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1. 发明授权

US6099675A Resist removing method 失效
标题翻译：抗蚀剂去除方法
公开(公告)号：US6099675A
公开(公告)日：2000-08-08
申请号：US203497
申请日：1998-12-01
申请人： Masayuki Yamamoto , Makoto Namikawa , Eiji Toyoda , Shigeji Kuroda , Saburo Miyamoto , Takao Matsushita
发明人： Masayuki Yamamoto , Makoto Namikawa , Eiji Toyoda , Shigeji Kuroda , Saburo Miyamoto , Takao Matsushita
IPC分类号： H01L21/027 , B29C63/00 , B32B31/16 , C09J5/06 , G05G15/00 , H01J21/30
CPC分类号： B29C63/0013 , Y10S156/922 , Y10T156/11
摘要： An adhesive tape is applied to an article covered with a resist pattern. The article with the adhesive tape applied thereto is rapidly cooled to form cracks in the resist pattern on the surface of the article to weaken the cohesion between the resist pattern and the surface of the article. After the cooling, the adhesive tape is separated from the article, whereby the resist pattern is removed with the adhesive tape from the surface of the article.
摘要翻译：将粘合带施加到被抗蚀图案覆盖的物品上。施加有胶粘带的制品被快速冷却以在制品的表面上的抗蚀剂图案中形成裂纹，以削弱抗蚀剂图案和制品的表面之间的内聚力。冷却后，粘合带与制品分离，由此用胶带从制品的表面除去抗蚀剂图案。

2. 发明授权

US06235144B1 Resist removing apparatus and method 失效
标题翻译：抗蚀剂除去装置和方法
公开(公告)号：US06235144B1
公开(公告)日：2001-05-22
申请号：US09203263
申请日：1998-12-01
申请人： Masayuki Yamamoto , Makoto Namikawa , Eiji Toyoda , Shigeji Kuroda , Saburo Miyamoto , Takao Matsushita
发明人： Masayuki Yamamoto , Makoto Namikawa , Eiji Toyoda , Shigeji Kuroda , Saburo Miyamoto , Takao Matsushita
IPC分类号： B32B3500
CPC分类号： H01L21/67132 , B08B7/00 , B08B7/0028 , B08B7/0035 , B29C63/0013 , G03F7/42 , Y10T156/11 , Y10T156/1158 , Y10T156/1189
摘要： A resist removing apparatus for removing an unwanted resist pattern from a surface of wafer W by applying an adhesive tape to the surface of wafer W having the resist patterns formed thereon, and separating the adhesive tape from the surface of wafer W. The apparatus includes an adhesive removing mechanism 13 for treating the surface of wafer W after the adhesive tape is separated therefrom. The adhesive removing mechanism 13 may be effective when constructed to jet ozone to the surface of wafer W heated, to irradiate the surface of wafer W heated, with ultraviolet rays, or to jet ozone to the surface of wafer W heated and irradiate the surface with ultraviolet rays.
摘要翻译：一种抗蚀剂去除装置，用于通过在其上形成有抗蚀剂图案的晶片W的表面上涂布粘合带，从晶片W的表面除去不需要的抗蚀剂图案，并将粘合带从晶片W的表面分离。该装置包括：粘合剂去除机构13，用于在粘合带分离之后处理晶片W的表面。当粘合剂去除机构13被构造成将臭氧喷射到被加热的晶片W的表面上，以紫外线照射加热的晶片W的表面，或者将臭氧喷射到加热并照射表面的晶片W的表面时，紫外线。

3. 发明授权

US5891298A Method and apparatus for peeling protective adhesive tape from semiconductor wafer 失效
标题翻译：从半导体晶片剥离保护性胶带的方法和装置
公开(公告)号：US5891298A
公开(公告)日：1999-04-06
申请号：US973859
申请日：1997-12-30
申请人： Shigeji Kuroda , Takao Matsushita , Saburo Miyamoto
发明人： Shigeji Kuroda , Takao Matsushita , Saburo Miyamoto
IPC分类号： H01L21/00 , H01L21/56 , B32B35/00
CPC分类号： H01L21/67132 , H01L21/56 , H01L21/67121 , H01L21/6836 , H01L2221/68327 , H01L2221/6834 , H01L2221/68395 , H01L2924/0002 , Y10S156/941 , Y10T156/1179 , Y10T156/19
摘要： A method and apparatus for peeling protective adhesive tape 3 from work having the protective adhesive tape 3 applied to a surface of a semiconductor wafer W supported in a ring-shaped frame F by means of a supporting adhesive tape 1. Thin plates 4 with non-adhesive upper surfaces are applied to the supporting adhesive tape 1 adjacent a peel starting end 3a and a peel finishing end 3b of protective adhesive tape 3, respectively, to form regions for avoiding contact between a peeling tape 5 wound around an applying roller 8 and the like and the supporting adhesive tape 1. Subsequently, the peeling tape 5 is applied to the protective adhesive tape 3 at the peel starting end 3a with the applying roller 8, and a group of rollers 6-8 is moved horizontally on the work A to peel the peeling tape 5 and protective adhesive tape 3 together from the surface of semiconductor wafer W.
摘要翻译： PCT No.PCT / JP96 / 02476 Sec。 371日期1997年12月30日 102（e）1997年12月30日PCT PCT 1996年8月28日PCT公布。出版物WO97 / 08745 日本1997年3月6日一种剥离保护性胶带3的工序的方法和装置，其具有通过支撑胶带1将保护胶带3涂覆在支撑在环形框架F中的半导体晶片W的表面上。薄片将带有非粘性上表面的板4分别施加到邻近保护胶带3的剥离起始端3a和剥离完成端3b的支撑胶带1上，以形成用于避免卷绕在保护胶带3上的剥离带5之间的接触的区域施加辊8等和支撑胶带1.随后，利用施加辊8将剥离带5施加到剥离开始端3a处的保护胶带3，并且一组辊6-8水平移动在工件A上将剥离带5和保护胶带3从半导体晶片W的表面一起剥离。

4. 发明授权

US06249943B1 Automatic semiconductor wafer applying apparatus 失效
标题翻译：自动半导体晶片施加装置
公开(公告)号：US06249943B1
公开(公告)日：2001-06-26
申请号：US09198489
申请日：1998-11-24
申请人： Takao Matsushita , Shigeji Kuroda , Yoshinobu Ide
发明人： Takao Matsushita , Shigeji Kuroda , Yoshinobu Ide
IPC分类号： B23P2306
CPC分类号： H01L21/67132 , Y10T29/5142 , Y10T29/5143 , Y10T29/5193 , Y10T156/1343
摘要： Disclosed is an automatic semiconductor wafer applying apparatus capable of lightly easily stacking and loading ring frames onto a frame supply section. This apparatus has the following construction. An adhesive tape unwound from a tape roll is applied to a lower surface of the ring frame supplied to a tape applying position. The applied adhesive tape is cut out along the ring frame. The ring frame having the adhesive tape applied thereto is transported to a wafer applying position. A semiconductor wafer is applied onto the adhesive tape of the ring frame. In this apparatus, a frame supply truck movable with the ring frames stacked and held thereon is arranged so that it can be pushed/transported into and pulled out/transported from the frame supply section. A lift unit for receiving, lifting and supplying a group of ring frames stacked on the pushed and transported frame supply truck is installed in the frame supply section.
摘要翻译：公开了一种自动半导体晶片施加装置，其能够轻易地将环形框架堆叠和装载到框架供应部分上。该装置具有以下结构。将从卷带展开的胶带施加到提供给带施加位置的环形框架的下表面。所施加的胶带沿环形框架切出。具有施加到其上的胶带的环形框架被输送到晶片施加位置。半导体晶片被施加到环形框架的胶带上。在这种装置中，以可堆叠并保持在其上的环形框架可移动的框架供应车架被布置成能够被推送/运送到框架供应部分并从框架供应部分中拉出/运送。用于接收，提升和供应堆叠在被推送和运送的框架供给卡车上的一组环形框架的提升单元安装在框架供应部分中。

5. 发明授权

US5246524A Semiconductor wafer processing system 失效
标题翻译：半导体波长加工系统
公开(公告)号：US5246524A
公开(公告)日：1993-09-21
申请号：US349542
申请日：1989-05-09
申请人： Shigeji Kuroda , Toshiyuki Sekido , Kazuhiro Noda , Matsuro Kinbara
发明人： Shigeji Kuroda , Toshiyuki Sekido , Kazuhiro Noda , Matsuro Kinbara
IPC分类号： B23Q7/04 , B23Q7/10 , B28D5/00 , H01L21/00 , H01L21/301 , H01L21/677
CPC分类号： H01L21/67173 , H01L21/67346 , H01L21/67778 , Y10S438/907 , Y10T156/12 , Y10T29/53178
摘要： A semiconductor wafer processing system having a plurality of processing devices forming a base processing line for processing in sequence a workpiece having a semiconductor wafer is provided with an auxiliary loader connected to one of the processing devices for supplying the workpiece forming a processing line different from the base processing line, and an auxiliary unloader connected to the one processing device for receiving the workpiece processed by the one processing device at times when the one processing device is not supplied the workpiece by the processing device upstream of the one processing device in the base processing line.
摘要翻译：一种具有多个处理装置的半导体晶片处理系统，具有形成用于依次处理具有半导体晶片的工件的基底处理线的处理装置，设置有辅助加载器，该辅助加载器连接到一个处理装置，用于提供形成不同于在一个处理装置中连接到一个处理装置的辅助卸载器，用于在基本处理中的一个处理装置的上游处理装置不由一个处理装置向工件供应时接收由一个处理装置处理的工件线。

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