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    • 2. 发明授权
    • Sealed
    • 密封镍/金属氢化物电池和储氢合金电极用于其中
    • US5948563A
    • 1999-09-07
    • US696494
    • 1996-08-14
    • Hiroshi KawaseShinya MorishitaShinichi TowataKenichi SuzukiKatsushi Abe
    • Hiroshi KawaseShinya MorishitaShinichi TowataKenichi SuzukiKatsushi Abe
    • H01M4/24H01M4/26H01M4/38H01M4/62H01M4/80H01M10/34H01M4/52
    • H01M4/622H01M4/242H01M4/621H01M10/345H01M4/383H01M4/808Y02P70/54
    • An electrode for a sealed nickel/metal hydride battery and a method of manufacturing the same, which is capable of suppressing a decrease in the charging reserve of a hydrogen-storage alloy electrode (negative electrode) and an increase in the internal pressure of the battery, is provided. The hydrogen-storage alloy electrode is formed using a tackifier or a binder which is prepared from an organic polymer material containing the ether linkage (--O--), for example, polyethylene oxide, polypropylene oxide , or polybutylene oxide. The specified material is suitably hydrophilic, and it exhibits an oxidation resistance which is much higher than that of a conventional material containing the hydroxyl group (--OH). Therefore, the specified material is especially resistant to oxidation and decomposition at the positive electrode of the battery and can significantly reduce the production of hydrogen attributed to the oxidation and decomposition.
    • 一种用于密封镍/金属氢化物电池的电极及其制造方法,其能够抑制储氢合金电极(负极)的充电储备的减少和电池内部压力的增加 ,被提供。 使用由含有醚键(-O-)的有机聚合物材料,例如聚环氧乙烷,聚环氧丙烷或聚环氧丁烷制备的增粘剂或粘合剂形成储氢合金电极。 指定的材料是适当的亲水性的,并且其表现出比含有羟基(-OH)的常规材料的抗氧化性更高的抗氧化性。 因此,特定的材料特别耐电池正极的氧化和分解,并且可以显着地减少归因于氧化和分解的氢的产生。
    • 3. 发明授权
    • Photo-plating process
    • 光电镀工艺
    • US5314725A
    • 1994-05-24
    • US18560
    • 1993-02-17
    • Shinya Morishita
    • Shinya Morishita
    • C23C18/18C23C18/31G03C5/58H05K3/18B05D3/02
    • C23C18/31C23C18/1865C23C18/1868C23C18/1889C23C18/1893G03C5/58H05K3/185
    • A process for photo-plating only a light-irradiated portion of a dye layer formed on a substrate comprises: forming a dye layer on the surface of a substrate; immersing the substrate with the dye layer into an electroless plating solution comprising a sacrificial reagent for supplying electrons by irreversible oxidative decomposition, and at least one of copper ions, nickel ions, cobalt ions, and tin ions; and irradiating the surface of the dye layer with light having an energy higher than the excitation energy of the dye in the dye layer. A thick coating containing at least one of copper, nickel, cobalt, and tin can be formed with excellent adhesion strength only on the light-irradiated portion of the dye layer formed on the substrate.
    • 仅对形成在基板上的染料层的光照射部分进行光电镀的工艺包括:在基板的表面上形成染料层; 将具有染料层的基板浸入包含用于通过不可逆氧化分解提供电子的牺牲试剂和铜离子,镍离子,钴离子和锡离子中的至少一种的化学镀溶液; 并且用染料层中具有比染料的激发能量高的能量的光照射染料层的表面。 只有在形成在基板上的染料层的光照射部分上,才能形成含有铜,镍,钴和锡中的至少一种的厚涂层。