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1. 发明授权

US5380805A Polyimides, process for the preparation thereof and polyimide resin compositions 失效
标题翻译：聚酰亚胺，其制备方法和聚酰亚胺树脂组合物
公开(公告)号：US5380805A
公开(公告)日：1995-01-10
申请号：US143105
申请日：1993-10-29
申请人： Shoji Tamai , Masahiro Ohta , Saburo Kawashima , Katsuaki Iiyama , Hideaki Oikawa , Akihiro Yamaguchi , Kouji Ohkoshi , Masao Yoshikawa
发明人： Shoji Tamai , Masahiro Ohta , Saburo Kawashima , Katsuaki Iiyama , Hideaki Oikawa , Akihiro Yamaguchi , Kouji Ohkoshi , Masao Yoshikawa
IPC分类号： C08G73/10 , C08L79/08
CPC分类号： C08G73/1042 , C08G73/105 , C08G73/1071 , C08L79/08
摘要： In one aspect, the present invention relates to polyimides having excellent thermal resistance and process for preparing the same comprising carrying out condensation of 4,4'-bis(3-aminophenoxy)biphenyl with pyromellitic dianhydride in the presence of a different diamine compound and optionally with a different tetracarboxylic acid dianhydride.In a second aspect, the present invention relates to a heat resistant resin composition consisting essentially of an aromatic polyetherimide and a defined polyimide.In a third aspect, the present invention relates to a polyimide resin composition comprised on a defined polyimide and a separate high-temperature engineering polymer.In a fourth aspect, the present invention relates to a resin composition comprised of a defined polyimide and an aromatic polyamideimide.
摘要翻译：一方面，本发明涉及具有优异耐热性的聚酰亚胺及其制备方法，包括在不同的二胺化合物和任选地存在下进行4,4'-双（3-氨基苯氧基）联苯与均苯四酸二酐的缩合与不同的四羧酸二酐。在第二方面，本发明涉及一种主要由芳族聚醚酰亚胺和所定义的聚酰亚胺组成的耐热树脂组合物。在第三方面，本发明涉及包含在限定的聚酰亚胺和单独的高温工程聚合物上的聚酰亚胺树脂组合物。在第四方面，本发明涉及由限定的聚酰亚胺和芳族聚酰胺酰亚胺组成的树脂组合物。

2. 发明授权

US5278276A Polyimide and high-temperature adhesive of polyimide 失效
标题翻译：聚酰亚胺和聚酰亚胺的高温粘合剂
公开(公告)号：US5278276A
公开(公告)日：1994-01-11
申请号：US9091
申请日：1993-01-26
申请人： Masahiro Ohta , Saburo Kawashima , Yoshiho Sonobe , Shoji Tamai , Hideaki Oikawa , Kouji Ohkoshi , Akihiro Yamaguchi
发明人： Masahiro Ohta , Saburo Kawashima , Yoshiho Sonobe , Shoji Tamai , Hideaki Oikawa , Kouji Ohkoshi , Akihiro Yamaguchi
IPC分类号： C08G73/10 , C09J179/08
CPC分类号： C08G73/105 , C08G73/1064 , C08G73/1071 , C09J179/08
摘要： Polyimide having repeating units of the following formula (I) and its polyamic acid precursor having repeating units of the following formula (II) are disclosed; ##STR1## (where Y is a radical selected from the group consisting of a bond, divalent hydrocarbon having 1 to 10 carbons, hexafluorinated isopropylidene, carbonyl, thio, sulfinyl, sulfonyl and oxide, and R is a tetra-valent radical selected from the group consisting of aliphatic radical having 2 and more carbons, cyclo-aliphatic radical, monoaromatic radical, condensed polyaromatic radical, and non-condensed polyaromatic radical wherein aromatic radicals are mutually connected with a bond or a crosslinking function).Typical examples of polyimide and polyamic acid include where Y is thio radical and R is ##STR2## Y is a bond and R is III or IV, and Y is isopropylidene radical and R is IV.The polymers can be prepared from corresponding diamine and tetracarboxylic acid dianhydride.Polyimide or polyamic acid of this invention is excellent for high-temperature adhesive.
摘要翻译：公开了具有下式（I）的重复单元的聚酰亚胺及其具有下式（II）的重复单元的聚酰胺酸前体; （*化学结构*）（I）（*化学结构*）（II）（其中Y是选自由键，碳数1〜10的二价烃，六氟化异亚丙基，羰基，硫代，亚磺酰基，磺酰基和氧化物，R是选自具有2个或更多个碳的脂族基团，环脂族基团，单芳族基团，缩合多芳族基团和非稠合多芳族基团中的四价基团，其中芳族基团相互连接具有键或交联功能）。聚酰亚胺和聚酰胺酸的典型实例包括其中Y为硫基，R为（*化学结构*）（III）（*化学结构*）（IV）Y为键，R为III或IV，Y为异丙叉基而R是IV。聚合物可以由相应的二胺和四羧酸二酐制备。本发明的聚酰亚胺或聚酰胺酸对于高温粘合剂是优异的。

3. 发明授权

US5087689A Polyimide and high-temperature adhesive of polyimide based on meta-phenoxy diamines 失效
标题翻译：基于金属氧化物的聚酰亚胺和高温胶粘剂
公开(公告)号：US5087689A
公开(公告)日：1992-02-11
申请号：US611471
申请日：1990-11-09
申请人： Masahiro Ohta , Saburo Kawashima , Yoshiho Sonobe , Shoji Tamai , Hideaki Oikawa , Kouji Ohkoshi , Akihiro Yamaguchi
发明人： Masahiro Ohta , Saburo Kawashima , Yoshiho Sonobe , Shoji Tamai , Hideaki Oikawa , Kouji Ohkoshi , Akihiro Yamaguchi
IPC分类号： C08G73/10 , C09J179/08
CPC分类号： C08G73/1039 , C08G73/105 , C08G73/1064 , C08G73/1071 , C09J179/08
摘要： Polyimide having repeating units of the following formula (I) and its polyamic acid precursor having repeating units of the following formula (II) are disclosed; ##STR1## (where Y is a radical selected from the group consisting of a bond, divalent hydrocarbon having 1 to 10 carbons, hexafluorinated isopropylidene, carbonyl, thio, sulfinyl, sulfonyl and oxide, and R is a tetra-valent radical selected from the group consisting of aliphatic radical having 2 and more carbons, cyclo-aliphatic radical, monoaromatic radical, condensed polyaromatic radical, and noncondensed polyaromatic radical wherein aromatic radicals are mutually connected with a bond or a crosslinking function).Typical examples of polyimide and polyamic acid include where Y is thio radical and R is ##STR2## Y is a bond and R is III or IV, and Y is isopropylidene radical and R is IV.The polymers can be prepared from corresponding diamine and tetracarboxylic acid dianhydride.Polyimide or polyamic acid of this invention is excellent for high-temperature adhesive.

4. 发明授权

US5205894A Polyimide and high-temperature adhesive of polyimide 失效
标题翻译：聚酰亚胺和高温胶粘剂
公开(公告)号：US5205894A
公开(公告)日：1993-04-27
申请号：US724548
申请日：1991-06-17
申请人： Masahiro Ohta , Saburo Kawashima , Yoshiho Sonobe , Shoji Tamai , Hideaki Oikawa , Kouji Ohkoshi , Akihiro Yamaguchi
发明人： Masahiro Ohta , Saburo Kawashima , Yoshiho Sonobe , Shoji Tamai , Hideaki Oikawa , Kouji Ohkoshi , Akihiro Yamaguchi
IPC分类号： C08G73/10 , C09J179/08
CPC分类号： C08G73/1039 , C08G73/105 , C08G73/1064 , C08G73/1071 , C09J179/08
摘要： Polyimide having repeating units of the following formula (I) and its polyamic acid precursor having repeating units of the following formula (II) are disclosed; ##STR1## (where Y is a radical selected from the group consisting of a bond, divalent hydrocarbon having 1 to 10 carbons, hexafluorinated isopropylidene, carbonyl, thio, sulfinyl, sulfonyl and oxide, and R is a tetra-valent radical selected from the group consisting of aliphatic radical having 2 and more carbons, cyclo-aliphatic radical, monoaromatic radical, condensed polyaromatic radical, and non-condensed polyaromatic radical wherein aromatic radicals are mutually connected with a bond or a crosslinking function).Typical examples of polyimide and polyamic acid include where Y is thio radical and R is ##STR2## Y is a bond and R is III or IV, and Y is isopropylidene radical and R is IV.The polymers can be prepared from corresponding diamine and tetracarboxylic acid dianhydride.Polyimide or polyamic acid of this invention is excellent for high-temperature adhesive.

5. 发明授权

US4847349A Polyimide and high-temperature adhesive of polyimide from meta substituted phenoxy diamines 失效
标题翻译：聚酰亚胺和来自间位取代的苯氧基二胺的聚酰亚胺的高温粘合剂
公开(公告)号：US4847349A
公开(公告)日：1989-07-11
申请号：US44028
申请日：1987-06-03
申请人： Masahiro Ohta , Saburo Kawashima , Yoshiho Sonobe , Shoji Tamai , Hideaki Oikawa , Kouji Ohkoshi , Akihiro Yamaguchi
发明人： Masahiro Ohta , Saburo Kawashima , Yoshiho Sonobe , Shoji Tamai , Hideaki Oikawa , Kouji Ohkoshi , Akihiro Yamaguchi
IPC分类号： C08G73/10 , C09J179/08
CPC分类号： C08G73/1039 , C08G73/105 , C08G73/1064 , C08G73/1071 , C09J179/08
摘要： Polyimide having repeating units of the following formula (I) and its polyamic acid precursor having repeating units of the following formula (II) are disclosed; ##STR1## (where Y is a radial selected from the group consisting of a bond, divalent hydrocarbon having 1 to 10 carbons, hexafluorinated isopropylidene, carbonyl, thio, sulfinyl, sulfonyl and oxide, and R is a tetra-valent radical selected from the group consisting of aliphatic radical having 2 and more carbons, cyclo-aliphatic radical, monoaromatic radical, condensed polyaromatic radical, and noncondensed polyaromatic radical wherein aromatic radicals ae mutually connected with a bond or a crosslinking function).Typical examples of polyimide and polyamic acid include where Y is thio radical and R is ##STR2## Y is a bond and R is III or IV, andy is isopropylidene radical and R is IV.The polymers can be prepared from corresponding diamine and tetracarboxylic acid dianhydride.Polyimide or polyamic acid of this invention is excellent for high-temperature adhesive.
摘要翻译： PCT No.PCT / JP86 / 00335 Sec。 371日期：1987年6月3日 102（e）1987年6月3日PCT PCT日期1986年6月30日PCT公布。出版物WO87 / 01378 公开了具有下式（I）的重复单元的聚酰亚胺及其具有下式（II）的重复单元的聚酰胺酸前体。（Ⅰ）（Ⅱ）（其中Y是选自由键，碳原子数为1〜10的二价烃，六氟化异亚丙基，羰基，硫基，亚磺酰基，磺酰基和氧化物组成的组的径向，R为是选自具有2个或更多个碳的脂族基团，环脂族基团，单芳族基团，缩合多芳族基团和非缩合多芳族基团的四价基团，其中芳族基团与键或交联官能团相互连接）。聚酰亚胺和聚酰胺酸的典型实例包括其中Y为硫基，R为Y，R为III或IV，且为异丙叉基，R为IV。聚合物可以由相应的二胺和四羧酸二酐制备。本发明的聚酰亚胺或聚酰胺酸对于高温粘合剂是优异的。

6. 发明授权

US4795798A High-temperature adhesive polyimide from 2,2-bis[4-(3-amino phenoxy)phenyl]1,1,1,3,3,3-hexafluoro propane 失效
标题翻译： 2,2-双[4-（3-氨基苯氧基）苯基] 1,1,1,3,3,3-六氟丙烷的高温粘合聚酰亚胺
公开(公告)号：US4795798A
公开(公告)日：1989-01-03
申请号：US18496
申请日：1987-02-25
申请人： Shoji Tamai , Saburo Kawashima , Masahiro Ohta , Hideaki Oikawa , Kouji Ohkoshi , Akihiro Yamaguchi
发明人： Shoji Tamai , Saburo Kawashima , Masahiro Ohta , Hideaki Oikawa , Kouji Ohkoshi , Akihiro Yamaguchi
IPC分类号： C08G73/10
CPC分类号： C08G73/105
摘要： This invention discloses high-temperature adhesives having a good light-transmittance and excellent high-temperature flowability which comprises polyimide having recurring units represented by the following formula (I) ##STR1## (where R is a tetra-valent radical selected from the group consisting of aliphatic radical having not less than two carbons, cyclo-aliphatic radical, monoaromatic radical, condensed polyaromatic radical, and non condensed polyaromatic radical wherein aromatic radicals are mutually connected with a bond or a crosslinking function).The polyimide is obtained by preparing polyamic acid through the reaction of 2,2-bis[4-(3-aminophenoxy)phenyl]-1,1,1,3,3,3,-hexafluoropropane as a diamine component with tetracarboxylic dianhydride such as pyromellitic dianhydride, 3,3',4,4'- biphenyltetracarboxylic dianhydride, bis(3,4-dicarboxyphenyl) ether dianhydride and 3,3'4,4'-benzophenonetetracarboxylic dianhydride, and further conducting the ring-closing reaction of resultant polyamic acid by dehydration.
摘要翻译：本发明公开了具有良好的透光率和优异的高温流动性的高温粘合剂，其包含具有由下式（I）表示的重复单元的聚酰亚胺（I）（其中R是选自由具有不少于2个碳的脂族基团，环脂族基团，单芳族基团，缩合多芳族基团和非缩合多芳族基团组成的组，其中芳族基团与键或交联官能团相互连接）。聚酰亚胺通过以二胺组分2,2-二[4-（3-氨基苯氧基）苯基] -1,1,1,3,3,3 - 六氟丙烷与四羧酸二酐的反应制备聚酰胺酸得到，作为均苯四酸二酐，3,3'，4,4'-联苯四羧酸二酐，双（3,4-二羧基苯基）醚二酐和3,3'4,4'-二苯甲酮四羧酸二酐，进一步进行所得物的闭环反应聚酰胺酸脱水。

7. 发明授权

US5288843A Polyimides, process for the preparation thereof and polyimide resin compositions 失效
标题翻译：聚酰亚胺，其制备方法和聚酰亚胺树脂组合物
公开(公告)号：US5288843A
公开(公告)日：1994-02-22
申请号：US608727
申请日：1990-11-05
申请人： Shoji Tamai , Masahiro Ohta , Saburo Kawashima , Katsuaki Iiyama , Hideaki Oikawa , Akihiro Yamaguchi , Kouji Ohkoshi , Masao Yoshikawa
发明人： Shoji Tamai , Masahiro Ohta , Saburo Kawashima , Katsuaki Iiyama , Hideaki Oikawa , Akihiro Yamaguchi , Kouji Ohkoshi , Masao Yoshikawa
IPC分类号： C08G73/10 , C08L79/08 , C08G69/26 , C08G8/02
CPC分类号： C08G73/1042 , C08G73/105 , C08G73/1071 , C08L79/08
摘要： In one aspect, the present invention relates to polyimides having excellent thermal resistance and process for preparing the same comprising carrying out condensation of 4,4'-bis(3-aminophenoxy)biphenyl with pyromellitic dianhydride in the presence of a different diamine compound and optionally with a different tetracarboxylic acid dianhydride.In a second aspect, the present invention relates to a heat resistant resin composition consisting essentially of an aromatic polyetherimide and a defined polyimide.In a third aspect, the present invention relates to a polyimide resin composition comprised on a defined polyimide and a separate high-temperature engineering polymer.In a fourth aspect, the present invention relates to a resin composition comprised of a defined polyimide and an aromatic polyamideimide.
摘要翻译：一方面，本发明涉及具有优异耐热性的聚酰亚胺及其制备方法，包括在不同的二胺化合物和任选地存在下进行4,4'-双（3-氨基苯氧基）联苯与均苯四酸二酐的缩合与不同的四羧酸二酐。在第二方面，本发明涉及一种主要由芳族聚醚酰亚胺和所定义的聚酰亚胺组成的耐热树脂组合物。在第三方面，本发明涉及包含在限定的聚酰亚胺和单独的高温工程聚合物上的聚酰亚胺树脂组合物。在第四方面，本发明涉及由限定的聚酰亚胺和芳族聚酰胺酰亚胺组成的树脂组合物。

8. 发明授权

US5043419A Process for preparing a polyimide and a composite material containing the same 失效
公开(公告)号：US5043419A
公开(公告)日：1991-08-27
申请号：US261520
申请日：1988-10-24
申请人： Masahiro Ohta , Saburo Kawashima , Shoji Tamai , Hideaki Oikawa , Akihiro Yamaguchi , Tomohito Koba , Toshiyuki Nakakura , Hideo Sakai , Misao Masuda , Satoru Kishi , Chiaki Maruko
发明人： Masahiro Ohta , Saburo Kawashima , Shoji Tamai , Hideaki Oikawa , Akihiro Yamaguchi , Tomohito Koba , Toshiyuki Nakakura , Hideo Sakai , Misao Masuda , Satoru Kishi , Chiaki Maruko
IPC分类号： C08G73/10 , C08K7/04 , C08L79/08
CPC分类号： C08K7/04 , C08G73/1014 , C08G73/105 , C08G73/1064 , C08L79/08
摘要： This invention relates to a method for preparing a polyimide having good heat-stability and excellent flowability in a molten state.The polymide is prepared by reacting aromatic diamines such as 4,4'-bis(3-aminophenoxy)biphenyl, bis[4-(3-aminophenoxy)phenyl] ketone and bis [4-(3-aminophenoxy)phenyl] sulfone; tetracarboxylic dianhydrides such as pyromellitic dianhydride, 3,3', 4,4'-benzophenonetetracarboxylic dianhydride and bis(3,4-dicarboxyphenyl) ether dianhydride; and dicarboxylic anhydrides such as glutaric anhydride, 1,2-hexanedicarboxylic anhydride, phthalic anhydride and 3,4-benzophenonedicarboxylic anhydride. The molar ratio of aromatic diamine: tetracarboxylic dianhydride: dicarboxylic anhydride is 1:(0.9 to 1.0):(0.001 to 1.0).The invention also relates to polyimide composite materials which are excellent in mechanical strengths and processability. The materials contain the polyimide and fibrous reinforcing materials such as yarn, roving, tow, fabrics, mats and felts of glass fiber, carbon fibers or aromatic polyamide fibers.

9. 发明授权

US5459233A Polyimides, process for the preparation thereof and polyimide resin compositions 失效
公开(公告)号：US5459233A
公开(公告)日：1995-10-17
申请号：US143148
申请日：1993-12-07
申请人： Shoji Tamai , Masahiro Ohta , Saburo Kawashima , Katsuaki Iiyama , Hideaki Oikawa , Akihiro Yamaguchi
发明人： Shoji Tamai , Masahiro Ohta , Saburo Kawashima , Katsuaki Iiyama , Hideaki Oikawa , Akihiro Yamaguchi
IPC分类号： C08G73/10 , C08L79/08 , C08G69/26
CPC分类号： C08G73/1042 , C08G73/105 , C08G73/1071 , C08L79/08
摘要： In one aspect, the present invention relates to polyimides having excellent thermal resistance and process for preparing the same comprising carrying out condensation of 4,4'-bis(3-aminophenoxy)biphenyl with pyromellitic dianhydride in the presence of a different diamine compound and optionally with a different tetracarboxylic acid dianhydride.In a second aspect, the present invention relates to a heat resistant resin composition consisting essentially of an aromatic polyetherimide and a defined polyimide.In a third aspect, the present invention relates to a polyimide resin composition comprised on a defined polyimide and a separate high-temperature engineering polymer.In a fourth aspect, the present invention relates to a resin composition comprised of a defined polyimide and an aromatic polyamideimide.

10. 发明授权

US5013817A Process for preparing a polyimide and a composite material containing the same 失效
标题翻译：制备聚酰亚胺和含有它的复合材料的方法
公开(公告)号：US5013817A
公开(公告)日：1991-05-07
申请号：US266678
申请日：1988-11-03
申请人： Masahiro Ohta , Saburo Kawashima , Shoji Tamai , Hideaki Oikawa , Akihiro Yamaguchi , Tomohito Koba , Toshiyuki Nakakura , Hideo Sakai , Misao Masuda , Satoru Kishi , Chiaki Maruko
发明人： Masahiro Ohta , Saburo Kawashima , Shoji Tamai , Hideaki Oikawa , Akihiro Yamaguchi , Tomohito Koba , Toshiyuki Nakakura , Hideo Sakai , Misao Masuda , Satoru Kishi , Chiaki Maruko
IPC分类号： C08G73/10
CPC分类号： C08G73/105 , C08G73/1017
摘要： The invention relates to processes for preparing a polyimide, a polyimide composition prepared by the processes and polyimide composite materials containing the same.

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