专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

1. 发明申请

US20120133042A1 MOUNTING STRUCTURE OF CHIP AND MODULE USING THE SAME 审中-公开
标题翻译：使用它的芯片和模块的安装结构
公开(公告)号：US20120133042A1
公开(公告)日：2012-05-31
申请号：US13320998
申请日：2009-05-21
申请人： Shintarou Hayashi , Mitsuhiko Ueda , Yoshiharu Sanagawa , Takamasa Sakai
发明人： Shintarou Hayashi , Mitsuhiko Ueda , Yoshiharu Sanagawa , Takamasa Sakai
IPC分类号： H01L23/488 , H01L23/48 , H01L23/495
CPC分类号： G01P15/123 , B81B7/0048 , G01P1/023 , G01P15/0802 , G01P15/18 , G01P2015/0842 , H01L23/50 , H01L24/05 , H01L24/06 , H01L24/13 , H01L24/14 , H01L24/16 , H01L24/17 , H01L24/29 , H01L24/32 , H01L24/45 , H01L24/48 , H01L24/49 , H01L24/73 , H01L24/83 , H01L25/0657 , H01L2224/0401 , H01L2224/04042 , H01L2224/05554 , H01L2224/06155 , H01L2224/131 , H01L2224/13144 , H01L2224/13191 , H01L2224/1329 , H01L2224/133 , H01L2224/13561 , H01L2224/1357 , H01L2224/13691 , H01L2224/14155 , H01L2224/14165 , H01L2224/14179 , H01L2224/16145 , H01L2224/1703 , H01L2224/29191 , H01L2224/321 , H01L2224/45139 , H01L2224/48091 , H01L2224/48145 , H01L2224/48227 , H01L2224/49171 , H01L2224/49175 , H01L2224/73203 , H01L2224/73265 , H01L2224/81191 , H01L2224/81192 , H01L2224/81862 , H01L2224/83 , H01L2225/0651 , H01L2225/06562 , H01L2225/06575 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01033 , H01L2924/01047 , H01L2924/01057 , H01L2924/01079 , H01L2924/014 , H01L2924/09701 , H01L2924/1461 , H01L2924/15153 , H01L2924/15156 , H01L2924/15165 , H01L2924/181 , H01L2924/0715 , H01L2924/01014 , H01L2924/00 , H01L2224/45099 , H01L2224/05599 , H01L2924/00012
摘要： A mounting structure of chip comprises a substrate having a base, a chip on the upper surface of the base, and adhesive agents which bonds the base and the first chip. The adhesive agent is applied to the upper surface of the base. The chip has a rectangular shape to have a width and a length, and is bonded at its lower surface to the base. The adhesive agents comprises the first adhesive agent, the second adhesive agent, and the third adhesive agent which are disposed on the three spots of the upper surface of the base, respectively. The three spots on the base are located on vertexes of a triangle. The first chip is bonded to the base by only the first adhesive agent, the second adhesive agent, and the third adhesive agent.
摘要翻译：芯片的安装结构包括具有底座，底座上表面上的芯片以及粘接基座和第一芯片的粘接剂的基片。粘合剂施加到基底的上表面。芯片具有宽度和长度的矩形形状，并且在其下表面与基底结合。粘合剂包括分别设置在基底的上表面的三个点上的第一粘合剂，第二粘合剂和第三粘合剂。基座上的三个点位于三角形的顶点。第一芯片仅通过第一粘合剂，第二粘合剂和第三粘合剂结合到基底上。

2. 发明申请

US20120235044A1 INFRARED SENSOR MODULE 有权
标题翻译：红外传感器模块
公开(公告)号：US20120235044A1
公开(公告)日：2012-09-20
申请号：US13513426
申请日：2010-12-17
申请人： Mitsuhiko Ueda , Takami Okubayashi , Takanori Sugiyama , Yoshiharu Sanagawa , Takanori Aketa , Yushi Nakamura , Masao Kirihara
发明人： Mitsuhiko Ueda , Takami Okubayashi , Takanori Sugiyama , Yoshiharu Sanagawa , Takanori Aketa , Yushi Nakamura , Masao Kirihara
IPC分类号： G01J5/04 , G01J5/02
CPC分类号： G01J5/16 , G01J5/02 , G01J5/0205 , G01J5/0215 , G01J5/04 , G01J5/046 , G01J5/08 , G01J5/0806 , G01J5/0875 , H01L2224/48137 , H01L2924/3025 , H01L2924/00
摘要： An infrared sensor module includes: an infrared sensor device disposed on a substrate and configured to receive infrared signals; a signal processing circuit device configured to process an output from the infrared sensor device; a metal case which is provided at a predetermined distance from the infrared sensor device, which includes a light incident window provided with an optical system for coupling an image on the infrared sensor device from external infrared signals, and which accommodates the infrared sensor device and the signal processing circuit device; and a sensor cover which is disposed between the infrared sensor device and the case and the signal processing circuit device, and which includes a light-transmitting portion configured to guide the infrared signals entering via the optical system to the infrared sensor device.
摘要翻译：红外线传感器模块包括：红外线传感器装置，设置在基板上并被配置为接收红外信号; 信号处理电路装置，被配置为处理来自所述红外线传感器装置的输出; 设置在距红外线传感器装置预定距离处的金属壳体，该金属壳体包括设置有用于将红外线传感器装置上的图像与外部红外信号耦合的光学系统的光入射窗，并且容纳红外线传感器装置和信号处理电路装置; 以及设置在所述红外线传感器装置和所述壳体之间的传感器盖和所述信号处理电路装置，所述传感器盖包括被配置为将经由所述光学系统进入的所述红外线信号引导到所述红外线传感器装置的透光部。

3. 发明授权

US09478682B2 IR sensor package including a cover member and a sensor chip recessed into the package body 有权
标题翻译：红外传感器封装包括一个盖构件和一个嵌入封装体内的传感器芯片
公开(公告)号：US09478682B2
公开(公告)日：2016-10-25
申请号：US13806111
申请日：2011-06-23
申请人： Masao Kirihara , Hiroshi Yamanaka , Yoshiharu Sanagawa , Takanori Aketa , Yushi Nakamura , Mitsuhiko Ueda
发明人： Masao Kirihara , Hiroshi Yamanaka , Yoshiharu Sanagawa , Takanori Aketa , Yushi Nakamura , Mitsuhiko Ueda
IPC分类号： H01L31/0232 , H01L31/024 , G01J5/04 , G01J5/06 , G01J5/08 , G01J5/12
CPC分类号： H01L31/024 , G01J5/04 , G01J5/045 , G01J5/06 , G01J5/08 , G01J5/0806 , G01J5/0831 , G01J5/12 , H01L2924/0002 , H01L2924/00
摘要： The infrared sensor includes: an infrared sensor chip in which a plurality of pixel portions each including a temperature-sensitive portion formed of a thermopile is disposed in an array on one surface side of a semiconductor substrate; and an IC chip that processes an output signal of the infrared sensor chip. A package includes a package main body on which the infrared sensor chip and the IC chip are mounted to be arranged side-by-side, and a package cover that has a lens transmitting infrared rays and is hermetically bonded to the package main body. The package is provided therein with a cover member that includes a window hole through which infrared rays pass into the infrared sensor chip and equalizes amounts of temperature change of hot junctions and cold junctions among the pixel portions, the temperature change resulting from heating of the IC chip.
摘要翻译：红外线传感器包括：红外线传感器芯片，其中在半导体衬底的一个表面侧上排列有包括由热电堆形成的温度敏感部分的多个像素部分; 以及处理红外线传感器芯片的输出信号的IC芯片。一种包装体，包括并排设置红外线传感器芯片和IC芯片的封装主体，以及具有透射红外线的透镜并与封装主体气密结合的封装盖。该封装件设置有盖构件，该盖构件包括窗孔，红外线通过该孔穿过红外线传感器芯片，并使像素部之间的热接点和冷接点的温度变化量相等，由IC加热引起的温度变化芯片。

4. 发明授权

US08952331B2 Infrared sensor module 有权
标题翻译：红外传感器模块
公开(公告)号：US08952331B2
公开(公告)日：2015-02-10
申请号：US13513426
申请日：2010-12-17
申请人： Mitsuhiko Ueda , Takami Okubayashi , Takanori Sugiyama , Yoshiharu Sanagawa , Takanori Aketa , Yushi Nakamura , Masao Kirihara
发明人： Mitsuhiko Ueda , Takami Okubayashi , Takanori Sugiyama , Yoshiharu Sanagawa , Takanori Aketa , Yushi Nakamura , Masao Kirihara
IPC分类号： G01J5/20 , G01J5/16 , G01J5/02 , G01J5/04 , G01J5/08
CPC分类号： G01J5/16 , G01J5/02 , G01J5/0205 , G01J5/0215 , G01J5/04 , G01J5/046 , G01J5/08 , G01J5/0806 , G01J5/0875 , H01L2224/48137 , H01L2924/3025 , H01L2924/00
摘要： An infrared sensor module includes: an infrared sensor device disposed on a substrate and configured to receive infrared signals; a signal processing circuit device configured to process an output from the infrared sensor device; a metal case which is provided at a predetermined distance from the infrared sensor device, which includes a light incident window provided with an optical system for coupling an image on the infrared sensor device from external infrared signals, and which accommodates the infrared sensor device and the signal processing circuit device; and a sensor cover which is disposed between the infrared sensor device and the case and the signal processing circuit device, and which includes a light-transmitting portion configured to guide the infrared signals entering via the optical system to the infrared sensor device.
摘要翻译：红外线传感器模块包括：红外线传感器装置，设置在基板上并被配置为接收红外信号; 信号处理电路装置，被配置为处理来自所述红外线传感器装置的输出; 设置在距红外线传感器装置预定距离处的金属壳体，该金属壳体包括设置有用于将红外线传感器装置上的图像与外部红外信号耦合的光学系统的光入射窗，并且容纳红外线传感器装置和信号处理电路装置; 以及设置在所述红外线传感器装置和所述壳体之间的传感器盖和所述信号处理电路装置，所述传感器盖包括被配置为将经由所述光学系统进入的所述红外线信号引导到所述红外线传感器装置的透光部。

5. 发明申请

US20130093037A1 INFARED SENSOR 有权
标题翻译：感染传感器
公开(公告)号：US20130093037A1
公开(公告)日：2013-04-18
申请号：US13806111
申请日：2011-06-23
申请人： Masao Kirihara , Hiroshi Yamanaka , Yoshiharu Sanagawa , Takanori Aketa , Yushi Nakamura , Mitsuhiko Ueda
发明人： Masao Kirihara , Hiroshi Yamanaka , Yoshiharu Sanagawa , Takanori Aketa , Yushi Nakamura , Mitsuhiko Ueda
IPC分类号： H01L31/024
CPC分类号： H01L31/024 , G01J5/04 , G01J5/045 , G01J5/06 , G01J5/08 , G01J5/0806 , G01J5/0831 , G01J5/12 , H01L2924/0002 , H01L2924/00
摘要： The infrared sensor includes: an infrared sensor chip in which a plurality of pixel portions each including a temperature-sensitive portion formed of a thermopile is disposed in an array on one surface side of a semiconductor substrate; and an IC chip that processes an output signal of the infrared sensor chip. A package includes a package main body on which the infrared sensor chip and the IC chip are mounted to be arranged side-by-side, and a package cover that has a lens transmitting infrared rays and is hermetically bonded to the package main body. The package is provided therein with a cover member that includes a window hole through which infrared rays pass into the infrared sensor chip and equalizes amounts of temperature change of hot junctions and cold junctions among the pixel portions, the temperature change resulting from heating of the IC chip.
摘要翻译：红外线传感器包括：红外线传感器芯片，其中在半导体衬底的一个表面侧上排列有包括由热电堆形成的温度敏感部分的多个像素部分; 以及处理红外线传感器芯片的输出信号的IC芯片。一种包装体，包括并排设置红外线传感器芯片和IC芯片的封装主体，以及具有透射红外线的透镜并与封装主体气密结合的封装盖。该封装件设置有盖构件，该盖构件包括窗孔，红外线通过该孔穿过红外线传感器芯片，并使像素部之间的热接点和冷接点的温度变化量相等，由IC加热引起的温度变化芯片。

6. 发明授权

US08433246B2 Wireless communication system, wireless communication device, wireless communication method and program 有权
标题翻译：无线通信系统，无线通信设备，无线通信方式和程序
公开(公告)号：US08433246B2
公开(公告)日：2013-04-30
申请号：US13572244
申请日：2012-08-10
申请人： Takashi Matsuo , Mitsuhiko Ueda , Yosuke Tsuda
发明人： Takashi Matsuo , Mitsuhiko Ueda , Yosuke Tsuda
IPC分类号： H04B7/00
CPC分类号： H04B7/24 , H04W8/20 , H04W76/19 , H04W76/25 , H04W76/38 , H04W88/06
摘要： A communication device includes a communication unit that performs a wireless communication with an external device. The communication device also includes a control unit that establishes the wireless communication between the communication unit and the external device by using setting data received from the external device. Further, the communication device includes a data processing unit that stores the setting data in a storage unit before the wireless communication is released. The communication device additionally includes a power input unit, and a communication releasing unit that releases the wireless communication between the communication unit and the external device. The control unit uses the setting data stored in the storage unit at a time of re-performing a wireless communication between the communication unit and the external device. The communication releasing unit releases the wireless communication when power is not being supplied via the power input unit.
摘要翻译：通信设备包括执行与外部设备的无线通信的通信单元。通信设备还包括控制单元，其通过使用从外部设备接收的设置数据建立通信单元和外部设备之间的无线通信。此外，通信设备包括数据处理单元，其在无线通信被释放之前将设置数据存储在存储单元中。通信装置还包括电力输入单元和释放通信单元和外部设备之间的无线通信的通信释放单元。在重新执行通信单元和外部设备之间的无线通信时，控制单元使用存储在存储单元中的设置数据。当通过电力输入单元未提供电力时，通信释放单元释放无线通信。

7. 发明授权

US08064829B2 Wireless communication system, wireless communication device, program, and wireless communication method 有权
标题翻译：无线通信系统，无线通信设备，程序和无线通信方式
公开(公告)号：US08064829B2
公开(公告)日：2011-11-22
申请号：US12059439
申请日：2008-03-31
申请人： Takashi Matsuo , Mitsuhiko Ueda
发明人： Takashi Matsuo , Mitsuhiko Ueda
IPC分类号： H04B7/00
CPC分类号： H04W76/10 , H04W4/18 , H04W88/04 , H04W88/06
摘要： There is provided a wireless communication device that includes a first communication portion that performs non-contact communication with an other wireless communication device and receives unit specific data indicating the other wireless communication device's communication function; a second communication portion that can communicate wirelessly faster than the first communication portion; a determination portion that determines, based on the unit specific data, whether the other wireless communication device's communication function is compatible with the second communication portion; and a format conversion portion that converts a format of transmission data that is transmitted to the other wireless communication device to a format that reduces the volume of the transmission data. If the determination portion determines that the other wireless communication device's communication function is not compatible with the second communication portion, the first communication portion transmits the transmission data to the other wireless communication device in the converted data format.
摘要翻译：提供了一种无线通信装置，其包括：第一通信部，其与其他无线通信装置进行非接触通信，并接收表示其他无线通信装置的通信功能的单位特定数据; 可以比第一通信部分更快地进行无线通信的第二通信部分; 确定部分，其基于所述单位特定数据确定所述另一无线通信设备的通信功能是否与所述第二通信部分兼容; 以及格式转换部分，其将发送到另一无线通信装置的发送数据的格式转换为减小发送数据量的格式。如果确定部分确定另一无线通信设备的通信功能与第二通信部分不兼容，则第一通信部分以转换的数据格式将传输数据发送到另一无线通信设备。

8. 发明申请

US20130161244A1 Chromatography Device 审中-公开
标题翻译：色谱装置
公开(公告)号：US20130161244A1
公开(公告)日：2013-06-27
申请号：US13817658
申请日：2011-07-21
申请人： Kimihiko Ishii , Mitsuhiko Ueda , Shouji Tomida
发明人： Kimihiko Ishii , Mitsuhiko Ueda , Shouji Tomida
IPC分类号： B01D15/14
CPC分类号： E05B47/026 , B65D2221/00 , E05B63/0052 , E05B2063/0026 , G01N35/00 , G01N2030/8804 , G01N2035/00306
摘要： Provided is a highly safe chromatography device that does not sacrifice user-friendliness during the addition and replacement of a sample holding container. The chromatography device has doors 10, 11, a door locking mechanism 15, and a sensor 13 for detecting whether the doors 10, 11 are open or closed. The doors 10, 11 are opened and closed to place a sample holding container 6 and a sample rack 1 in the chromatography device. The door locking mechanism 15 is operated to lock the doors 10, 11 when the sensor 13 indicates that the doors 10, 11 are closed and the analysis of a sample in the sample holding container 6 starts, and is operated to unlock the doors 10, 11 when a return operation and a washing operation terminate after a needle 2, a syringe 9, and other mechanical parts operate. Consequently, the sample holding container can be safely added or replaced without having to perform, for instance, a procedure for executing a pause function.
摘要翻译：提供了一种高度安全的色谱装置，其在添加和更换样品保持容器期间不牺牲用户友好性。色谱装置具有门10,11，门锁定机构15和用于检测门10,11是否打开或关闭的传感器13。门10,11打开和关闭以将样品保持容器6和样品架1放置在色谱装置中。当传感器13指示门10,11关闭并且样品保持容器6中的样品的分析开始并且操作以解锁门10时，门锁定机构15被操作以锁定门10,11，如图11所示，当针2，注射器9和其他机械部件操作之后返回操作和洗涤操作终止。因此，可以安全地添加或更换样品保持容器，而不必执行例如执行暂停功能的步骤。

9. 发明申请

US20090253374A1 WIRELESS COMMUNICATION SYSTEM, WIRELESS COMMUNICATION DEVICE, WIRELESS COMMUNICATION METHOD AND PROGRAM 有权
标题翻译：无线通信系统，无线通信设备，无线通信方法和程序
公开(公告)号：US20090253374A1
公开(公告)日：2009-10-08
申请号：US12442530
申请日：2008-04-11
申请人： Takashi Matsuo , Mitsuhiko Ueda , Yosuke Tsuda
发明人： Takashi Matsuo , Mitsuhiko Ueda , Yosuke Tsuda
IPC分类号： H04B7/00
CPC分类号： H04B7/24 , H04W8/20 , H04W76/19 , H04W76/25 , H04W76/38 , H04W88/06
摘要： A wireless communication device is provided with a first communication section for performing non-contact communication with another wireless communication device and receiving predetermined setting data from the other wireless communication device, a second communication section capable of establishing a wireless connection with the other wireless communication device, a control section for establishing the wireless connection between the second communication section and the other wireless communication device by using the setting data, necessary for the wireless connection, received by the first communication section, and a data processing section for storing the setting data in a storage medium before the wireless connection is released. The control section uses the setting data stored in the storage medium at the time of establishing a wireless reconnection between the second communication section and the other wireless communication device.
摘要翻译：一种无线通信装置具有：第一通信部，其与另一无线通信装置进行非接触通信，从其他无线通信装置接收预定的设定数据;第二通信部，能够与其他无线通信装置建立无线连接用于通过使用由第一通信部分接收的无线连接所需的设置数据来建立第二通信部分和另一无线通信设备之间的无线连接的控制部分，以及用于将设置数据存储在其中的数据处理部分无线连接之前的存储介质被释放。控制部在建立第二通信部与其他无线通信装置之间的无线重连时，使用存储在存储媒体中的设定数据。

10. 发明授权

US08483615B2 Wireless communication system, wireless communication device, program, and wireless communication method 有权
标题翻译：无线通信系统，无线通信设备，程序和无线通信方式
公开(公告)号：US08483615B2
公开(公告)日：2013-07-09
申请号：US13274975
申请日：2011-10-17
申请人： Takashi Matsuo , Mitsuhiko Ueda
发明人： Takashi Matsuo , Mitsuhiko Ueda
IPC分类号： H04B7/00
CPC分类号： H04W76/10 , H04W4/18 , H04W88/04 , H04W88/06
摘要： A wireless communication method includes receiving from an other wireless communication device, by using a non-contact communication method, specification data that indicates a communication function of the other wireless communication device. The wireless communication method also includes converting, if the specification data does not correspond to a wireless communication whose communication speed is faster than a communication speed of the non-contact communication method, a data format of transmission data that is transmitted to the other wireless communication device to a data format that reduces a data volume of the transmission data. Additionally, the wireless communication method includes transmitting, by the non-contact communication method, to the other wireless communication device, the transmission data whose data format was converted to reduce the data volume of the transmission data.
摘要翻译：无线通信方法包括：通过使用非接触通信方法从其他无线通信设备接收指示其他无线通信设备的通信功能的指定数据。无线通信方法还包括如果指定数据不对应于通信速度比非接触通信方法的通信速度快的无线通信，则转换为发送到另一无线通信的传输数据的数据格式设备到减少传输数据的数据量的数据格式。另外，无线通信方法包括：通过非接触式通信方式向其他无线通信装置发送数据格式被转换以减少发送数据的数据量的发送数据。

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式