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    • 1. 发明授权
    • Thermoplastic fluorine-containing resin blend composition
    • 热塑性含氟树脂共混组合物
    • US4575533A
    • 1986-03-11
    • US730149
    • 1985-05-03
    • Shinji HorieTetsuji KakizakiToshikazu Mizutani
    • Shinji HorieTetsuji KakizakiToshikazu Mizutani
    • C08L1/00C08L23/00C08L27/00C08L27/12C08L51/00C08L51/02C08L51/06C08L57/00C08L101/00C08L101/04C08L27/14C08L27/16
    • C08L27/12C08L51/06
    • 1. A thermoplastic fluorine-containing resin blend composition comprising(a) from 5 to 95% by weight of a thermoplastic fluorine-containing resin, and(b) from 95 to 5% by weight of at least one modified ethylene polymer selected from the group consisting of the following components (i) and (ii).(i) A modified ethylene polymer obtained by subjecting an ethylene polymer and an alkyl acrylate to graft reaction conditions, wherein the total alkyl acrylate content including the alkyl acrylate which has been previously contained is from 5 to 70% by weight based on the weight of the modified ethylene polymer;(ii) A modified ethylene polymer obtained by subjecting an ethylene polymer having a crystallinity of from 4 to 50% and vinyl acetate to graft reaction conditions, wherein the total vinyl acetate content including the vinyl acetate which has been previously contained is from 5 to 70% by weight based on the weight of the modified ethylene polymer and the boiling xylene insoluble content is 10% by weight or less based on the weight of the modified ethylene polymer.
    • 1.一种热塑性含氟树脂共混组合物,其包含(a)5至95重量%的热塑性含氟树脂,和(b)95至5重量%的至少一种改性乙烯聚合物,其选自 组由以下组分(i)和(ii)组成。 (i)通过使乙烯聚合物和丙烯酸烷基酯进行接枝反应条件而获得的改性乙烯聚合物,其中包含以前含有的丙烯酸烷基酯的总烷基酯含量为5-70重量% 改性乙烯聚合物; (ii)通过使结晶度为4〜50%的乙烯聚合物和乙酸乙烯酯进行接枝反应而得到的改性乙烯聚合物,其中包含先前含有的乙酸乙烯酯的总乙酸乙烯酯含量为5〜70 相对于改性乙烯聚合物的重量,基于改性乙烯聚合物的重量和沸点二甲苯不溶成分的重量%为10重量%以下。
    • 4. 发明授权
    • Semiconductive resin composition and process for producing the same
    • 半导体树脂组合物及其制备方法
    • US5985181A
    • 1999-11-16
    • US20897
    • 1998-02-09
    • Yoshie YoshidaToshikazu MizutaniMasaki KitagawaJichio Deguchi
    • Yoshie YoshidaToshikazu MizutaniMasaki KitagawaJichio Deguchi
    • H01B1/24H01B1/06
    • H01B1/24Y10T428/2947
    • There is provided a semiconductive resin composition comprising the following components (A), (B), (D) and (E):(A) 5 to 100 parts by weight of a modified ethylene copolymer obtainable by subjecting an ethylene copolymer (a1) and a vinyl monomer (a2) to graft polymerization conditions,(B) 0.5 to 15 parts by weight of an unsaturated silane compound,(D) 10 to 110 parts by weight of carbon black, and(E) 0 to 95 parts by weight of an ethylene copolymer, provided that the amounts of the components shown above are based on 100 parts by weight in total of the components (A) and (E),wherein the component (B) is incorporated into the composition by subjecting the component (B) to melt graft reaction together with the component (A) and/or component (E) in the presence of 0.01 to 2 parts by weight of a radical generator (C),the vinyl monomer (a2) unit is contained in the composition in an amount of 5 to 35% by weight of the total amount of the components (A) and (E), andthe degree of crosslinking of the composition is from 30 to 90% by weight.
    • 提供了包含以下组分(A),(B),(D)和(E)的半导体树脂组合物:(A)5至100重量份通过使乙烯共聚物(a1) 乙烯基单体(a2),接枝聚合条件,(B)0.5〜15重量份的不饱和硅烷化合物,(D)10〜110重量份的炭黑,(E)0〜95重量份 的乙烯共聚物,条件是上述组分的量基于组分(A)和(E)的总计100重量份,其中组分(B)通过使组分(B) B)在0.01〜2重量份自由基发生剂(C)的存在下,与成分(A)和/或成分(E)一起熔融接枝反应,组合物中含有乙烯基单体(a2)单元 (A)和(E)的总量的5〜35重量%,交联度 组合物的着色为30至90重量%。
    • 10. 发明授权
    • Female terminal
    • 女性终端
    • US5975963A
    • 1999-11-02
    • US91904
    • 1998-06-26
    • Mitsutoshi HiguchiToshikazu MizutaniSatoru ImaedaYasuo MiyakeTakehiko NiwaHaruo Shimura
    • Mitsutoshi HiguchiToshikazu MizutaniSatoru ImaedaYasuo MiyakeTakehiko NiwaHaruo Shimura
    • H05K1/18H01R4/02H01R12/55H01R12/58H01R13/11H01R13/115H01R11/22
    • H01R4/028H01R12/58H01R13/11H01R13/113
    • A female terminal has a structure that does not allow molten solder to close a pipe section into which male terminal is inserted. Notched recessed sections (9) are oppositely formed at the lower ends of the side faces (3a and 3a) of a female terminal (1). The female terminal (1) is locked by horizontally opening locking legs (7) protruded from the rear surface of a printed wiring board (11) from an inserting hole (12). In such a state, the rear surface of the board is dipped in molten solder (21). When the board (11), is pulled up from the molten solder (12), the solder (21) closing the pipe section (2) in a bridge-like form is turned to droplets and drops from the recessed section (9), because the wettability of the pipe section (2) with the solder (21) is lowered and the adhesion is weakened due to the recessed sections (9). The remaining molten solder (21) attaches to the peripheral edge of the end of the pipe section (2) other than the recessed sections (9) due to the surface tension and solidifies.
    • PCT No.PCT / JP96 / 03827 Sec。 371日期:1998年6月26日 102(e)日期1998年6月26日PCT 1996年12月24日PCT公布。 出版物WO97 / 24910 日期1997年7月10日母端子具有不允许熔融焊料封闭插入阳端子的管段的结构。 在凹形端子(1)的侧面(3a和3a)的下端形成有凹口的凹部(9)。 通过从插入孔(12)水平打开从印刷电路板(11)的后表面突出的锁定腿(7),阴端子(1)被锁定。 在这种状态下,将板的后表面浸入熔融焊料(21)中。 当板(11)从熔融焊料(12)拉起时,将管状部分(2)以桥状形式封闭的焊料(21)从凹部(9)转向液滴和滴落, 因为具有焊料(21)的管部(2)的润湿性降低,并且由于凹部(9)而导致的粘接力减弱。 剩余的熔融焊料(21)由于表面张力而附着到除了凹部(9)之外的管部(2)的端部的周边边缘并固化。