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1. 发明授权

US08716736B2 Surface light emitting device 有权
标题翻译：表面发光装置
公开(公告)号：US08716736B2
公开(公告)日：2014-05-06
申请号：US13522445
申请日：2011-01-19
申请人： Kazuyuki Yamae , Hitoshi Kimura , Nobuhiro Ide , Hiroya Tsuji , Shintarou Hayashi
发明人： Kazuyuki Yamae , Hitoshi Kimura , Nobuhiro Ide , Hiroya Tsuji , Shintarou Hayashi
IPC分类号： H01L51/50
CPC分类号： H01L51/524 , H01L51/5271 , H01L51/5275 , H05B33/04
摘要： The surface light emitting device includes an organic EL element, a protection substrate, a protection part, and a light extraction structure part. The element has a first face and a second face opposite to the first face, and emits light from the first face. The substrate has transparency for light emitted from the element, and is placed facing the first face, and has a primary surface facing the first face of the element. The protection part is placed facing the second face of the element, and constitutes a housing in combination with the substrate and accommodates the element so as to protect the element from water. The structure part is interposed between the first face of the element and the substrate, and suppresses reflection of light emitted from the element on at least one of the first face of the element and the primary surface of the substrate.
摘要翻译：表面发光器件包括有机EL元件，保护基板，保护部件和光提取结构部件。元件具有与第一面相对的第一面和第二面，并且从第一面发射光。衬底对于从元件发射的光具有透明度，并且被放置成面对第一面，并且具有面向元件的第一面的主表面。保护部件被放置成面向元件的第二面，并且与基板组合构成壳体并容纳该元件，以保护元件免受水分影响。结构部分插入在元件的第一面和基板之间，并且抑制从元件发射的光在元件的第一面和基板的主表面中的至少一个上的反射。

2. 发明申请

US20120133042A1 MOUNTING STRUCTURE OF CHIP AND MODULE USING THE SAME 审中-公开
标题翻译：使用它的芯片和模块的安装结构
公开(公告)号：US20120133042A1
公开(公告)日：2012-05-31
申请号：US13320998
申请日：2009-05-21
申请人： Shintarou Hayashi , Mitsuhiko Ueda , Yoshiharu Sanagawa , Takamasa Sakai
发明人： Shintarou Hayashi , Mitsuhiko Ueda , Yoshiharu Sanagawa , Takamasa Sakai
IPC分类号： H01L23/488 , H01L23/48 , H01L23/495
CPC分类号： G01P15/123 , B81B7/0048 , G01P1/023 , G01P15/0802 , G01P15/18 , G01P2015/0842 , H01L23/50 , H01L24/05 , H01L24/06 , H01L24/13 , H01L24/14 , H01L24/16 , H01L24/17 , H01L24/29 , H01L24/32 , H01L24/45 , H01L24/48 , H01L24/49 , H01L24/73 , H01L24/83 , H01L25/0657 , H01L2224/0401 , H01L2224/04042 , H01L2224/05554 , H01L2224/06155 , H01L2224/131 , H01L2224/13144 , H01L2224/13191 , H01L2224/1329 , H01L2224/133 , H01L2224/13561 , H01L2224/1357 , H01L2224/13691 , H01L2224/14155 , H01L2224/14165 , H01L2224/14179 , H01L2224/16145 , H01L2224/1703 , H01L2224/29191 , H01L2224/321 , H01L2224/45139 , H01L2224/48091 , H01L2224/48145 , H01L2224/48227 , H01L2224/49171 , H01L2224/49175 , H01L2224/73203 , H01L2224/73265 , H01L2224/81191 , H01L2224/81192 , H01L2224/81862 , H01L2224/83 , H01L2225/0651 , H01L2225/06562 , H01L2225/06575 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01033 , H01L2924/01047 , H01L2924/01057 , H01L2924/01079 , H01L2924/014 , H01L2924/09701 , H01L2924/1461 , H01L2924/15153 , H01L2924/15156 , H01L2924/15165 , H01L2924/181 , H01L2924/0715 , H01L2924/01014 , H01L2924/00 , H01L2224/45099 , H01L2224/05599 , H01L2924/00012
摘要： A mounting structure of chip comprises a substrate having a base, a chip on the upper surface of the base, and adhesive agents which bonds the base and the first chip. The adhesive agent is applied to the upper surface of the base. The chip has a rectangular shape to have a width and a length, and is bonded at its lower surface to the base. The adhesive agents comprises the first adhesive agent, the second adhesive agent, and the third adhesive agent which are disposed on the three spots of the upper surface of the base, respectively. The three spots on the base are located on vertexes of a triangle. The first chip is bonded to the base by only the first adhesive agent, the second adhesive agent, and the third adhesive agent.
摘要翻译：芯片的安装结构包括具有底座，底座上表面上的芯片以及粘接基座和第一芯片的粘接剂的基片。粘合剂施加到基底的上表面。芯片具有宽度和长度的矩形形状，并且在其下表面与基底结合。粘合剂包括分别设置在基底的上表面的三个点上的第一粘合剂，第二粘合剂和第三粘合剂。基座上的三个点位于三角形的顶点。第一芯片仅通过第一粘合剂，第二粘合剂和第三粘合剂结合到基底上。

3. 发明授权

US08419201B2 Light emitting module 有权
标题翻译：发光模块
公开(公告)号：US08419201B2
公开(公告)日：2013-04-16
申请号：US12913137
申请日：2010-10-27
申请人： Osamu Tanahashi , Satoshi Fukano , Shintarou Hayashi , Shinichi Anami , Shigetsugu Sumiyama , Motohiro Saimi , Hideharu Kawachi
发明人： Osamu Tanahashi , Satoshi Fukano , Shintarou Hayashi , Shinichi Anami , Shigetsugu Sumiyama , Motohiro Saimi , Hideharu Kawachi
IPC分类号： F21V9/16 , G09G3/30
CPC分类号： H01L51/5203 , F21Y2105/00 , F21Y2115/15 , H01L51/5237 , H01L2251/5361
摘要： A light emitting module includes an organic EL light emitting element and a support body supporting the organic EL light emitting element. The support body is attached to the organic EL light emitting element at the side of the non-light emitting surface of the light emitting module to cover one surface of the organic EL light emitting element. The organic EL light emitting element includes power feeding electrodes. The support body includes openings formed in a corresponding relationship with the power feeding electrodes. The power feeding electrodes exposed on the non-light emitting side of the support body through the openings. The support body includes power feeding terminals. The power feeding terminals partially exposed on the non-light emitting side of the support body. The power feeding terminals electrically connected to the power feeding electrodes by electric connection members extending via the non-light emitting side and the openings of the support body.
摘要翻译：发光模块包括有机EL发光元件和支撑有机EL发光元件的支撑体。支撑体附着在发光模块的非发光表面侧的有机EL发光元件，以覆盖有机EL发光元件的一个表面。有机EL发光元件包括供电电极。支撑体包括与供电电极形成对应关系的开口。供电电极通过开口暴露在支撑体的非发光侧。支撑体包括供电端子。供电端子部分地露出在支撑体的非发光侧。供电端子通过经由非发光侧延伸的电连接构件和支撑体的开口电连接到供电电极。

4. 发明申请

US20120292652A1 SURFACE LIGHT EMITTING DEVICE 有权
标题翻译：表面发光装置
公开(公告)号：US20120292652A1
公开(公告)日：2012-11-22
申请号：US13522445
申请日：2011-01-19
申请人： Kazuyuki Yamae , Hitoshi Kimura , Nobuhiro Ide , Hiroya Tsuji , Shintarou Hayashi
发明人： Kazuyuki Yamae , Hitoshi Kimura , Nobuhiro Ide , Hiroya Tsuji , Shintarou Hayashi
IPC分类号： H01L51/50
CPC分类号： H01L51/524 , H01L51/5271 , H01L51/5275 , H05B33/04
摘要： The surface light emitting device includes an organic EL element, a protection substrate, a protection part, and a light extraction structure part. The element has a first face and a second face opposite to the first face, and emits light from the first face. The substrate has transparency for light emitted from the element, and is placed facing the first face, and has a primary surface facing the first face of the element. The protection part is placed facing the second face of the element, and constitutes a housing in combination with the substrate and accommodates the element so as to protect the element from water. The structure part is interposed between the first face of the element and the substrate, and suppresses reflection of light emitted from the element on at least one of the first face of the element and the primary surface of the substrate.
摘要翻译：表面发光器件包括有机EL元件，保护基板，保护部件和光提取结构部件。元件具有与第一面相对的第一面和第二面，并且从第一面发射光。衬底对于从元件发射的光具有透明度，并且被放置成面对第一面，并且具有面向元件的第一面的主表面。保护部件被放置成面向元件的第二面，并且与基板组合构成壳体并容纳该元件，以保护元件免受水分影响。结构部分插入在元件的第一面和基板之间，并且抑制从元件发射的光在元件的第一面和基板的主表面中的至少一个上的反射。

5. 发明申请

US20110095701A1 LIGHT EMITTING MODULE 有权
标题翻译：发光模块
公开(公告)号：US20110095701A1
公开(公告)日：2011-04-28
申请号：US12913137
申请日：2010-10-27
申请人： Osamu TANAHASHI , Satoshi Fukano , Shintarou Hayashi , Shinichi Anami , Shigetsugu Sumiyama , Motohiro Saimi , Hideharu Kawachi
发明人： Osamu TANAHASHI , Satoshi Fukano , Shintarou Hayashi , Shinichi Anami , Shigetsugu Sumiyama , Motohiro Saimi , Hideharu Kawachi
IPC分类号： H05B37/02 , H01J1/62
CPC分类号： H01L51/5203 , F21Y2105/00 , F21Y2115/15 , H01L51/5237 , H01L2251/5361
摘要： A light emitting module includes an organic EL light emitting element and a support body supporting the organic EL light emitting element. The support body is attached to the organic EL light emitting element at the side of the non-light emitting surface of the light emitting module to cover one surface of the organic EL light emitting element. The organic EL light emitting element includes power feeding electrodes. The support body includes openings formed in a corresponding relationship with the power feeding electrodes. The power feeding electrodes exposed on the non-light emitting side of the support body through the openings. The support body includes power feeding terminals. The power feeding terminals partially exposed on the non-light emitting side of the support body. The power feeding terminals electrically connected to the power feeding electrodes by electric connection members extending via the non-light emitting side and the openings of the support body.
摘要翻译：发光模块包括有机EL发光元件和支撑有机EL发光元件的支撑体。支撑体附着在发光模块的非发光表面侧的有机EL发光元件，以覆盖有机EL发光元件的一个表面。有机EL发光元件包括供电电极。支撑体包括与供电电极形成对应关系的开口。供电电极通过开口暴露在支撑体的非发光侧。支撑体包括供电端子。供电端子部分地露出在支撑体的非发光侧。供电端子通过经由非发光侧延伸的电连接构件和支撑体的开口电连接到供电电极。

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