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    • 2. 发明授权
    • Method for evaluating photo mask and method for manufacturing semiconductor device
    • 评估光掩膜的方法和制造半导体器件的方法
    • US07229721B2
    • 2007-06-12
    • US10705954
    • 2003-11-13
    • Shoji MimotogiShigeki NojimaOsamu Ikenaga
    • Shoji MimotogiShigeki NojimaOsamu Ikenaga
    • G03F1/00
    • G03F7/70625G03F1/44G03F1/68G03F1/78G03F7/705
    • A method for evaluating a photo mask comprises preparing a photo mask including a unit drawing pattern, finding a dimensional variation relating to the photo mask, the dimensional variation including first and second dimensional variations, the first dimensional variation occurring due to a positional displacement and size mismatch of the unit drawing pattern in the photo mask and the second dimensional variation occurring due to etching and development relating to a manufacturing of the photo mask, estimating a deteriorated amount of an exposure latitude occurring due to the dimensional variation of the photo mask using the dimensional variation and a degree of influence of the dimensional variation for the exposure latitude, and judging quality of the photo mask by comparing the deteriorated amount of the exposure latitude and an allowable deteriorated amount of the exposure latitude.
    • 一种用于评估光掩模的方法包括制备包括单元绘图图案的光掩模,找到与光掩模相关的尺寸变化,包括第一和第二尺寸变化的尺寸变化,由于位置偏移和尺寸而发生的第一尺寸变化 光掩模中的单位绘图图案的不匹配以及由于与光掩模的制造相关的蚀刻和显影而发生的第二尺寸变化,估计由于光掩膜的尺寸变化而产生的曝光宽容度的恶化量, 通过比较曝光宽容度的劣化量和曝光宽容度的允许恶化量来判断曝光宽容度的尺寸变化和影响程度,以及判断光掩模的质量。
    • 7. 发明申请
    • PATTERN FORMING METHOD AND PATTERN FORMING DEVICE
    • 图案形成方法和图案形成装置
    • US20120049396A1
    • 2012-03-01
    • US13217698
    • 2011-08-25
    • Tomohiro TsutsuiOsamu IkenagaRyoichi Inanami
    • Tomohiro TsutsuiOsamu IkenagaRyoichi Inanami
    • B29C59/02
    • G03F7/0002B82Y10/00B82Y40/00
    • According to one embodiment, a pattern forming method includes transferring a first pattern area of a plurality of pattern areas to a to-be-processed substrate, by using a template on which the plurality of pattern areas, where patterns are formed on a substrate, are disposed, counting up a number of times of transfer of the first pattern area, and storing the number of times of transfer, determining whether the stored number of times of transfer of the pattern of the first pattern area has exceeded a specified number, and executing switching to a second pattern of the plurality of pattern areas when it is determined, at a time of the determining, that the stored number of times of transfer of the pattern of the first pattern area has exceeded the specified number, and transferring the second pattern area to the to-be-processed substrate.
    • 根据一个实施例,图案形成方法包括通过使用其上在基板上形成图案的多个图案区域的模板将多个图案区域的第一图案区域转印到待处理基板, 对第一图案区域的传送次数进行计数,并存储传送次数,确定存储的第一图案区域的图案的传送次数是否超过规定数量;以及 当确定时确定存储的第一图案区域的图案的传送次数已经超过指定的数量,并且将第二图案区域的第二图案转移到第二图案区域的第二图案 图案区域到待处理的基板。
    • 8. 发明授权
    • Semiconductor mask inspection using die-to-die and die-to-database comparisons
    • 半导体掩模检测使用模 - 模和模 - 数据库比较
    • US08036446B2
    • 2011-10-11
    • US11439989
    • 2006-05-25
    • Osamu IkenagaTomohiro Tsutsui
    • Osamu IkenagaTomohiro Tsutsui
    • G06K9/00
    • G03F1/84
    • A mask forming method includes preparing design data of mask including pattern regions having identical repetition patterns respectively, generating mask pattern data of mask based on the design data, generating inspection control information for controlling inspection of defect on mask based on the mask pattern data, the information including positional information of the pattern regions and inspection sensitivity information of the repetition pattern, providing the inspection control information to mask pattern data, forming mask pattern of mask based on the mask pattern data, and inspecting the mask pattern based on the mask pattern data comprising inspecting portion in the mask pattern different from the pattern regions by Die-to-Database comparison method, the inspecting the portion including selecting portion corresponding to repetition pattern from the mask pattern based on the positional information, and inspecting the selected portion by Die-to-Die comparison method at an inspection sensitivity corresponding to inspection sensitivity information.
    • 掩模形成方法包括:分别准备包括具有相同重复图案的图案区域的掩模的设计数据,基于设计数据生成掩模的掩模图案数据,产生用于基于掩模图案数据控制掩模缺陷检查的检查控制信息, 包括图案区域的位置信息和重复图案的检查灵敏度信息的信息,提供检查控制信息以屏蔽图案数据,基于掩模图案数据形成掩模的掩模图案,以及基于掩模图案数据检查掩模图案 包括通过模 - 数据库比较方法在不同于图案区域的掩模图案中的检查部分,基于位置信息检查包括与掩模图案相对应的重复图案的选择部分的部分,并且通过Die- 灵感的对比比较方法 检测灵敏度对应检测灵敏度信息。
    • 10. 发明授权
    • Method for drawing a desired circuit pattern using charged particle beam
    • 使用带电粒子束绘制所需电路图案的方法
    • US4878177A
    • 1989-10-31
    • US155027
    • 1988-02-11
    • Osamu IkenagaSusumu Watanabe
    • Osamu IkenagaSusumu Watanabe
    • H01L21/027H01J37/302H01J37/317
    • B82Y10/00B82Y40/00H01J37/3026H01J37/3174H01J2237/31764H01J2237/31776
    • There is disclosed a specific method, which is applied to a charged particle beam pattern drawing system, for drawing a circuit pattern on a workpiece using a charged particle beam. A circuit pattern to be drawn is first divided into unit figures by parallel line segments extending from the vertexes of the figure that has a polygonal planar shape in a first reference direction. Each of the unit figures corresponds to a specific reference figure registered in advance. When the divided unit figures include an elongated too-small figure having at least one side shorter than a predetermined minimum allowable length, the too-small figure is merged with at least one unit figure adjacent to it at least once, and thus an expanded unit figure is defined. The expanded unit figure is divided into new unit figures by parallel line segments extending from its vertexes in a second reference direction perpendicular to the first reference direction so as to correspond to the reference figures. As a result, remaining of the too-small figures in the circuit pattern to be actually subjected to charged particle beam pattern drawing is minimized.
    • 公开了一种特定的方法,其应用于带电粒子束图形绘制系统,用于使用带电粒子束在工件上绘制电路图案。 要绘制的电路图案首先通过从图中顶点延伸的平行线段划分为单元图,该平面线段在第一参考方向上具有多边形平面形状。 每个单位图对应于预先登记的具体参考图。 当分割单元图形包括具有比预定的最小允许长度短的至少一边的细长太小图形时,太小的图形与与其相邻的至少一个单位图形合并至少一次,因此扩展单元 图定义。 扩展的单位图由平行线段分割成新的单位图形,其平行线段从垂直于第一参考方向的第二参考方向从其顶点延伸,以对应于参考图形。 结果,使电路图案中实际经受带电粒子束图案绘制的太小图形的剩余量最小化。