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1. 发明申请

US20110019335A1 CAPACITOR STRUCTURE 有权
标题翻译：电容结构
公开(公告)号：US20110019335A1
公开(公告)日：2011-01-27
申请号：US12841456
申请日：2010-07-22
申请人： Shih-Hsien WU , Min-Lin LEE , Shinn-Juh LAI , Shur-Fen LIU , Meng-Hua CHEN , Chin-Hsien HUNG
发明人： Shih-Hsien WU , Min-Lin LEE , Shinn-Juh LAI , Shur-Fen LIU , Meng-Hua CHEN , Chin-Hsien HUNG
IPC分类号： H01G4/005
CPC分类号： H01G4/005
摘要： The disclosure provides a capacitor structure. A first dielectric layer is disposed over the first electrode layer. A second electrode layer is disposed over the first dielectric layer. At least one of the first electrode layer and the second electrode layer has a peak-valley like structure to create at least two different gap distances therebetween, thereby providing parallel combinations of at least two different capacitances.
摘要翻译：本公开提供一种电容器结构。第一电介质层设置在第一电极层上。第二电极层设置在第一介电层上。第一电极层和第二电极层中的至少一个具有峰谷状结构，以在它们之间产生至少两个不同的间隙距离，从而提供至少两个不同电容的并联组合。

2. 发明申请

US20080266750A1 Capacitor Devices 有权
标题翻译：电容器件
公开(公告)号：US20080266750A1
公开(公告)日：2008-10-30
申请号：US11844280
申请日：2007-08-23
申请人： Shih-Hsien WU , Shinn-Juh LAI , Min-Lin LEE , Shur-Fen LIU
发明人： Shih-Hsien WU , Shinn-Juh LAI , Min-Lin LEE , Shur-Fen LIU
IPC分类号： H01G4/06 , H01G9/00
CPC分类号： H01G4/06 , H01G4/12 , H01G4/1227 , H01G4/14 , H01G4/20 , H01G4/206 , H05K1/162 , H05K3/4611 , H05K2201/0187 , H05K2201/0195 , H05K2201/09672 , H05K2201/2036 , Y10T29/417
摘要： A capacitor device with a capacitance is introduced. The capacitor device includes at least one capacitive element. The at least capacitive element comprises a pair of first conductive layers being opposed to each other, at least one first dielectric layer formed on a surface of at least one of the first conductive layers, and a second dielectric layer being sandwiched between the first conductive layers. The first dielectric layer has a first dielectric constant and the second dielectric layer has a second dielectric constant. The capacitance of the capacitor device depends on dielectric parameters of the first dielectric layer and the second dielectric layer. The dielectric parameters comprise the first dielectric constant and thickness of the at least one first dielectric layer and the second dielectric constant and thickness of the second dielectric layer.
摘要翻译：引入具有电容的电容器件。电容器装置包括至少一个电容元件。所述至少电容元件包括彼此相对的一对第一导电层，至少一个形成在所述第一导电层中的至少一个的表面上的第一电介质层，以及夹在所述第一导电层。第一介电层具有第一介电常数，第二介电层具有第二介电常数。电容器器件的电容取决于第一介电层和第二介电层的介电参数。介电参数包括第一介电常数和至少一个第一介电层的厚度和第二介电常数和第二介电层的厚度。

3. 发明申请

US20090107717A1 ELECTRICALLY CONDUCTIVE STRUCTURE OF CIRCUIT BOARD AND CIRCUIT BOARD USING THE SAME 有权
标题翻译：使用电路板和电路板的电导体结构
公开(公告)号：US20090107717A1
公开(公告)日：2009-04-30
申请号：US12181330
申请日：2008-07-29
申请人： Chien-Min Hsu , Shih-Hsien Wu , Shinn-Juh LAI , Min-Lin LEE
发明人： Chien-Min Hsu , Shih-Hsien Wu , Shinn-Juh LAI , Min-Lin LEE
IPC分类号： H05K1/11
CPC分类号： H05K1/112 , H01L2224/05568 , H01L2224/05573 , H01L2224/16225 , H01L2924/00014 , H05K1/0228 , H05K1/0231 , H05K1/0263 , H05K1/162 , H05K1/185 , H05K3/429 , H05K3/4602 , H05K2201/09245 , H05K2201/09627 , H05K2201/09709 , H05K2201/10734 , H01L2224/05599
摘要： An electrically conductive structure includes a first conductive structure and a second conductive structure. Each has a conducting section at one end and a coupling section at the other end. The first and second conducting sections are electrically connected to a power and ground contact of an electronic device, respectively. The first and second coupling sections are respectively connected with power and ground layer of a circuit board. The first coupling sections are connected with the first conducting section through first extending sections and the second coupling sections are connected with the second conducting section through second extending sections. At least two coupling sections of the conductive structures are arranged in pairs. The first conductive structure and the second conductive structure are arranged in a staggered array to form two wiring loops having opposite current directions, thereby generating a magnetic flux cancellation effect.
摘要翻译：导电结构包括第一导电结构和第二导电结构。每个在一端具有导电部分，另一端具有耦合部分。第一和第二导电部分分别电连接到电子设备的电源和接地触点。第一和第二耦合部分分别与电路板的电源层和接地层连接。第一耦合部分通过第一延伸部分与第一导电部分连接，第二耦合部分通过第二延伸部分与第二导电部分连接。导电结构的至少两个耦合部分成对布置。第一导电结构和第二导电结构以交错阵列布置以形成具有相反电流方向的两个布线环，从而产生磁通消除效果。

4. 发明申请

US20080239622A1 WIRING STRUCTURE OF LAMINATED CAPACITORS 有权
标题翻译：层压电容器接线结构
公开(公告)号：US20080239622A1
公开(公告)日：2008-10-02
申请号：US11950381
申请日：2007-12-04
申请人： Chien-Min HSU , Shih-Hsien WU , Min-Lin LEE , Shinn-Juh LAI
发明人： Chien-Min HSU , Shih-Hsien WU , Min-Lin LEE , Shinn-Juh LAI
IPC分类号： H01G4/236 , H05K1/16
CPC分类号： H05K1/162 , H01L2224/16225 , H01L2924/00011 , H01L2924/00014 , H05K1/112 , H05K3/429 , H05K3/4688 , H05K2201/0792 , H05K2201/09309 , H05K2201/09536 , H05K2201/09636 , H05K2201/10734 , H01L2224/0401
摘要： The present invention relates to a wiring structure for reducing the equivalent series inductance (ESL) of a laminated capacitor. The laminated capacitor comprises a number of conductive layers, a power via extending along a thickness direction of the laminated capacitor and arranged to extend from the top conductive layer to the bottom conductive layer, and a ground via extending along the thickness direction of the laminated capacitor and arranged to extend from the top conductive layer to the bottom conductive layer. The conductive layers include a set of first conductive layers and a set of second conductive layers. The power via is electrically coupled to the first conductive layers and the ground via is electrically coupled to the second conductive layers. The laminated capacitor further comprises a supplemental via between the power via and the ground via. The supplemental via is shorter in length than the power via and the ground via. The supplemental via is electrically coupled to one of the first conductive layers and the second conductive layer.
摘要翻译：本发明涉及一种用于降低层叠电容器的等效串联电感（ESL）的布线结构。层叠电容器包括多个导电层，沿层叠电容器的厚度方向延伸的电力通孔，并且从顶部导电层延伸至底部导电层，沿着层叠电容器的厚度方向延伸的接地通孔并布置成从顶部导电层延伸到底部导电层。导电层包括一组第一导电层和一组第二导电层。电源通孔电耦合到第一导电层，并且接地通孔电耦合到第二导电层。层叠电容器还包括电源通孔和接地通孔之间的补充通路。补充通孔的长度要短于电源通孔和接地通孔。辅助通孔电耦合到第一导电层和第二导电层之一。

5. 发明申请

US20070062725A1 EMBEDDED CAPACITOR CORE HAVING A MULTIPLE-LAYER STRUCTURE 有权
标题翻译：嵌入式电容器芯具有多层结构
公开(公告)号：US20070062725A1
公开(公告)日：2007-03-22
申请号：US11470435
申请日：2006-09-06
申请人： Shih-Hsien WU , Min-Lin LEE , Shinn-Juh LAY , Chi-Hao CHANG
发明人： Shih-Hsien WU , Min-Lin LEE , Shinn-Juh LAY , Chi-Hao CHANG
IPC分类号： H05K1/16 , H01G4/20 , H01G7/00
CPC分类号： H05K1/162 , H05K3/4611 , H05K2201/0209 , H05K2201/09309 , Y10T29/43 , Y10T29/49126
摘要： An embedded capacitor core includes a first set of capacitors, a second set of capacitors, and an inter-layer dielectric film between the first set of capacitors and the second set of capacitors. The first set of capacitors includes: a first conductive pattern comprising at least two conductive electrodes; a second conductive pattern comprising at least two conductive electrodes corresponding to the two conductive electrodes of the first conductive pattern; and a first dielectric film between the first conductive pattern and the second conductive pattern. The second set of capacitors includes: a third conductive pattern comprising at least two conductive electrodes; a fourth conductive pattern comprising at least two conductive electrodes corresponding to the two conductive electrodes of the fourth conductive pattern; and a second dielectric film between the third conductive pattern and the fourth conductive pattern.
摘要翻译：嵌入式电容器芯包括第一组电容器，第二组电容器和在第一组电容器和第二组电容器之间的层间电介质膜。第一组电容器包括：包括至少两个导电电极的第一导电图案; 第二导电图案，包括对应于第一导电图案的两个导电电极的至少两个导电电极; 以及在第一导电图案和第二导电图案之间的第一电介质膜。第二组电容器包括：包括至少两个导电电极的第三导电图案; 第四导电图案，包括对应于第四导电图案的两个导电电极的至少两个导电电极; 以及在第三导电图案和第四导电图案之间的第二电介质膜。

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