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    • 1. 发明授权
    • Aligning method utilizing reliability weighting coefficients
    • 利用可靠性加权系数对齐方法
    • US5543921A
    • 1996-08-06
    • US465098
    • 1995-06-05
    • Shigeyuki UzawaAkiya NakaiMasaaki ImaizumiHiroshi TanakaNoburu TakakuraYoshio Kaneko
    • Shigeyuki UzawaAkiya NakaiMasaaki ImaizumiHiroshi TanakaNoburu TakakuraYoshio Kaneko
    • G03F9/00G01B11/00
    • G03F9/7088G03F9/7003G03F9/7092
    • An aligning method suitably usable in a semiconductor device manufacturing exposure apparatus of step-and-repeat type, for sequentially positioning regions on a wafer to an exposure position. In one preferred form, the marks provided on selected regions of the wafer are detected to obtain corresponding mark signals and then respective positional data related to the positions or positional errors of the selected regions are measured, on the basis of the mark signals. Then, the reliability of each measured positional data of a corresponding selected region is detected, on the basis of the state of a corresponding mark signal or the state of that measured positional data and by using fuzzy reasoning, for example. Corrected positional data related to the disposition of all the regions on the wafer is then prepared by using the measured positional data of the selected regions, wherein, for preparation of the corrected positional data, each measured positional data is weighted in accordance with the detected reliability thereof such that measured positional data having higher reliability is more influential to determine the corrected positional data.
    • 适用于步进重复类型的半导体器件制造曝光设备中的对准方法,用于将晶片上的区域顺序地定位到曝光位置。 在一个优选形式中,检测提供在晶片的选定区域上的标记以获得对应的标记信号,然后基于标记信号测量与所选区域的位置或位置误差相关的各个位置数据。 然后,基于对应的标记信号的状态或测量的位置数据的状态,并通过使用模糊推理来检测对应的选择区域的每个测量位置数据的可靠性。 然后通过使用测量的所选择的区域的位置数据来准备与晶片上的所有区域的配置相关的位置数据,其中,为了准备校正的位置数据,根据检测到的可靠性对每个测量的位置数据进行加权 使得具有较高可靠性的测量位置数据对确定校正的位置数据更有影响力。
    • 2. 发明授权
    • Aligning method
    • 对齐方式
    • US06333786B1
    • 2001-12-25
    • US08139059
    • 1993-10-21
    • Shigeyuki UzawaAkiya NakaiMasaaki ImaizumiHiroshi TanakaNoburu TakakuraYoshio Kaneko
    • Shigeyuki UzawaAkiya NakaiMasaaki ImaizumiHiroshi TanakaNoburu TakakuraYoshio Kaneko
    • G01B1100
    • G03F9/7092G03F9/7003G03F9/7088
    • An aligning method suitably usable in a semiconductor device manufacturing exposure apparatus of step-and-repeat type, for sequentially positioning regions on a wafer to an exposure position. In one preferred form, the marks provided on selected regions of the wafer are detected to obtain corresponding mark signals and then respective positional data related to the positions or positional errors of the selected regions are measured, on the basis of the mark signals. Then, the reliability of each measured positional data of a corresponding selected region is detected, on the basis of the state of a corresponding mark signal or the state of that measured positional data and by using fuzzy reasoning, for example. Corrected positional data related to the disposition of all the regions on the wafer is then prepared by using the measured positional data of the selected regions, wherein, for preparation of the corrected positional data, each measured positional data is weighted in accordance with the detected reliability thereof such that measured positional data having higher reliability is more influential to determine of the corrected positional data. For sequential positioning of the regions on the wafer to the exposure position, the wafer movement is controlled on the basis of the prepared corrected positional data, whereby high-precision alignment of each region is assured.
    • 适用于步进重复类型的半导体器件制造曝光设备中的对准方法,用于将晶片上的区域顺序地定位到曝光位置。 在一个优选形式中,检测提供在晶片的选定区域上的标记以获得对应的标记信号,然后基于标记信号测量与所选区域的位置或位置误差相关的各个位置数据。 然后,基于对应的标记信号的状态或测量的位置数据的状态,并通过使用模糊推理来检测对应的选择区域的每个测量位置数据的可靠性。 然后通过使用测量的所选择的区域的位置数据来准备与晶片上的所有区域的配置相关的位置数据,其中,为了准备校正的位置数据,根据检测到的可靠性对每个测量的位置数据进行加权 使得具有较高可靠性的测量位置数据对确定校正的位置数据更有影响力。 为了将晶片上的区域顺序定位到曝光位置,基于准备的校正位置数据来控制晶片移动,从而确保每个区域的高精度对准。
    • 3. 发明授权
    • Aligning method
    • 对齐方式
    • US6097495A
    • 2000-08-01
    • US102752
    • 1998-06-23
    • Shigeyuki UzawaAkiya NakaiMasaaki ImaizumiHiroshi TanakaNoburu TakakuraYoshio Kaneko
    • Shigeyuki UzawaAkiya NakaiMasaaki ImaizumiHiroshi TanakaNoburu TakakuraYoshio Kaneko
    • G03F9/00G01B11/00
    • G03F9/7088G03F9/7003G03F9/7092
    • An aligning method suitably usable in a semiconductor device manufacturing exposure apparatus of step-and-repeat type, for sequentially positioning regions on a wafer to an exposure position. In one preferred form, the marks provided on selected regions of the wafer are detected to obtain corresponding mark signals and then respective positional data related to the positions or positional errors of the selected regions are measured, on the basis of the mark signals. Then, the reliability of each measured positional data of a corresponding selected region is detected, on the basis of the state of a corresponding mark signal or the state of that measured positional data and by using fuzzy reasoning, for example. Corrected positional data related to the disposition of all the regions on the wafer is then prepared by using the measured positional data of the selected regions, wherein, for preparation of the corrected positional data, each measured positional data is weighted in accordance with the detected reliability thereof such that measured positional data having higher reliability is more influential to determine the corrected positional data. For sequential positioning of the regions on the wafer to the exposure position, the wafer movement is controlled on the basis of the prepared corrected positional data, whereby high-precision alignment of each region is assured.
    • 适用于步进重复类型的半导体器件制造曝光设备中的对准方法,用于将晶片上的区域顺序地定位到曝光位置。 在一个优选形式中,检测提供在晶片的选定区域上的标记以获得对应的标记信号,然后基于标记信号测量与所选区域的位置或位置误差相关的各个位置数据。 然后,基于对应的标记信号的状态或测量的位置数据的状态,并通过使用模糊推理来检测对应的选择区域的每个测量位置数据的可靠性。 然后通过使用测量的所选择的区域的位置数据来准备与晶片上的所有区域的配置相关的位置数据,其中,为了准备校正的位置数据,根据检测到的可靠性对每个测量的位置数据进行加权 使得具有较高可靠性的测量位置数据对确定校正的位置数据更有影响力。 为了将晶片上的区域顺序定位到曝光位置,基于准备的校正位置数据来控制晶片移动,从而确保每个区域的高精度对准。
    • 8. 发明授权
    • Substrate processing apparatus and substrate processing method
    • 基板加工装置及基板处理方法
    • US09070549B2
    • 2015-06-30
    • US12680799
    • 2008-09-22
    • Hiroshi TanakaToshiyuki ShiokawaTakao Inada
    • Hiroshi TanakaToshiyuki ShiokawaTakao Inada
    • B08B5/02H01L21/02H01L21/67
    • H01L21/02052H01L21/67028
    • A drying gas is supplied into a drying chamber in a substantially horizontal direction, an obliquely downward direction descendent from the substantially horizontal direction, or a vertically downward direction under a state where a wafer is immersed in a cleaning liquid in a cleaning tank. The wafer is moved from the cleaning tank into the drying chamber, with the drying gas being supplied into the drying chamber. At this time, the supply of the drying gas into the drying chamber is stopped, under a condition where a part of the wafer is immersed in the cleaning liquid stored in the cleaning tank. After the movement of the wafer into the drying chamber has been finished, a drying gas is supplied into the drying chamber in an obliquely upward direction ascendant from the substantially horizontal direction or a vertically upward direction.
    • 在将晶片浸入清洗槽中的清洗液体的状态下,将干燥气体从大致水平方向或垂直向下方向向大致水平方向,倾斜向下方向供给到干燥室。 将晶片从清洁槽移动到干燥室中,其中干燥气体被供应到干燥室中。 此时,在将晶片的一部分浸渍在存储在清洗槽中的清洗液中的状态下,将干燥气体供给到干燥室内停止。 在将晶片移动到干燥室中之后,干燥气体从大致水平方向或垂直向上方向上升的斜上方向供给干燥室。