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    • 7. 发明申请
    • SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
    • 半导体器件及制造半导体器件的方法
    • US20080073699A1
    • 2008-03-27
    • US11689157
    • 2007-03-21
    • Kazuhito NishitaniHidehiko Yabuhara
    • Kazuhito NishitaniHidehiko Yabuhara
    • H01L29/788H01L21/336
    • H01L29/40114
    • A method for manufacturing a semiconductor device includes: forming a first film on a base body; crystallizing the first film by heating; thinning the crystallized first film; and forming a second film on the thinned first film. The first film is made of a material having a high dielectric constant than silicon oxide. A semiconductor device includes: a silicon substrate; a tunnel insulating film provided on the silicon substrate; a floating gate electrode provided on the tunnel insulating film; a polycrystalline insulating film provided on the floating gate electrode; and a control gate electrode provided on the polycrystalline insulating film. The polycrystalline insulating film has a high dielectric constant than silicon oxide, and the polycrystalline insulating film is made of crystal grains which are substantially monocrystalline in a film thickness direction
    • 一种制造半导体器件的方法包括:在基体上形成第一膜; 通过加热使第一膜结晶; 使结晶的第一层薄膜变薄; 以及在所述薄化的第一膜上形成第二膜。 第一膜由具有高氧化硅介电常数的材料制成。 半导体器件包括:硅衬底; 设置在硅基板上的隧道绝缘膜; 设置在隧道绝缘膜上的浮栅电极; 设置在浮栅电极上的多晶绝缘膜; 以及设置在多晶绝缘膜上的控制栅电极。 多晶绝缘膜的介电常数高于氧化硅,多晶绝缘膜由膜厚方向上基本上单晶的晶粒构成
    • 8. 发明授权
    • Semiconductor light emitting device
    • 半导体发光器件
    • US08338820B2
    • 2012-12-25
    • US13207824
    • 2011-08-11
    • Takuo KikuchiHidehiko Yabuhara
    • Takuo KikuchiHidehiko Yabuhara
    • H01L29/06
    • H01L33/04H01L33/06H01L33/12H01L33/32
    • According to one embodiment, a semiconductor light emitting device includes a first conductivity type semiconductor layer, a light emitting layer and a second conductivity type semiconductor layer. The first conductivity type layer has a superlattice structure. First semiconductor layers and second semiconductor layers are alternately provided in the superlattice structure. The first semiconductor layers include a first nitride semiconductor and the second semiconductor layers include a second nitride semiconductor having a larger lattice constant than the first nitride semiconductor. The light emitting layer has a multi-quantum well structure. Quantum well layers and barrier layers are alternately provided in the multi-quantum well structure. The quantum well layers include a third nitride semiconductor having a smaller lattice constant than the second nitride semiconductor and the barrier layers include a fourth nitride semiconductor having a smaller lattice constant than the third nitride semiconductor. At least one of the quantum well layers has lattice spacing equal to the lattice constant of the third nitride semiconductor.
    • 根据一个实施例,半导体发光器件包括第一导电类型半导体层,发光层和第二导电类型半导体层。 第一导电类型层具有超晶格结构。 第一半导体层和第二半导体层交替地设置在超晶格结构中。 第一半导体层包括第一氮化物半导体,第二半导体层包括具有比第一氮化物半导体更大的晶格常数的第二氮化物半导体。 发光层具有多量子阱结构。 在多量子阱结构中交替提供量子阱层和势垒层。 量子阱层包括具有比第二氮化物半导体更小的晶格常数的第三氮化物半导体,并且阻挡层包括具有比第三氮化物半导体更小的晶格常数的第四氮化物半导体。 至少一个量子阱层具有等于第三氮化物半导体的晶格常数的晶格间距。