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1. 发明申请

US20050036241A1 Rotary disk storage device and method 审中-公开
标题翻译：旋转盘存储装置及方法
公开(公告)号：US20050036241A1
公开(公告)日：2005-02-17
申请号：US10890302
申请日：2004-07-12
申请人： Shingo Tsuda , Yasunori Kawamoto , Tsuyoshi Matsumoto , Taichi Nakamura
发明人： Shingo Tsuda , Yasunori Kawamoto , Tsuyoshi Matsumoto , Taichi Nakamura
IPC分类号： G11B21/21 , G11B5/41 , G11B5/48 , G11B5/55 , G11B5/596 , G11B5/60 , G11B21/02
CPC分类号： G11B5/41 , G11B5/4826 , G11B5/4833 , G11B5/4853 , G11B5/6082
摘要： Embodiments of the invention provide a rotary disk storage device in which dust particles are less likely to deposit on the air bearing surface of each head/slider. The actuator head suspension assembly is configured so as to make the skew angle of the head/slider positive at about 80% or more of all the tracks. Specifically, the actuator head suspension assembly is configured in such a manner that the distance L2 between the center of the pivot shaft and the intersection point P of the trailing edge of the head/slider is made longer than a given length or there is an angle β between the reference line Y and the pivot line Z.
摘要翻译：本发明的实施例提供一种旋转盘存储装置，其中灰尘颗粒不太可能沉积在每个头/滑块的空气支承表面上。致动器头部悬挂组件被构造成使得头部/滑块的歪斜角度在所有轨道的大约80％或更多处正向。具体地说，致动器头部悬挂组件被构造成使得枢转轴的中心与头/滑块的后缘的交点P之间的距离L2被制成长于给定的长度，或者有一个角度 β在参考线Y和枢转线Z之间。

2. 发明授权

US07724463B2 Disk drive device and method for removing adhesion on a head 有权
标题翻译：磁盘驱动装置和去除头部附着力的方法
公开(公告)号：US07724463B2
公开(公告)日：2010-05-25
申请号：US12220719
申请日：2008-07-25
申请人： Taichi Nakamura , Mitsuhiko Oguchi , Yasunori Kawamoto
发明人： Taichi Nakamura , Mitsuhiko Oguchi , Yasunori Kawamoto
IPC分类号： G11B21/02
CPC分类号： G11B5/41 , G11B21/12
摘要： Embodiments of the present invention help to effectively remove adhesion on a head slider. In an embodiment of the present invention, a hard disk controller/multiprocessing unit (HDC/MPU) raises the temperature on the surface of a head slider with a heating element on the head slider to remove adhesion on the head slider while an actuator stays on a ramp. The HDC/MPU varies the amount of heat in accordance with the temperature sensed by a temperature sensor. This achieves removal of the adhesion on the head slider, maintaining reliability.
摘要翻译：本发明的实施例有助于有效地去除头部滑块上的粘附。在本发明的一个实施例中，硬盘控制器/多处理单元（HDC / MPU）在磁头滑动器上使用加热元件在磁头滑块的表面上升高温度，以在致动器保持开启时去除磁头滑块上的粘附一个坡道 HDC / MPU根据温度传感器感测到的温度来改变热量。这实现了去除头滑块上的粘附力，保持了可靠性。

3. 发明申请

US20070091506A1 Magnetic disk drive with air bearing surface design for data area expansion 审中-公开
标题翻译：磁盘驱动器带有空气轴承表面设计，用于数据区域扩展
公开(公告)号：US20070091506A1
公开(公告)日：2007-04-26
申请号：US11584380
申请日：2006-10-19
申请人： Taichi Nakamura , Akihiro Sera , Yasunori Kawamoto , Takaaki Deguchi
发明人： Taichi Nakamura , Akihiro Sera , Yasunori Kawamoto , Takaaki Deguchi
IPC分类号： G11B5/60
CPC分类号： G11B5/6005
摘要： Embodiment of the invention provides a magnetic disk drive that may suppress the decrease of a recording region by preventing a magnetic head slider from abutting a magnetic disk at the time of loading, and suppress the degradation of the flying characteristics. In one embodiment a magnetic disk drive of the present invention is provided with a magnetic head slider including a magnetic transducer, a ramp that unloads the magnetic head slider, and an actuator that moves the magnetic head slider. The magnetic head slider includes a rail surface that generates a positive pressure on an air-bearing surface, a step bearing surface, and a taper section that is formed to a slider corner section that is brought closest to the surface of a recording disk at the time of loading with a space from the rail surface and the step bearing surface.
摘要翻译：本发明的实施例提供一种磁盘驱动器，其可以通过防止磁头滑块在装载时抵靠磁盘来抑制记录区域的减小，并且抑制飞行特性的劣化。在一个实施例中，本发明的磁盘驱动器设置有磁头滑块，其包括磁换能器，卸载磁头滑块的斜面和移动磁头滑块的致动器。磁头滑动器包括在空气轴承表面上产生正压的轨道表面，台阶支承表面和形成在最靠近记录盘表面的滑块角部的锥形部分从轨道表面和台阶承载表面加载空间的时间。

4. 发明授权

US07787218B2 Data storage device 有权
标题翻译：数据存储设备
公开(公告)号：US07787218B2
公开(公告)日：2010-08-31
申请号：US11707534
申请日：2007-02-16
申请人： Takaaki Deguchi , Mutsuro Ohta , Shingo Tsuda , Taichi Nakamura
发明人： Takaaki Deguchi , Mutsuro Ohta , Shingo Tsuda , Taichi Nakamura
IPC分类号： G11B5/54
CPC分类号： G11B5/54
摘要： Embodiments in accordance with the present invention relate to suppressing deterioration in rigidity and dynamic characteristics of a tab even when an initial point of contact between a tab and a ramp during unloading is set closer to the outer periphery of a disk. A data storage device in one embodiment of the present invention includes a head, a ramp for unloading the head, a load beam having a head support portion for supporting the head and a tab adapted to slide on a sliding surface of the ramp on a front end side with respect to the head support portion, and an actuator having the load beam and adapted to actuate the head for loading and unloading. During unloading, a portion of the tab offset from the center in the transverse direction of the tab first comes into contact with the sliding surface of the ramp. The load beam has a flange formed to be bent and continuously from the front end portion of the tab up to both ends of the head support portion.
摘要翻译：根据本发明的实施例涉及抑制突片的刚度和动态特性的劣化，即使在卸载期间突片和斜坡之间的初始接触点被设置成更接近盘的外周。本发明的一个实施例中的数据存储装置包括头部，用于卸载头部的斜面，负载梁，其具有用于支撑头部的头部支撑部分和适于在前部的斜面的滑动表面上滑动的突出部相对于头部支撑部分的端侧，以及具有负载梁并且适于致动头部用于装载和卸载的致动器。在卸载期间，从突片的横向方向上的中心偏离的突片的一部分首先与斜面的滑动表面接触。负载梁具有形成为从凸起的前端部直到头部支撑部的两端连续弯曲的凸缘。

5. 发明申请

US20070206331A1 Data storage device 有权
标题翻译：数据存储设备
公开(公告)号：US20070206331A1
公开(公告)日：2007-09-06
申请号：US11707534
申请日：2007-02-16
申请人： Takaaki Deguchi , Mutsuro Ohta , Shingo Tsuda , Taichi Nakamura
发明人： Takaaki Deguchi , Mutsuro Ohta , Shingo Tsuda , Taichi Nakamura
IPC分类号： G11B5/54
CPC分类号： G11B5/54
摘要： Embodiments in accordance with the present invention relate to suppressing deterioration in rigidity and dynamic characteristics of a tab even when an initial point of contact between a tab and a ramp during unloading is set closer to the outer periphery of a disk. A data storage device in one embodiment of the present invention includes a head, a ramp for unloading the head, a load beam having a head support portion for supporting the head and a tab adapted to slide on a sliding surface of the ramp on a front end side with respect to the head support portion, and an actuator having the load beam and adapted to actuate the head for loading and unloading. During unloading, a portion of the tab offset from the center in the transverse direction of the tab first comes into contact with the sliding surface of the ramp. The load beam has a flange formed to be bent and continuously from the front end portion of the tab up to both ends of the head support portion.
摘要翻译：根据本发明的实施例涉及抑制突片的刚度和动态特性的劣化，即使在卸载期间突片和斜坡之间的初始接触点被设置成更接近盘的外周。本发明的一个实施例中的数据存储装置包括头部，用于卸载头部的斜面，负载梁，其具有用于支撑头部的头部支撑部分和适于在前部的斜面的滑动表面上滑动的突出部相对于头部支撑部分的端侧，以及具有负载梁并且适于致动头部用于装载和卸载的致动器。在卸载期间，从突片的横向方向上的中心偏离的突片的一部分首先与斜面的滑动表面接触。负载梁具有形成为从凸起的前端部直到头部支撑部的两端连续弯曲的凸缘。

6. 发明申请

US20090040659A1 Disk drive device and method for removing adhesion on a head 有权
标题翻译：磁盘驱动装置和去除头部附着力的方法
公开(公告)号：US20090040659A1
公开(公告)日：2009-02-12
申请号：US12220719
申请日：2008-07-25
申请人： Taichi Nakamura , Mitsuhiko Oguchi , Yasunori Kawamoto
发明人： Taichi Nakamura , Mitsuhiko Oguchi , Yasunori Kawamoto
IPC分类号： G11B5/60
CPC分类号： G11B5/41 , G11B21/12
摘要： Embodiments of the present invention help to effectively remove adhesion on a head slider. In an embodiment of the present invention, a hard disk controller/multiprocessing unit (HDC/MPU) raises the temperature on the surface of a head slider with a heating element on the head slider to remove adhesion on the head slider while an actuator stays on a ramp. The HDC/MPU varies the amount of heat in accordance with the temperature sensed by a temperature sensor. This achieves removal of the adhesion on the head slider, maintaining reliability.
摘要翻译：本发明的实施例有助于有效地去除头部滑块上的粘附。在本发明的一个实施例中，硬盘控制器/多处理单元（HDC / MPU）在磁头滑动器上使用加热元件在磁头滑块的表面上升高温度，以在致动器保持开启时去除磁头滑块上的粘附一个坡道 HDC / MPU根据温度传感器感测到的温度来改变热量。这实现了去除头滑块上的粘附力，保持了可靠性。

7. 发明申请

US20130241069A1 SEMICONDUCTOR BONDING STRUCTURE BODY AND MANUFACTURING METHOD OF SEMICONDUCTOR BONDING STRUCTURE BODY 有权
标题翻译：半导体结合体结构体的半导体结合体和半导体结合体的制造方法
公开(公告)号：US20130241069A1
公开(公告)日：2013-09-19
申请号：US13823463
申请日：2011-10-17
申请人： Taichi Nakamura , Akio Furusawa , Shigeaki Sakatani , Hidetoshi Kitaura , Yukihiro Ishimaru
发明人： Taichi Nakamura , Akio Furusawa , Shigeaki Sakatani , Hidetoshi Kitaura , Yukihiro Ishimaru
IPC分类号： H01L23/00
CPC分类号： H01L24/30 , B22F2999/00 , B23K1/0016 , B23K35/0238 , B23K35/26 , B23K35/262 , B23K35/3006 , B23K35/3013 , B23K35/302 , B23K2101/40 , B32B15/018 , C22C1/0483 , C22C5/02 , C22C5/06 , C22C9/00 , C22C9/02 , C22C13/00 , H01L21/563 , H01L23/4827 , H01L23/562 , H01L24/05 , H01L24/27 , H01L24/29 , H01L24/32 , H01L24/48 , H01L24/73 , H01L24/83 , H01L2224/04026 , H01L2224/05147 , H01L2224/05639 , H01L2224/05647 , H01L2224/2733 , H01L2224/29 , H01L2224/29111 , H01L2224/29113 , H01L2224/32245 , H01L2224/32503 , H01L2224/32507 , H01L2224/48091 , H01L2224/48247 , H01L2224/73265 , H01L2224/83 , H01L2224/83065 , H01L2224/83439 , H01L2224/83444 , H01L2224/8381 , H01L2224/83815 , H01L2924/00015 , H01L2924/01019 , H01L2924/01029 , H01L2924/01079 , H01L2924/0132 , H01L2924/01322 , H01L2924/01327 , H01L2924/351 , H01L2924/3512 , H01L2924/00014 , B22F1/0003 , H01L2924/0105 , H01L2924/00 , H01L2924/00012 , H01L2924/01047 , H01L2924/01083 , H01L2924/01049 , H01L2924/01028 , H01L2224/45099
摘要： A bonding structure body in which a semiconductor element and an electrode are bonded via a solder material, wherein a part that allows bonding has a first intermetallic compound layer that has been formed on the electrode side, a second intermetallic compound layer that has been formed on the semiconductor element side, and a third layer that is constituted by a phase containing Sn and a sticks-like intermetallic compound part, which is sandwiched between the two layers of the first intermetallic compound layer and the second intermetallic compound layer, and the sticks-like intermetallic compound part is interlayer-bonded to both of the first intermetallic compound layer and the second intermetallic compound layer.
摘要翻译：一种接合结构体，其中半导体元件和电极通过焊料材料接合，其中允许接合的部分具有形成在电极侧的第一金属间化合物层，形成在第二金属间化合物层上的第二金属间化合物层半导体元件侧和由夹在第一金属间化合物层和第二金属间化合物层的两层之间的含有Sn和棒状金属间化合物部分的相位构成的第三层，类似金属间化合物部分被层间接合到第一金属间化合物层和第二金属间化合物层上。

8. 发明授权

US08421246B2 Joint structure and electronic component 有权
标题翻译：联合结构和电子元件
公开(公告)号：US08421246B2
公开(公告)日：2013-04-16
申请号：US12864826
申请日：2009-05-22
申请人： Akio Furusawa , Shigeaki Sakatani , Taichi Nakamura , Takahiro Matsuo
发明人： Akio Furusawa , Shigeaki Sakatani , Taichi Nakamura , Takahiro Matsuo
IPC分类号： H01L29/43
CPC分类号： B23K1/0016 , B23K35/0233 , B23K35/0238 , B23K35/264 , B23K2101/40 , C22C12/00 , C22C19/03 , H01L23/488 , H01L23/49503 , H01L23/49513 , H01L24/05 , H01L24/29 , H01L24/32 , H01L24/45 , H01L24/48 , H01L24/49 , H01L24/83 , H01L2224/0401 , H01L2224/04042 , H01L2224/05554 , H01L2224/05556 , H01L2224/29101 , H01L2224/29113 , H01L2224/2919 , H01L2224/32245 , H01L2224/32257 , H01L2224/45124 , H01L2224/48091 , H01L2224/48247 , H01L2224/48699 , H01L2224/49111 , H01L2224/49171 , H01L2224/73265 , H01L2224/838 , H01L2924/00014 , H01L2924/01006 , H01L2924/01013 , H01L2924/01014 , H01L2924/01022 , H01L2924/01028 , H01L2924/01029 , H01L2924/01032 , H01L2924/01033 , H01L2924/01046 , H01L2924/01047 , H01L2924/01061 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/0132 , H01L2924/01327 , H01L2924/0133 , H01L2924/014 , H01L2924/0665 , H01L2924/10162 , H01L2924/10253 , H01L2924/10272 , H01L2924/1033 , H01L2924/1305 , H01L2924/13055 , H01L2924/15153 , H01L2924/15165 , H01L2924/181 , H01L2924/19041 , H01L2924/19042 , H01L2924/00 , H01L2924/01083 , H01L2924/3512 , H01L2924/00012
摘要： A joint structure joins an electronic element 12 included in an electronic component to an electrode 14 included in that electronic component. The joint structure includes a solder layer, which contains 0.2 to 6% by weight of copper, 0.02 to 0.2% by weight of germanium and 93.8 to 99.78% by weight of bismuth, a nickel layer provided between the solder layer and the electrode, and a barrier layer provided between the nickel layer and the solder layer. Here, the barrier layer is formed so as to have an average thickness of from 0.5 to 4.5 μm after the electronic element and the electrode are joined by the solder layer.
摘要翻译：接合结构将包括在电子部件中的电子元件12与包括在该电子部件中的电极14连接。接头结构包括焊料层，其含有0.2〜6重量％的铜，0.02〜0.2重量％的锗和93.8〜99.78重量％的铋，设置在焊料层和电极之间的镍层，以及设置在镍层和焊料层之间的阻挡层。这里，在电子元件和电极通过焊料层接合之后，阻挡层形成为具有0.5至4.5μm的平均厚度。

9. 发明授权

US08414704B2 Bonding structure and semiconductor device manufacturing apparatus 有权
标题翻译：接合结构和半导体器件制造装置
公开(公告)号：US08414704B2
公开(公告)日：2013-04-09
申请号：US12349682
申请日：2009-01-07
申请人： Tomoyuki Fujii , Taichi Nakamura , Hiroshi Takebayashi
发明人： Tomoyuki Fujii , Taichi Nakamura , Hiroshi Takebayashi
IPC分类号： B32B37/00 , C23C16/00 , H01L21/306 , B23B31/28
CPC分类号： H01L21/67103 , C23C16/4586 , H01L21/6833 , Y10T279/23
摘要： The present invention relates to a bonding structure, including: a ceramic member including a hole; a terminal embedded in the ceramic member, an exposed surface exposed to a bottom portion of the hole, and made of a refractory metal having a thermal expansion coefficient substantially equal to a thermal expansion coefficient of the ceramic member; a brazed bond layer including a first tantalum layer in contact with the exposed surface of the terminal, a gold layer formed on the first tantalum layer, and a second tantalum layer formed on the gold layer; and a connecting member inserted in the hole, bonded to the terminal via the brazed bond layer, and made of a refractory metal having a thermal expansion coefficient substantially equal to the thermal expansion coefficient of the ceramic member.
摘要翻译：本发明涉及一种接合结构，包括：陶瓷构件，其包括孔; 嵌入在所述陶瓷构件中的端子，暴露于所述孔的底部的暴露表面，并且由具有基本上等于所述陶瓷构件的热膨胀系数的热膨胀系数的耐热金属制成; 包括与端子的暴露表面接触的第一钽层，形成在第一钽层上的金层和形成在金层上的第二钽层的钎焊接合层; 以及插入孔中的连接构件，其通过钎焊接合层接合到端子，并且由具有基本上等于陶瓷构件的热膨胀系数的热膨胀系数的难熔金属制成。

10. 外观设计

USD647549S1 Shaft portion of an apparatus for holding and heating semiconductor wafers or the like 有权
公开(公告)号：USD647549S1
公开(公告)日：2011-10-25
申请号：US29323537
申请日：2008-08-27
申请人： Taichi Nakamura
设计人： Taichi Nakamura

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