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1. 发明申请

US20190245308A1 TELECOMMUNICATIONS DEVICE 审中-公开
公开(公告)号：US20190245308A1
公开(公告)日：2019-08-08
申请号：US16241422
申请日：2019-01-07
申请人： CommScope Technologies LLC
发明人： Bernard Harold Hammond, JR. , David Patrick Murray , Ian Robert George
IPC分类号： H01R13/6466 , H01R24/64 , H01R4/2416 , H01R13/66 , H01R13/719 , H05K1/02
CPC分类号： H01R13/6466 , H01R4/2416 , H01R13/6658 , H01R13/719 , H01R24/64 , H01R2107/00 , H05K1/0228 , H05K1/162 , H05K3/4644 , H05K2201/09236 , H05K2201/09245 , H05K2201/09263 , H05K2201/10189 , Y10S439/941 , Y10T29/49117 , Y10T29/49204 , Y10T29/49222
摘要： The present disclosure relates to a telecommunications jack including a housing having a port for receiving a plug. The jack also includes a plurality of contact springs adapted to make electrical contact with the plug when the plug is inserted into the port of the housing, and a plurality of wire termination contacts for terminating wires to the jack. The jack further includes a circuit board that electrically connects the contact springs to the wire termination contacts. The circuit board includes a multi-zone crosstalk compensation arrangement for reducing crosstalk at the jack.

2. 发明授权

US09916050B2 Display apparatus 有权
公开(公告)号：US09916050B2
公开(公告)日：2018-03-13
申请号：US14704181
申请日：2015-05-05
申请人： Japan Display Inc.
发明人： Masanobu Ikeda , Koji Ishizaki , Hayato Kurasawa
IPC分类号： G06F3/041 , G06F3/044 , H05K1/02
CPC分类号： G06F3/044 , G06F3/041 , G06F3/0412 , G06F3/0416 , G06F2203/04112 , H05K1/0298 , H05K2201/09245 , H05K2201/10128 , H05K2201/10166
摘要： [PROBLEM] To reduce a time constant of an electric circuit including driving electrodes and detecting electrodes in a display provided with an input device, and reduce a temperature variation ratio of the time constant.[SOLVING MEANS] The display 1 includes driving electrodes COML provided along an X axis direction when seen in a plan view, buffer TFT elements Trb serially connected to the driving electrodes COML, and a plurality of detecting electrodes TDL respectively provided to intersect with the driving electrodes COML when seen in a plan view and aligned in the X axis direction. A temperature coefficient of resistance of a sum of an ON resistance of the buffer TFT elements Trb and a resistance of the driving electrodes COML is negative, each of the specific resistances of the plurality of detecting electrodes TDL is not more than 40 μΩcm, and each of the temperature coefficients of resistance of the plurality of detecting electrodes TDL is 1×10−3 to 5×10−3K−1.

3. 发明授权

US09844145B2 Strain isolation structures for stretchable electronics 有权
公开(公告)号：US09844145B2
公开(公告)日：2017-12-12
申请号：US15194995
申请日：2016-06-28
申请人： MC10, Inc.
发明人： Yung-Yu Hsu
IPC分类号： H05K7/00 , H05K1/18 , H05K1/03 , H05K1/11 , H05K1/02 , H05K1/09 , H01R9/00 , H05K3/46 , H05K1/14
CPC分类号： H05K1/185 , H05K1/0271 , H05K1/028 , H05K1/0283 , H05K1/036 , H05K1/0393 , H05K1/09 , H05K1/118 , H05K1/147 , H05K1/148 , H05K1/189 , H05K3/4691 , H05K3/4694 , H05K2201/0133 , H05K2201/0154 , H05K2201/0187 , H05K2201/09245 , H05K2201/1028 , H05K2201/10287 , H05K2201/2009
摘要： Buffer structures are provided that can be used to reduce a strain in a conformable electronic system that includes compliant components in electrical communication with more rigid device components. The buffer structures are disposed on, or at least partially embedded in, the conformable electronic system such that the buffer structures overlap with at least a portion of a junction region between a compliant component and a more rigid device component. The buffer structure can have a higher value of Young's modulus than an encapsulant of the conformable electronic system.

4. 发明授权

US09439283B2 Conductive sheet 有权
标题翻译：导电片
公开(公告)号：US09439283B2
公开(公告)日：2016-09-06
申请号：US14703072
申请日：2015-05-04
申请人： FUJIFILM Corporation
发明人： Tadashi Kuriki
IPC分类号： H03K17/975 , H05K1/02 , G06F3/044
CPC分类号： G06F3/044 , G06F2203/04103 , G06F2203/04112 , H05K1/0298 , H05K2201/09245
摘要： Disclosed are a conductive sheet, a usage method of the conductive sheet and a capacitive type touch panel. For a first conductive sheet, two or more conductive first large grids are formed atop a first transparent base, wherein each first large grid is constituted by combining two or more small grids, and the shapes of facing sides of each first large grid are formed to alternate. For example, rectangular waveshapes of a first side portion of the first large grid and of a fourth side portion facing the first side portion are made to alternate, and rectangular waveshapes of a second side portion of the first large grid and of a third side portion facing the second side portion are made to alternate.
摘要翻译：公开了导电片，导电片和电容式触摸面板的使用方法。对于第一导电片，在第一透明基底顶部形成有两个或多个导电的第一大栅格，其中每个第一大栅格通过组合两个或更多个小栅格构成，并且每个第一大栅格的相对侧的形状形成为备用。例如，使第一大格栅的第一侧部分和面向第一侧部分的第四侧部分的矩形波形彼此交替，并且第一大格栅的第二侧部分和第三侧部分的矩形波形面对第二侧部分是交替的。

5. 发明申请

US20160147374A1 DISPLAY DEVICE WITH TOUCH PANEL HAVING X, Y AND DUMMY ELECTRODES 审中-公开
公开(公告)号：US20160147374A1
公开(公告)日：2016-05-26
申请号：US15010744
申请日：2016-01-29
申请人： Japan Display Inc. , Panasonic Liquid Crystal Display Co., Ltd.
发明人： Shinya HASHIMOTO
IPC分类号： G06F3/041 , H05K1/02 , H05K1/11 , G06F3/044
CPC分类号： G06F3/0416 , G02F1/133345 , G02F1/13338 , G02F1/13439 , G06F1/16 , G06F3/0412 , G06F3/0418 , G06F3/044 , G06F2203/04103 , G06F2203/04107 , G06F2203/04111 , H05K1/0216 , H05K1/11 , H05K1/118 , H05K3/361 , H05K2201/09245 , H05K2201/09254
摘要： A display device includes a display panel, and an electrostatic capacitive type touch panel which is formed in an overlapping manner with the display panel. A plurality of X electrodes and a plurality of Y electrodes intersecting with the X electrodes. A first signal line supplies signals to the X electrodes, a second signal line supplies signals to the Y electrodes, and the first signal line and the second signal line are formed on a flexible printed circuit board. A dummy electrode is formed adjacent to an electrode portion of each X electrode and electrode portion of each Y electrode, the dummy electrode does not overlap the X electrode and the Y electrode, and the dummy electrode does not electrically connect with the first and second signal lines.

6. 发明授权

US09288893B2 Implementations of twisted differential pairs on a circuit board 有权
标题翻译：电路板上扭曲差分对的实现
公开(公告)号：US09288893B2
公开(公告)日：2016-03-15
申请号：US12537430
申请日：2009-08-07
申请人： Sampath Komarapalayam Velayudham Karikalan
发明人： Sampath Komarapalayam Velayudham Karikalan
IPC分类号： H05K1/00 , H05K3/10 , H05K1/02
CPC分类号： H05K1/0245 , H05K2201/09245 , H05K2201/097 , Y10T29/49155
摘要： A twisted differential conductor pair is formed on a circuit board that includes first-third conductors. The second conductor includes first-third portions. The second portion of the second conductor extends between an end of the first conductor and an end of the third conductor, and couples an end of the first portion of the second conductor to an end of the third portion of the second conductor. A solder mask layer is formed over the first, second, and third conductors on the circuit board. An end of the first conductor and the end of the third conductor are exposed through the solder mask layer. The exposed end of the first conductor is coupled to the exposed end of the third conductor over the solder mask layer with a bridge. This configuration may be repeated to create multiple twists along the twisted differential conductor pair.
摘要翻译：在包括第一至第三导体的电路板上形成扭曲的差分导体对。第二导体包括第一第三部分。第二导体的第二部分在第一导体的端部和第三导体的端部之间延伸，并且将第二导体的第一部分的端部耦合到第二导体的第三部分的端部。在电路板上的第一，第二和第三导体上形成焊接掩模层。第一导体的一端和第三导体的端部通过焊接掩模层露出。第一导体的暴露端通过桥接在焊料掩模层上与第三导体的暴露端耦合。可以重复该配置以沿着扭曲的差分导体对产生多个扭曲。

7. 发明授权

US09282632B2 Multilayer circuit substrate 有权
标题翻译：多层电路基板
公开(公告)号：US09282632B2
公开(公告)日：2016-03-08
申请号：US13861907
申请日：2013-04-12
申请人： TAIYO YUDEN CO., LTD.
发明人： Tetsuo Saji , Hiroshi Nakamura
IPC分类号： H05K1/18 , H05K1/02 , H01P3/08 , H05K3/46
CPC分类号： H05K1/0253 , H01P3/088 , H05K1/0227 , H05K1/185 , H05K3/4602 , H05K2201/09245 , H05K2201/09336 , H05K2201/09727
摘要： A multilayer circuit substrate includes: a first conductor layer in which first transmission lines and a second transmission line are formed; a second conductive layer facing the first conductive layer through an insulating layer; and a third conductive layer that faces the second conductive layer through an insulating layer and that has a bypass line formed therein. The bypass line is electrically connected to the second transmission line of the first conductive layer through via conductors and such that the second transmission line and the first transmission lines intersect with each other. In the second conductive layer, a ground conductor is formed at least in a position that faces the bypass line, and the first transmission lines are made narrower at the intersection with the second transmission line than other portions.
摘要翻译：多层电路基板包括：第一导体层，其中形成有第一传输线和第二传输线; 通过绝缘层面对所述第一导电层的第二导电层; 以及通过绝缘层面向所述第二导电层并且在其中形成有旁路线的第三导电层。旁通线路通过通孔导体与第一导电层的第二传输线电连接，使得第二传输线与第一传输线相互交叉。在第二导电层中，至少形成面向旁路线的位置的接地导体，并且使第一传输线在与第二传输线的交点处比其它部分更窄。

8. 发明授权

US09247637B2 Strain relief structures for stretchable interconnects 有权
标题翻译：用于伸缩互连的应变消除结构
公开(公告)号：US09247637B2
公开(公告)日：2016-01-26
申请号：US13843880
申请日：2013-03-15
申请人： MC10, Inc.
发明人： Yung-Yu Hsu
IPC分类号： H05K1/02
CPC分类号： H05K1/0271 , A61B2562/164 , A61B2562/166 , A61B2562/225 , H05K1/0283 , H05K2201/09245
摘要： Intersection structures are provided to reduce a strain in a conformable electronic system that includes multi-level arrangements of stretchable interconnect structures. Bypass regions are formed in areas of the stretchable interconnect structures that may ordinarily cross or pass each other. The bypass regions of the stretchable interconnects are disposed relative to each other such that the intersection structure encompasses at least a portion of the bypass regions of each stretchable interconnect structure. The intersection structure has elastic properties that relieve a mechanical strain on the bypass regions during stretching at least one of the stretchable interconnect structures.
摘要翻译：提供交叉结构以减少包括可拉伸互连结构的多层布置的一致的电子系统中的应变。旁路区域形成在通常可以彼此交叉或通过的可拉伸互连结构的区域中。可拉伸互连的旁路区域相对于彼此设置，使得交叉结构包含每个可拉伸互连结构的旁路区域的至少一部分。交叉结构具有弹性特性，其可在拉伸至少一个可拉伸互连结构的同时减轻旁路区域上的机械应变。

9. 发明申请

US20150382450A1 TRANSMISSION LINE STRUCTURE 有权
标题翻译：传输线结构
公开(公告)号：US20150382450A1
公开(公告)日：2015-12-31
申请号：US14461074
申请日：2014-08-15
申请人： Chung Yuan Christian University
发明人： Guang-Hwa SHIUE
IPC分类号： H05K1/02 , H01P3/08
CPC分类号： H01P3/088 , H01P3/026 , H01P3/08 , H01P5/028 , H05K1/0228 , H05K1/0245 , H05K2201/09245 , H05K2201/09727
摘要： A transmission line structure emplaces at a substrate which includes a first layout layer, a first dielectric layer, a second dielectric layer, a second dielectric layer, and a grounding layer includes a first transmission line pair and at least one second transmission line. The first transmission line pair is set on the first layout layer. The second transmission line is set on the second layout layer. A line of first transmission line pair and a line of the second transmission line cross each other and form a crossing area. A width of the line is narrow. A distance between the first transmission line pair and the second transmission line at the crossing area is less than a distance at an outstanding area.
摘要翻译：传输线结构放置在包括第一布局层，第一介电层，第二介电层，第二介电层的基板处，并且接地层包括第一传输线对和至少一个第二传输线。第一传输线对设置在第一布局层上。第二传输线设置在第二布局层上。一条第一传输线对和第二条传输线的一条线彼此交叉并形成一个交叉区域。线的宽度窄。交叉区域的第一传输线对和第二传输线之间的距离小于突出区域的距离。

10. 发明授权

US09226402B2 Strain isolation structures for stretchable electronics 有权
标题翻译：可拉伸电子元件的应变隔离结构
公开(公告)号：US09226402B2
公开(公告)日：2015-12-29
申请号：US13843873
申请日：2013-03-15
申请人： MC10, Inc.
发明人： Yung-Yu Hsu
IPC分类号： H05K1/16 , H05K1/18 , H05K1/03 , H05K1/11 , H05K1/00 , H05K7/00 , H05K5/00 , H01L23/28 , H05K1/09 , H05K1/02 , H05K3/46
CPC分类号： H05K1/185 , H05K1/0271 , H05K1/028 , H05K1/0283 , H05K1/036 , H05K1/0393 , H05K1/09 , H05K1/118 , H05K1/147 , H05K1/148 , H05K1/189 , H05K3/4691 , H05K3/4694 , H05K2201/0133 , H05K2201/0154 , H05K2201/0187 , H05K2201/09245 , H05K2201/1028 , H05K2201/10287 , H05K2201/2009
摘要： Buffer structures are provided that can be used to reduce a strain in a conformable electronic system that includes compliant components in electrical communication with more rigid device components. The buffer structures are disposed on, or at least partially embedded in, the conformable electronic system such that the buffer structures overlap with at least a portion of a junction region between a compliant component and a more rigid device component. The buffer structure can have a higher value of Young's modulus than an encapsulant of the conformable electronic system.
摘要翻译：提供缓冲结构，其可以用于减少适应电子系统中的应变，其包括与更刚性的装置部件电连通的顺应部件。缓冲结构设置在适配电子系统上或至少部分嵌入适配电子系统中，使得缓冲结构与柔顺部件和更刚性的器件部件之间的连接区域的至少一部分重叠。缓冲结构可以具有比适形电子系统的密封剂更高的杨氏模量值。

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