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    • 1. 发明授权
    • Dry etching method
    • 干蚀刻法
    • US5320708A
    • 1994-06-14
    • US825279
    • 1992-01-24
    • Shingo KadomuraMasakazu Muroyama
    • Shingo KadomuraMasakazu Muroyama
    • H01L21/302H01L21/3065H01L21/3105H01L21/311H01L21/321H01L21/768H01L21/00
    • H01L21/02063H01L21/3065H01L21/31051H01L21/31116H01L21/321H01L21/76819
    • A dry etching method by which the surface of a variety of materials constituting a semiconductor device may be planarized or smoothed under clean state. Small-sized recesses existing on the surface of a layer of the material to be etched are filled with deposited free sulfur yielded from sulfur halides, such as S.sub.2 F.sub.2 or S.sub.2 Cl.sub.2, into the plasma under conditions of dissociation produced by electrical discharge. After the surface of the material to be etched is planarized in this manner, etching is carried out under conditions of simultaneously removing the small-sized projections and deposited sulfur to successfully eliminate step differences or roughness on the material surface. Etching may alternatively be carried out under the condition of competition of filling of recesses with sulfur and removal of the projections. Sulfur may easily be removed on sublimation by heating the wafer after completion of etching without producing pollution by particles. The present invention may be applied to trimming of cross-sectional shape of the trenches or connection holes, surface smoothing of the WSi.sub.x layer formed by high temperature CVD or planarization of an interlayer insulating film used for covering the step differences.
    • 构成半导体器件的各种材料的表面可以在清洁状态下被平坦化或平滑化的干蚀刻方法。 存在于待蚀刻材料层表面上的小尺寸凹槽在由放电产生的解离的条件下填充由硫卤化物(例如S2F2或S2Cl2)产生的沉积的游离硫。 在被蚀刻材料的表面以这种方式平坦化后,在同时去除小尺寸突起和沉积硫的条件下进行蚀刻,以成功地消除材料表面上的步长差异或粗糙度。 蚀刻也可以在用硫填充凹槽的竞争和去除突起的条件下进行。 通过在蚀刻完成之后加热晶片而不会产生颗粒污染,可以在升华时容易地除去硫。 本发明可以用于修整沟槽或连接孔的横截面形状,通过高温CVD形成的WSix层的表面平滑化或用于覆盖台阶差的层间绝缘膜的平坦化。
    • 2. 发明申请
    • PHOTOELECTRIC CONVERSION DEVICE AND METHOD FOR MANUFACTURING THE SAME
    • 光电转换装置及其制造方法
    • US20130061923A1
    • 2013-03-14
    • US13698190
    • 2011-05-17
    • Masakazu MuroyamaKazuaki Fukushima
    • Masakazu MuroyamaKazuaki Fukushima
    • H01L31/0384H01L31/18
    • H01G9/2031H01G9/2059Y02E10/542
    • To provide a photoelectric conversion device having high conversion efficiency and a method for manufacturing the same. The photoelectric conversion device includes a working electrode that has a transparent electrode (2) and a porous metal oxide semiconductor layer (3) that is formed on a surface of the transparent electrode (2) and supported with a dye; a counter electrode (5); and an electrolyte layer (4), the hydroxyl group concentration on the surface of the oxide semiconductor layer is 0.01 groups/(nm)2 or more and 4.0 groups/(nm)2 or less, and the adsorbed water concentration on the surface thereof is 0.03 pieces/(nm)2 or more and 4.0 pieces/(nm)2 or less. The method for manufacturing a photoelectric conversion device includes a first step of forming a porous metal oxide semiconductor layer (3) on a surface of a transparent electrode (2), a second step of controlling the hydroxyl group concentration on the surface of the oxide semiconductor layer to be 0.01 groups/(nm)2 or more and 4.0 groups/(nm)2 or less and the adsorbed water concentration on the surface to be 0.03 pieces/nm2 or more and 4.0 pieces/(nm)2 or less by low temperature plasma processing under an oxidizing atmosphere, and a third step of supporting a dye in the oxide semiconductor layer.
    • 提供一种具有高转换效率的光电转换装置及其制造方法。 光电转换装置包括具有透明电极(2)和多孔金属氧化物半导体层(3)的工作电极,该多孔金属氧化物半导体层(3)形成在透明电极(2)的表面上并用染料支撑; 对电极(5); 和电解质层(4),氧化物半导体层表面的羟基浓度为0.01个/(nm)2〜4.0个/(nm)2以下,其表面吸附水浓度 为0.03个/(nm)2以上且4.0个/(nm)2以下)。 制造光电转换装置的方法包括在透明电极(2)的表面上形成多孔金属氧化物半导体层(3)的第一步骤,控制氧化物半导体的表面上的羟基浓度的第二步骤 层为0.01组/(nm)2以上且4.0团/(nm)2以下,表面的吸附水浓度为0.03个/ nm 2以上且4.0个/(nm)2以下) 在氧化气氛下进行高温等离子体处理,以及在氧化物半导体层中负载染料的第三工序。
    • 6. 发明授权
    • Polishing slurry and polishing method using the same
    • 抛光浆和抛光方法使用相同
    • US6126514A
    • 2000-10-03
    • US264690
    • 1999-03-09
    • Masakazu Muroyama
    • Masakazu Muroyama
    • B24B37/00C09G1/02C09K3/14H01L21/304B24D3/02
    • C09G1/02
    • A polishing slurry includes polishing abrasive grains and a polishing liquid containing at least one kind of a fatty acid and a fatty acid ester. The fatty acid is at least one kind selected from a group consisting of oleic acid, myristic acid, and stearic acid. The fatty acid ester is at least one kind selected from a group consisting of butyl stearate, hexyl stearate, heptyl stearate, butyl oleate, hexyl oleate, heptyl oleate, butyl myristate, hexyl myristate, and heptyl myristate. The polishing slurry is used for polishing a surface to be polished of a substance to be polished such as a wafer by bringing the surface to be polished into slide-contact with a polishing surface of a polishing plate mounted to a polishing table while supplying the polishing slurry on the polishing surface. The polishing slurry solves such a related art problem that upon CMP of an interlayer insulating film having a step, a polishing pressure applied to a lower portion of the step becomes equal to that applied to an upper portion of the step, to make the polishing rate at the lower portion of the step nearly equal to that at the upper portion of the step, thereby making it difficult to flatly polish the interlayer insulating film.
    • 抛光浆料包括抛光磨粒和含有至少一种脂肪酸和脂肪酸酯的抛光液。 脂肪酸是选自油酸,肉豆蔻酸和硬脂酸中的至少一种。 脂肪酸酯是选自硬脂酸丁酯,硬脂酸己酯,油酸辛酯,油酸丁酯,油酸庚酯,肉豆蔻酸丁酯,肉豆蔻酸己酯和肉豆蔻酸庚酯中的至少一种。 抛光浆料用于通过使抛光表面与抛光板的抛光表面滑动接触来抛光待研磨物质的抛光表面,同时提供抛光 浆料在抛光面上。 抛光浆料解决了这样的现有技术问题:在具有台阶的层间绝缘膜的CMP上,施加到台阶的下部的研磨压力等于施加到台阶的上部的研磨压力,以使抛光速率 在步骤的下部几乎等于台阶的上部,从而难以平坦地抛光层间绝缘膜。