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1. 发明授权

US08338820B2 Semiconductor light emitting device 有权
标题翻译：半导体发光器件
公开(公告)号：US08338820B2
公开(公告)日：2012-12-25
申请号：US13207824
申请日：2011-08-11
申请人： Takuo Kikuchi , Hidehiko Yabuhara
发明人： Takuo Kikuchi , Hidehiko Yabuhara
IPC分类号： H01L29/06
CPC分类号： H01L33/04 , H01L33/06 , H01L33/12 , H01L33/32
摘要： According to one embodiment, a semiconductor light emitting device includes a first conductivity type semiconductor layer, a light emitting layer and a second conductivity type semiconductor layer. The first conductivity type layer has a superlattice structure. First semiconductor layers and second semiconductor layers are alternately provided in the superlattice structure. The first semiconductor layers include a first nitride semiconductor and the second semiconductor layers include a second nitride semiconductor having a larger lattice constant than the first nitride semiconductor. The light emitting layer has a multi-quantum well structure. Quantum well layers and barrier layers are alternately provided in the multi-quantum well structure. The quantum well layers include a third nitride semiconductor having a smaller lattice constant than the second nitride semiconductor and the barrier layers include a fourth nitride semiconductor having a smaller lattice constant than the third nitride semiconductor. At least one of the quantum well layers has lattice spacing equal to the lattice constant of the third nitride semiconductor.
摘要翻译：根据一个实施例，半导体发光器件包括第一导电类型半导体层，发光层和第二导电类型半导体层。第一导电类型层具有超晶格结构。第一半导体层和第二半导体层交替地设置在超晶格结构中。第一半导体层包括第一氮化物半导体，第二半导体层包括具有比第一氮化物半导体更大的晶格常数的第二氮化物半导体。发光层具有多量子阱结构。在多量子阱结构中交替提供量子阱层和势垒层。量子阱层包括具有比第二氮化物半导体更小的晶格常数的第三氮化物半导体，并且阻挡层包括具有比第三氮化物半导体更小的晶格常数的第四氮化物半导体。至少一个量子阱层具有等于第三氮化物半导体的晶格常数的晶格间距。

2. 发明授权

US07262511B2 Conductive adhesive agent with ultrafine particles 有权
标题翻译：具有超细颗粒的导电粘合剂
公开(公告)号：US07262511B2
公开(公告)日：2007-08-28
申请号：US11206223
申请日：2005-08-18
申请人： Katsuhisa Osako , Naoto Shioi , Daisuke Itoh , Hideyuki Gotoh , Yorishige Matsuba , Kazuki Tateyama , Yasunari Ukita , Masao Segawa , Takuo Kikuchi
发明人： Katsuhisa Osako , Naoto Shioi , Daisuke Itoh , Hideyuki Gotoh , Yorishige Matsuba , Kazuki Tateyama , Yasunari Ukita , Masao Segawa , Takuo Kikuchi
IPC分类号： H01L23/48 , H01L21/00 , H01B1/02
CPC分类号： H01L24/29 , H01L23/3107 , H01L24/73 , H01L24/83 , H01L2224/29 , H01L2224/29101 , H01L2224/29111 , H01L2224/2919 , H01L2224/2929 , H01L2224/29313 , H01L2224/29318 , H01L2224/29339 , H01L2224/29344 , H01L2224/29347 , H01L2224/29355 , H01L2224/29369 , H01L2224/29384 , H01L2224/32245 , H01L2224/45144 , H01L2224/48095 , H01L2224/48247 , H01L2224/73265 , H01L2224/83192 , H01L2224/83439 , H01L2224/838 , H01L2224/92247 , H01L2924/00013 , H01L2924/01005 , H01L2924/01006 , H01L2924/01012 , H01L2924/01013 , H01L2924/01016 , H01L2924/01018 , H01L2924/01027 , H01L2924/01029 , H01L2924/0103 , H01L2924/01033 , H01L2924/01046 , H01L2924/01047 , H01L2924/0105 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/0132 , H01L2924/014 , H01L2924/0665 , H01L2924/0781 , H01L2924/10253 , H01L2924/12044 , H01L2924/15747 , H01L2924/181 , H05K3/321 , H01L2924/00014 , H01L2924/00 , H01L2924/00012 , H01L2924/3512 , H01L2224/29099 , H01L2224/29199 , H01L2224/29299
摘要： The present invention provides a conductive adhesive agent capable of being diluted with a solvent to give good coating workability and allowing formation of a conductive joint excellent in both thermal conductivity and electrical conductivity by inhibiting a gas generated when a binder resin is heat-cured after attachment of a part. The conductive adhesive agent according to the present invention is a conductive adhesive agent wherein, based on 100 parts by weight of silver powder having an average particle diameter of micrometers, which is used for a conductive medium, e.g. as a main component, 1 to 10 parts by weight of silver fine particles having an average particle diameter of nanometers is used in combination therewith and 5 to 15 parts by weight of thermosetting resin as a binder resin component and 10 parts or less by weight of solvent for adjustment of a fluid viscosity are blended therein as essential components, and by selection of such a blending ratio, generation of a gas component during heating and curing of the thermosetting resin to prevent formation of voids, and at the same time, fabrication of a conductive joint excellent in thermal conductivity and electrical conductivity is achieved.
摘要翻译：本发明提供一种能够用溶剂稀释以提供良好的涂布加工性的导电粘合剂，并且通过抑制粘合剂树脂在附着后热固化时产生的气体，可以形成导热性和导电性两者优异的导电接头的一部分。根据本发明的导电粘合剂是导电粘合剂，其中基于100重量份的平均粒径为微米的银粉，其用于导电介质，例如，作为主要成分，使用1〜10重量份平均粒径为纳米的银微粒，并配合5〜15重量份作为粘结剂树脂成分的热固性树脂，10重量份以下的作为主要成分配合调节流体粘度的溶剂，通过选择这样的配合比例，在热固性树脂的加热固化期间产生气体成分以防止形成空隙，同时制造实现了导热性和导电性优异的导电接头。

3. 发明申请

US20060038304A1 Conductive adhesive agent and process for manufacturing article using the conductive adhesive agent 有权
标题翻译：导电粘合剂及使用导电粘合剂制造制品的方法
公开(公告)号：US20060038304A1
公开(公告)日：2006-02-23
申请号：US11206223
申请日：2005-08-18
申请人： Katsuhisa Osako , Naoto Shioi , Daisuke Itoh , Hideyuki Gotoh , Yorishige Matsuba , Kazuki Tateyama , Yasunari Ukita , Masao Segawa , Takuo Kikuchi
发明人： Katsuhisa Osako , Naoto Shioi , Daisuke Itoh , Hideyuki Gotoh , Yorishige Matsuba , Kazuki Tateyama , Yasunari Ukita , Masao Segawa , Takuo Kikuchi
IPC分类号： H01L23/29
CPC分类号： H01L24/29 , H01L23/3107 , H01L24/73 , H01L24/83 , H01L2224/29 , H01L2224/29101 , H01L2224/29111 , H01L2224/2919 , H01L2224/2929 , H01L2224/29313 , H01L2224/29318 , H01L2224/29339 , H01L2224/29344 , H01L2224/29347 , H01L2224/29355 , H01L2224/29369 , H01L2224/29384 , H01L2224/32245 , H01L2224/45144 , H01L2224/48095 , H01L2224/48247 , H01L2224/73265 , H01L2224/83192 , H01L2224/83439 , H01L2224/838 , H01L2224/92247 , H01L2924/00013 , H01L2924/01005 , H01L2924/01006 , H01L2924/01012 , H01L2924/01013 , H01L2924/01016 , H01L2924/01018 , H01L2924/01027 , H01L2924/01029 , H01L2924/0103 , H01L2924/01033 , H01L2924/01046 , H01L2924/01047 , H01L2924/0105 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/0132 , H01L2924/014 , H01L2924/0665 , H01L2924/0781 , H01L2924/10253 , H01L2924/12044 , H01L2924/15747 , H01L2924/181 , H05K3/321 , H01L2924/00014 , H01L2924/00 , H01L2924/00012 , H01L2924/3512 , H01L2224/29099 , H01L2224/29199 , H01L2224/29299
摘要： The present invention provides a conductive adhesive agent capable of being diluted with a solvent to give good coating workability and allowing formation of a conductive joint excellent in both thermal conductivity and electrical conductivity by inhibiting a gas generated when a binder resin is heat-cured after attachment of a part. The conductive adhesive agent according to the present invention is a conductive adhesive agent wherein, based on 100 parts by weight of silver powder having an average particle diameter of micrometers, which is used for a conductive medium, e.g. as a main component, 1 to 10 parts by weight of silver fine particles having an average particle diameter of nanometers is used in combination therewith and 5 to 15 parts by weight of thermosetting resin as a binder resin component and 10 parts or less by weight of solvent for adjustment of a fluid viscosity are blended therein as essential components, and by selection of such a blending ratio, generation of a gas component during heating and curing of the thermosetting resin to prevent formation of voids, and at the same time, fabrication of a conductive joint excellent in thermal conductivity and electrical conductivity is achieved.
摘要翻译：本发明提供一种能够用溶剂稀释以提供良好的涂布加工性的导电粘合剂，并且通过抑制粘合剂树脂在附着后热固化时产生的气体，可以形成导热性和导电性两者优异的导电接头的一部分。根据本发明的导电粘合剂是导电粘合剂，其中基于100重量份的平均粒径为微米的银粉，其用于导电介质，例如，作为主要成分，使用1〜10重量份平均粒径为纳米的银微粒，并配合5〜15重量份作为粘结剂树脂成分的热固性树脂，10重量份以下的作为主要成分配合调节流体粘度的溶剂，通过选择这样的配合比例，在热固性树脂的加热固化期间产生气体成分以防止形成空隙，同时制造实现了导热性和导电性优异的导电接头。

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