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    • 7. 发明授权
    • Heat-treating furnace
    • 热处理炉
    • US08696350B2
    • 2014-04-15
    • US12235952
    • 2008-09-23
    • Takashi Ohara
    • Takashi Ohara
    • F27D1/00
    • F27B17/0016B22F3/003B22F2998/00B32B18/00C04B35/638C04B35/64F27B17/0075F27D1/0006H05K1/0306H05K3/4611H05K3/4629B22F3/1021
    • A heat treating furnace capable of continuously performing binder removal and subsequent firing without requiring a complicated configuration and increasing the equipment size and cost, for example, for degreasing a ceramic molding which is to be fired in a process for manufacturing a ceramic electronic component. A heat insulator is disposed to surround a heat treatment region in a case, and a reflector is disposed between the inner wall of the case and the insulator in order to reflect heat transferred from the heat treatment region through the heat insulator. A module heater including a heater embedded in the insulator is used. As the reflector, there is used a reflector having a structure in which a plurality of thin plates is arranged so that the main surfaces are arranged in parallel to each other with a predetermined space between the adjacent main surfaces.
    • 一种能够连续进行粘合剂除去和随后的烧制而不需要复杂的构造并增加设备尺寸和成本的热处理炉,例如用于在用于制造陶瓷电子部件的方法中焙烧的陶瓷模制品的脱脂。 为了将来自热处理区域的热量传递通过隔热体,在壳体的内壁和绝缘体的内壁之间设置有围绕热处理区域的隔热体。 使用包括嵌入在绝缘体中的加热器的模块加热器。 作为反射器,使用具有多个薄板布置的结构的反射器,使得主表面以相邻的主表面之间的预定间隔彼此平行地布置。