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1. 发明授权

US5985181A Semiconductive resin composition and process for producing the same 失效
标题翻译：半导体树脂组合物及其制备方法
公开(公告)号：US5985181A
公开(公告)日：1999-11-16
申请号：US20897
申请日：1998-02-09
申请人： Yoshie Yoshida , Toshikazu Mizutani , Masaki Kitagawa , Jichio Deguchi
发明人： Yoshie Yoshida , Toshikazu Mizutani , Masaki Kitagawa , Jichio Deguchi
IPC分类号： H01B1/24 , H01B1/06
CPC分类号： H01B1/24 , Y10T428/2947
摘要： There is provided a semiconductive resin composition comprising the following components (A), (B), (D) and (E):(A) 5 to 100 parts by weight of a modified ethylene copolymer obtainable by subjecting an ethylene copolymer (a1) and a vinyl monomer (a2) to graft polymerization conditions,(B) 0.5 to 15 parts by weight of an unsaturated silane compound,(D) 10 to 110 parts by weight of carbon black, and(E) 0 to 95 parts by weight of an ethylene copolymer, provided that the amounts of the components shown above are based on 100 parts by weight in total of the components (A) and (E),wherein the component (B) is incorporated into the composition by subjecting the component (B) to melt graft reaction together with the component (A) and/or component (E) in the presence of 0.01 to 2 parts by weight of a radical generator (C),the vinyl monomer (a2) unit is contained in the composition in an amount of 5 to 35% by weight of the total amount of the components (A) and (E), andthe degree of crosslinking of the composition is from 30 to 90% by weight.
摘要翻译：提供了包含以下组分（A），（B），（D）和（E）的半导体树脂组合物：（A）5至100重量份通过使乙烯共聚物（a1）乙烯基单体（a2），接枝聚合条件，（B）0.5〜15重量份的不饱和硅烷化合物，（D）10〜110重量份的炭黑，（E）0〜95重量份的乙烯共聚物，条件是上述组分的量基于组分（A）和（E）的总计100重量份，其中组分（B）通过使组分（B） B）在0.01〜2重量份自由基发生剂（C）的存在下，与成分（A）和/或成分（E）一起熔融接枝反应，组合物中含有乙烯基单体（a2）单元（A）和（E）的总量的5〜35重量％，交联度组合物的着色为30至90重量％。

2. 发明申请

US20130130119A1 COPPER-COVERED STEEL FOIL, NEGATIVE ELECTRODE COLLECTOR AND ITS PRODUCTION METHOD, AND BATTERY 有权
标题翻译：铜覆盖钢丝，负极电极收集器及其生产方法和电池
公开(公告)号：US20130130119A1
公开(公告)日：2013-05-23
申请号：US13737294
申请日：2013-01-09
申请人： Sho MAJIMA , Takao Tsujimura , Takeshi Shimizu , Yoshikazu Morita , Takahiro Fujii , Norihiro Kon , Yoshie Yoshida
发明人： Sho MAJIMA , Takao Tsujimura , Takeshi Shimizu , Yoshikazu Morita , Takahiro Fujii , Norihiro Kon , Yoshie Yoshida
IPC分类号： H01M4/12 , H01M4/66 , H01M4/133
CPC分类号： H01M4/661 , B23K20/04 , B23K20/227 , B23K2101/16 , B23K2101/34 , B23K2101/38 , B23K2103/22 , B32B15/015 , C22C38/001 , C22C38/002 , C22C38/004 , C22C38/02 , C22C38/04 , C22C38/06 , C22C38/20 , C22C38/22 , C22C38/26 , C22C38/28 , C22C38/32 , C22C38/42 , C22C38/44 , C22C38/46 , C22C38/48 , C22C38/50 , C22C38/60 , C25D3/38 , C25D5/10 , C25D5/12 , C25D7/0614 , H01M4/0404 , H01M4/133 , H01M4/587 , H01M4/662 , H01M4/667 , H01M10/052 , H01M10/0525 , H01M2004/027 , H01M2220/30 , Y02E60/122 , Y02P70/54 , Y02T10/7011
摘要： A negative electrode collector using a copper-covered steel foil for carrying a negative electrode active material for lithium ion secondary batteries has a steel sheet as the core material thereof and has, on both surfaces thereof, a copper covering layer having a mean thickness tCu of from 0.02 to 5.0 μm on each surface, and of which the total mean thickness, t, including the copper covering layer 7 is from 3 to 100 μm with tCu/t of at most 0.3. The steel sheet can be common steel, austenitic stainless steel, or ferritic stainless steel. The copper covering layer can be a copper electroplating layer (including one rolled after plating). On the surface of the copper covering layer, for example, a carbon-based active material layer that has been densified through strong roll pressing is formed, and the copper-covered steel foil and the carbon-based active material layer constitute the negative electrode collector.
摘要翻译：使用用于承载锂离子二次电池用负极活性物质的铜包覆钢箔的负极集电体具有钢板作为其芯材，并且在其两个表面上具有平均厚度tCu为在每个表面上为0.02至5.0μm，其中包括铜覆盖层7的总平均厚度t为3至100μm，tCu / t至多为0.3。钢板可以是普通钢，奥氏体不锈钢或铁素体不锈钢。铜覆层可以是铜电镀层（包括电镀后的一个）。在铜被覆层的表面上，例如形成通过强力辊压而致密化的碳系活性物质层，铜覆盖钢箔和碳系活性物质层构成负极集电体。

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