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1. 发明授权

US08329335B2 Sealed-type secondary battery with integrated battery container formed with a polypropylene-based resin 有权
标题翻译：具有由聚丙烯系树脂形成的集成电池容器的密封型二次电池
公开(公告)号：US08329335B2
公开(公告)日：2012-12-11
申请号：US12707632
申请日：2010-02-17
申请人： Shinji Hamada , Toyohiko Eto , Kyouei Miura , Kenji Fukumoto , Daisuke Muramatsu
发明人： Shinji Hamada , Toyohiko Eto , Kyouei Miura , Kenji Fukumoto , Daisuke Muramatsu
IPC分类号： H01M2/00 , H01M2/02 , H01M2/04 , H01M2/08
CPC分类号： H01M10/345 , H01M2/0217 , H01M2/0242 , H01M2/0257 , H01M2/08 , H01M2/12 , H01M2/24 , H01M10/0413 , H01M10/0468 , H01M10/0525
摘要： A sealed-type secondary battery is disclosed. A battery module of a sealed-type secondary battery is formed by heating and fusing a top lid member and an integrated battery container. The integrated battery container is formed with a polymer alloy including a polyphenylene ether resin and a polyolefin resin, and the top lid member or a lateral lid member is formed with a polypropylene-based resin. A nucleating agent is added to the polypropylene-based resin of the top lid member or the lateral lid member, to improve mechanical strength, and the molecular weight is increased to reduce a melt flow rate MFR to approximately the same degree as the polymer alloy.
摘要翻译：公开了一种密封型二次电池。密封型二次电池的电池模块通过加热和熔合顶盖构件和集成电池容器而形成。集成电池容器由聚苯醚树脂和聚烯烃树脂构成的聚合物合金形成，顶盖部件或侧盖部件由聚丙烯系树脂形成。向上盖部件或侧盖部件的聚丙烯类树脂中添加成核剂，以提高机械强度，并且提高分子量以将熔体流动速率MFR降低至与聚合物合金大致相同的程度。

2. 发明申请

US20100209769A1 SEALED-TYPE SECONDARY BATTERY 有权
标题翻译：密封型二次电池
公开(公告)号：US20100209769A1
公开(公告)日：2010-08-19
申请号：US12707632
申请日：2010-02-17
申请人： Shinji Hamada , Toyohiko Eto , Kyouei Miura , Kenji Fukumoto , Daisuke Muramatsu
发明人： Shinji Hamada , Toyohiko Eto , Kyouei Miura , Kenji Fukumoto , Daisuke Muramatsu
IPC分类号： H01M2/08
CPC分类号： H01M10/345 , H01M2/0217 , H01M2/0242 , H01M2/0257 , H01M2/08 , H01M2/12 , H01M2/24 , H01M10/0413 , H01M10/0468 , H01M10/0525
摘要： A sealed-type secondary battery is disclosed. A battery module of a sealed-type secondary battery is formed by heating and fusing a top lid member and an integrated battery container. The integrated battery container is formed with a polymer alloy including a polyphenylene ether resin and a polyolefin resin, and the top lid member or a lateral lid member is formed with a polypropylene-based resin. A nucleating agent is added to the polypropylene-based resin of the top lid member or the lateral lid member, to improve mechanical strength, and the molecular weight is increased to reduce a melt flow rate MFR to approximately the same degree as the polymer alloy.
摘要翻译：公开了一种密封型二次电池。密封型二次电池的电池模块通过加热和熔合顶盖构件和集成电池容器而形成。集成电池容器由聚苯醚树脂和聚烯烃树脂构成的聚合物合金形成，顶盖部件或侧盖部件由聚丙烯系树脂形成。向上盖部件或侧盖部件的聚丙烯类树脂中添加成核剂，以提高机械强度，并且提高分子量以将熔体流动速率MFR降低至与聚合物合金大致相同的程度。

3. 发明申请

US20050191838A1 Apparatus and method for forming bump 失效
标题翻译：用于形成凸块的装置和方法
公开(公告)号：US20050191838A1
公开(公告)日：2005-09-01
申请号：US11114084
申请日：2005-04-26
申请人： Shoriki Narita , Koichi Yoshida , Masahiko Ikeya , Takaharu Mae , Shinji Kanayama , Makoto Imanishi , Kazushi Higashi , Kenji Fukumoto , Hiroshi Wada
发明人： Shoriki Narita , Koichi Yoshida , Masahiko Ikeya , Takaharu Mae , Shinji Kanayama , Makoto Imanishi , Kazushi Higashi , Kenji Fukumoto , Hiroshi Wada
IPC分类号： H05K3/34 , B23K20/00 , H01L21/00 , H01L21/60 , H01L21/44
CPC分类号： H01L24/742 , H01L21/67138 , H01L21/67144 , H01L21/67248 , H01L24/11 , H01L2224/05568 , H01L2224/05573 , H01L2224/1134 , H01L2224/13099 , H01L2224/13144 , H01L2224/45144 , H01L2924/01004 , H01L2924/01006 , H01L2924/01013 , H01L2924/01023 , H01L2924/01025 , H01L2924/01033 , H01L2924/01039 , H01L2924/01047 , H01L2924/01052 , H01L2924/01065 , H01L2924/01073 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01327 , H01L2924/10329 , H01L2924/351 , Y10T29/4921 , H01L2924/00 , H01L2924/00014
摘要： A preheat device (160) is provided to execute, before forming bumps (16) to electrode parts (15), a pre-formation temperature control for bonding promotion to promote bonding between the electrode parts and the bumps during bump formation. Metal particles of the electrode parts can be changed to an appropriate state before the bump formation. Phenomenally, a bonding state between the electrode parts and the bumps can be improved as compared with the conventional art. In a further arrangement of the present invention, semiconductor components with bumps can be heated under a bonding strength improvement condition by a bonding stage (316) through controlling the heating by a controller (317).
摘要翻译：提供预热装置（160），用于在形成凸起（16）到电极部件（15）之前执行用于粘接促进的预制温度控制，以促进在凸起形成期间电极部件和凸块之间的接合。电极部分的金属颗粒可以在凸点形成之前变成适当的状态。与现有技术相比，现在可以改善电极部分和凸块之间的结合状态。在本发明的另一方面中，通过控制器（317）的加热来控制加热，可以通过接合台（316）在接合强度改善条件下加热具有凸块的半导体部件。

4. 发明授权

US06358957B1 Phenylahistin and the phenylahistin analogs, a new class of anti-tumor compounds 有权
标题翻译：苯基黑曲霉素和亚硫酸钠类似物，一类新的抗肿瘤化合物
公开(公告)号：US06358957B1
公开(公告)日：2002-03-19
申请号：US09440316
申请日：1999-11-12
申请人： Kenji Fukumoto , Shinkichi Kohno , Kaneo Kanoh , Tohru Asari , Hiroshi Kawashima , Hirokatsu Sekiya , Kazunori Ohmizo , Takeo Harada
发明人： Kenji Fukumoto , Shinkichi Kohno , Kaneo Kanoh , Tohru Asari , Hiroshi Kawashima , Hirokatsu Sekiya , Kazunori Ohmizo , Takeo Harada
IPC分类号： C07D24106
CPC分类号： C07D403/06 , A61K31/496
摘要： A compound, its pharmaceutically acceptable salts, and/or its pro-drug esters, in isolated form, and methods for isolating, for formulating, and for administering the compound, salt, and/or pro-drug ester as an antitumor agent, wherein the compound, salt, or pro-drug ester has the following structure: wherein: R1, R2, R5, R7,and R8 are each separately selected from the group consisting of a hydrogen atom, a halogen atom, and saturated C1-C24 alkyl, unsaturated C1-C24 alkenyl, cycloalkyl, cycloalkenyl, alkoxy, cycloalkoxy, aryl, substituted aryl, heteroaryl, substituted heteroaryl, amino, substituted amino, nitro, substituted nitro, phenyl, and substituted phenyl groups, R3, R4, and R6 are each separately selected from the group consisting of a hydrogen atom, a halogen atom, and saturated C1-C12 alkyl, unsaturated C1-C12 alkenyl, cycloalkyl, alkoxy, cycloalkoxy, aryl, substituted aryl, heteroaryl, substituted heteroaryl, amino, substituted amino, nitro, and substituted nitro groups, X1 and X2 are separately selected from the group consisting of an oxygen atom, and a sulfur atom, and the dashed bond represents a bond selected from the group consisting of a carbon-carbon single bond and a carbon-carbon double bond. Most preferably, R3 and R4 are hydrogen, and each are involved in hydrogen bonds, and/or the dashed bond is a double bond, such that the chemical backbone of the compound substantially retains a substantially planar conformation.
摘要翻译：分离形式的化合物，其药学上可接受的盐和/或其前药酯，以及用于分配，配制和施用作为抗肿瘤剂的化合物，盐和/或前药酯的方法，其中化合物，盐或前药酯具有以下结构：其中：R 1，R 2，R 5，R 7和R 8各自独立地选自氢原子，卤素原子和饱和C 1 -C 24烷基，不饱和C 1 -C 24烯基，环烷基，环烯基，烷氧基，环烷氧基，芳基，取代的芳基，杂芳基，取代的杂芳基，氨基，取代的氨基，硝基，取代的硝基，苯基和取代的苯基，R 3，R 4和R 6 分别选自氢原子，卤素原子和饱和C 1 -C 12烷基，不饱和C 1 -C 12烯基，环烷基，烷氧基，环烷氧基，芳基，取代的芳基，杂芳基，取代的杂芳基，氨基，取代的氨基，硝基和取代的硝基，X1和 X2分别选自氧原子和硫原子，虚键表示选自碳 - 碳单键和碳 - 碳双键的键。最优选地，R 3和R 4是氢，并且各自参与氢键，和/或虚线键是双键，使得化合物的化学主链基本上保持基本上平面的构象。

5. 发明授权

US5058526A Vertical load-lock reduced-pressure type chemical vapor deposition apparatus 失效
标题翻译：垂直装载减压型化学气相沉积装置
公开(公告)号：US5058526A
公开(公告)日：1991-10-22
申请号：US318315
申请日：1989-03-03
申请人： Yoshinari Matsushita , Kenji Fukumoto , Satoshi Takeda
发明人： Yoshinari Matsushita , Kenji Fukumoto , Satoshi Takeda
IPC分类号： H01L21/205 , C23C16/54 , H01L21/31 , H01L21/677
CPC分类号： H01L21/67757 , C23C16/54 , H01L21/67766 , Y10S414/137 , Y10S414/139 , Y10S414/14
摘要： A CVD apparatus having a single loading-unloading chamber that serves as a loading chamber in the left and center parts and as an unloading chamber in the right and center parts. Alternately, wafers provisionally stored in cassettes are put into and taken from an auxiliary chamber connected at the center part. The loading-unloading chamber has a sliding bed for slidingly transferring two cassettes, each used for temporarily carrying a plurality of wafers for loading from a load cassette table through the loading cassette to a reaction chamber and for unloading from the reaction chamber through an unloading cassette to an unloading cassette table.
摘要翻译：一种CVD装置，其具有在左侧和中央部分中用作装载室的单个装载卸载室以及右侧和中部的卸载室。或者，临时存储在盒中的晶片被放入并连接在连接在中心部分的辅助室中。装载卸载室具有用于滑动地传送两个盒的滑动床，每个盒用于临时携带多个晶片，用于从装载盒台通过装载盒装载到反应室，并通过卸载盒从反应室卸载到卸载盒式表。

6. 发明授权

US08408890B2 Mold system for composite molding 有权
标题翻译：复合成型模具系统
公开(公告)号：US08408890B2
公开(公告)日：2013-04-02
申请号：US11990398
申请日：2006-08-09
申请人： Kenji Fukumoto , Shizuo Jinno , Atsushi Tsukamoto , Toshiaki Hotaka , Fumitaka Kondo , Yasuhiro Sugihara , Kazuma Hisaki
发明人： Kenji Fukumoto , Shizuo Jinno , Atsushi Tsukamoto , Toshiaki Hotaka , Fumitaka Kondo , Yasuhiro Sugihara , Kazuma Hisaki
IPC分类号： B29C45/14 , B29C45/16 , B29C43/18 , B29C43/20 , B29C69/02
CPC分类号： B29C43/04 , B29C45/045 , B29C45/1628 , B29C45/561 , B29L2011/00 , B29L2031/3055 , B29L2031/7782
摘要： [PROBLEM]To provide a method of molding a composite molded article enabling compression molding without requiring a large sized injection molding machine and a mold system used for that.[MEANS FOR SOLUTION]A method of molding a composite molded article using a first mold member 13 to mold a primary molded article 29 by primary molding, switching a movable mold member holding the primary molded article 29 with a movable mold member 14 positioned with a second mold member 15, then using a second mold member 15 in which the primary molded article 29 is inserted to mold a secondary molded article 30 by secondary molding, wherein the primary molding and the secondary molding are executed by non-continuous different steps at points of time different from each other.
摘要翻译： [问题]提供一种能够进行压缩成型而不需要大型注塑机和用于其的模具系统的复合模制品的成型方法。解决方案的方法使用第一模具构件13模制复合模塑制品以通过一次模塑来模制一次模塑制品29的方法，用一个可移动模具构件14切换保持一次模塑制品29的可移动模具构件，第二模具构件15，然后使用第二模制构件15，其中插入一次模塑制品29以通过二次模制来模制二次模制品30，其中一次模制和二次模塑通过非连续不同的步骤在点的时间彼此不同。

7. 发明授权

US5000988A Method of applying a coating of viscous materials 失效
标题翻译：施加粘性材料涂层的方法
公开(公告)号：US5000988A
公开(公告)日：1991-03-19
申请号：US143027
申请日：1988-01-12
申请人： Takao Inoue , Tetsuo Fukushima , Kenji Fukumoto , Kazumi Ishimoto
发明人： Takao Inoue , Tetsuo Fukushima , Kenji Fukumoto , Kazumi Ishimoto
IPC分类号： G02F1/13 , B05C5/02 , B05D1/02 , B05D1/26 , H05K3/12
CPC分类号： H05K3/1241 , B05C5/0216 , H05K2203/0126
摘要： In the coating method of a viscous material according to the present invention, a nozzle body having outlets corresponding to many coating rows is employed. The nozzle body is moved, while the gap between the nozzle body and the surface to be coated is maintained constant, so that the viscous material composed of different kinds of materials is discharged out of each outlet, thereby to effect simultaneous coating of the viscous material composed of different kinds of materials in many rows. Therefore, the present invention has such advantages that the surface to be coated is less stained, and at the same time, the surface to be coated becomes more smooth.
摘要翻译：在根据本发明的粘性材料的涂布方法中，采用具有对应于许多涂布行的出口的喷嘴体。喷嘴体移动，同时喷嘴体与待涂覆表面之间的间隙保持恒定，使得由各种材料组成的粘性材料从每个出口排出，从而同时涂覆粘性材料由不同种类的材料组成的很多行。因此，本发明具有这样的优点：被涂布表面污染较少，同时，被涂布表面更加光滑。

8. 发明授权

US06910613B2 Device and method for forming bump 失效
标题翻译：用于形成凸块的装置和方法
公开(公告)号：US06910613B2
公开(公告)日：2005-06-28
申请号：US10332026
申请日：2001-06-29
申请人： Shoriki Narita , Koichi Yoshida , Masahiko Ikeya , Takaharu Mae , Shinji Kanayama , Makoto Imanishi , Kazushi Higashi , Kenji Fukumoto , Hiroshi Wada
发明人： Shoriki Narita , Koichi Yoshida , Masahiko Ikeya , Takaharu Mae , Shinji Kanayama , Makoto Imanishi , Kazushi Higashi , Kenji Fukumoto , Hiroshi Wada
IPC分类号： H05K3/34 , B23K20/00 , H01L21/00 , H01L21/60 , B23K37/00 , H01L21/44
CPC分类号： H01L24/742 , H01L21/67138 , H01L21/67144 , H01L21/67248 , H01L24/11 , H01L2224/05568 , H01L2224/05573 , H01L2224/1134 , H01L2224/13099 , H01L2224/13144 , H01L2224/45144 , H01L2924/01004 , H01L2924/01006 , H01L2924/01013 , H01L2924/01023 , H01L2924/01025 , H01L2924/01033 , H01L2924/01039 , H01L2924/01047 , H01L2924/01052 , H01L2924/01065 , H01L2924/01073 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01327 , H01L2924/10329 , H01L2924/351 , Y10T29/4921 , H01L2924/00 , H01L2924/00014
摘要： A preheat device (160) is provided to execute, before forming bumps (16) to electrode parts (15), a pre-formation temperature control for bonding promotion to promote bonding between the electrode parts and the bumps during bump formation. Metal particles of the electrode parts can be changed to an appropriate state before the bump formation. Phenomenally, a bonding state between the electrode parts and the bumps can be improved as compared with the conventional art. In a further arrangement of the present invention, semiconductor components with bumps can be heated under a bonding strength improvement condition by a bonding stage (316) through controlling the heating by a controller (317).
摘要翻译：提供预热装置（160），用于在形成凸起（16）到电极部件（15）之前执行用于粘合促进的预制温度控制，以促进在凸块形成期间电极部分和凸块之间的结合。电极部分的金属颗粒可以在凸点形成之前变成适当的状态。与现有技术相比，现在可以改善电极部分和凸块之间的结合状态。在本发明的另一方面中，通过控制器（317）的加热来控制加热，可以通过接合台（316）在接合强度改善条件下加热具有凸块的半导体部件。

9. 发明授权

US5315445A Audio signal recording apparatus and method for use with VTR 失效
标题翻译：用于VTR的音频信号记录装置和方法
公开(公告)号：US5315445A
公开(公告)日：1994-05-24
申请号：US757653
申请日：1991-09-05
申请人： Kenji Fukumoto , Ichiro Okamoto , Keitaro Yamashita
发明人： Kenji Fukumoto , Ichiro Okamoto , Keitaro Yamashita
IPC分类号： G11B20/12 , H04N5/7826 , H04N5/91 , H04N5/928 , H04N9/797 , H04N9/81 , G11B5/02
CPC分类号： H04N9/7973 , G11B20/1208 , H04N5/78266 , H04N5/928 , H04N9/81
摘要： An audio signal recording apparatus and method for recording an video signal (e.g., a half field) and at least four channels of audio signals corresponding to the video signal to a plurality of tracks on a tape. The audio signals are recorded to recording blocks in an audio recording area which are separated from a recording area for the corresponding video signal in accordance with a priority rating. More specifically, the at least four channels of audio signals are divided into groups each having a plurality of channels. The audio signal recording area is divided into a plurality of recording blocks in the longitudinal direction of the tracks and each group of audio data is recorded to one of the audio signal recording blocks. Each group of audio data is assigned a priority rating depending on the importance of the data contained therein. Audio data having a high priority are recorded to blocks that are located further away from the track ends than those for audio data having a low priority. Since the contact fit between the tape and a recording head at the track ends is unstable, by recording the audio data of high priorities in blocks located relatively for away from the track ends where the tape-to-head contact fit is more stable, deterioration in sound quality is minimized for the important data upon reproduction.
摘要翻译：一种音频信号记录装置和方法，用于将对应于视频信号的视频信号（例如，半场）和至少四个音频信号的信道记录到磁带上的多个磁道。音频信号被记录在音频记录区中，根据优先等级与对应的视频信号的记录区分开。更具体地，至少四个声道的音频信号被分成具有多个声道的组。音频信号记录区域在轨道的纵向被分成多个记录块，并且每组音频数据被记录到音频信号记录块之一。根据其中包含的数据的重要性，为每组音频数据分配优先级。具有高优先级的音频数据被记录到比轨道端更远的块比具有低优先级的音频数据的块。由于磁带和轨道端之间的记录头之间的接触配合是不稳定的，所以通过将高优先级的音频数据记录在相对较远的位置，以便远离磁带头接触配合的轨道端更稳定，劣化对于重放时的重要数据，音质被最小化。

10. 发明授权

US07350684B2 Apparatus and method for forming bump 失效
标题翻译：用于形成凸块的装置和方法
公开(公告)号：US07350684B2
公开(公告)日：2008-04-01
申请号：US11114084
申请日：2005-04-26
申请人： Shoriki Narita , Koichi Yoshida , Masahiko Ikeya , Takaharu Mae , Shinji Kanayama , Makoto Imanishi , Kazushi Higashi , Kenji Fukumoto , Hiroshi Wada
发明人： Shoriki Narita , Koichi Yoshida , Masahiko Ikeya , Takaharu Mae , Shinji Kanayama , Makoto Imanishi , Kazushi Higashi , Kenji Fukumoto , Hiroshi Wada
IPC分类号： B23K37/00
CPC分类号： H01L24/742 , H01L21/67138 , H01L21/67144 , H01L21/67248 , H01L24/11 , H01L2224/05568 , H01L2224/05573 , H01L2224/1134 , H01L2224/13099 , H01L2224/13144 , H01L2224/45144 , H01L2924/01004 , H01L2924/01006 , H01L2924/01013 , H01L2924/01023 , H01L2924/01025 , H01L2924/01033 , H01L2924/01039 , H01L2924/01047 , H01L2924/01052 , H01L2924/01065 , H01L2924/01073 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01327 , H01L2924/10329 , H01L2924/351 , Y10T29/4921 , H01L2924/00 , H01L2924/00014
摘要： A preheat device (160) is provided to execute, before forming bumps (16) to electrode parts (15), a pre-formation temperature control for bonding promotion to promote bonding between the electrode parts and the bumps during bump formation. Metal particles of the electrode parts can be changed to an appropriate state before the bump formation. Phenomenally, a bonding state between the electrode parts and the bumps can be improved as compared with the conventional art. In a further arrangement of the present invention, semiconductor components with bumps can be heated under a bonding strength improvement condition by a bonding stage (316) through controlling the heating by a controller (317).
摘要翻译：提供预热装置（160），用于在形成凸起（16）到电极部件（15）之前执行用于粘接促进的预制温度控制，以促进在凸块形成期间电极部件和凸块之间的接合。电极部分的金属颗粒可以在凸点形成之前变成适当的状态。与现有技术相比，现在可以改善电极部分和凸块之间的结合状态。在本发明的另一方面中，通过控制器（317）的加热来控制加热，可以通过接合台（316）在接合强度改善条件下加热具有凸块的半导体部件。

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