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1. 发明授权

US06634073B1 Continuous production facilities for wire 有权
标题翻译：电线连续生产设备
公开(公告)号：US06634073B1
公开(公告)日：2003-10-21
申请号：US09744370
申请日：2001-01-23
申请人： Koji Adachi , Koji Tanabe , Ryuichi Seki , Kiichiro Tsuchida
发明人： Koji Adachi , Koji Tanabe , Ryuichi Seki , Kiichiro Tsuchida
IPC分类号： B23P2306
CPC分类号： C21D9/5732 , B21B1/18 , B21C47/26 , C21D8/06 , Y10T29/5184 , Y10T29/5187
摘要： The present invention relates a train of in-line continuous manufacturing equipment for producing steel wire, considered difficult with a block mill up to now, capable of efficiently carrying out controlled-rolling and slow-cooling by an effective in-line combination of controlled rolling apparatuses and slow cooling apparatuses, having a hot rolling mill for steel wire, a winder to wind the rolled steel wire into rings, bundling apparatuses to pack the wound steel wire into bundled coils and an in-line heat treatment furnace to slow-cool the steel wire bundled into coils, which are sequentially connected, and using, preferably, a block mill with an area reduction rate of 25 to 60% having at most 4 roll stands as a final finish rolling mill of the hot rolling mill.
摘要翻译：本发明涉及一种用于生产钢丝的在线连续制造设备的列车，其至今被认为难以使用块式铣刀，能够通过有效的控制轧制组合有效地进行控制滚动和缓慢冷却具有用于钢丝的热轧机，卷绕机将卷绕的钢丝卷绕成环的装置和缓慢冷却装置，将卷绕的钢丝包装成捆扎线圈的捆扎装置和直列式热处理炉，以缓慢冷却将钢丝捆扎成线圈，将其连续地连接起来，优选使用面积减少率为25〜60％的块式研磨机，最多具有4台轧机机架作为热轧机的最终精轧机。

2. 发明授权

US06826821B2 System for machining work pieces comprising at least one machine tool 有权
标题翻译：用于加工包括至少一个机床的工件的系统
公开(公告)号：US06826821B2
公开(公告)日：2004-12-07
申请号：US10312822
申请日：2002-12-26
申请人： Dietrich Geiger , Wolfgang Horn , Gerhard Stengele
发明人： Dietrich Geiger , Wolfgang Horn , Gerhard Stengele
IPC分类号： B23P2306
CPC分类号： B23Q7/005 , B23Q7/03 , B23Q41/02 , Y10T29/5124 , Y10T29/5196 , Y10T409/304088 , Y10T409/305264 , Y10T409/30532
摘要： An installation for machining work pieces (15) comprises at least a machine tool (36). It is provided with a supply and take-down equipment (41), which is disposed before the machine tool (36) on a side of the working area (14) that faces away from the work spindle (10).
摘要翻译：用于加工工件（15）的安装件至少包括机床（36）。设置有供给和取出设备（41），其设置在工作区域（14）的远离工作主轴（10）的一侧的机床（36）之前。

3. 发明授权

US06249943B1 Automatic semiconductor wafer applying apparatus 失效
标题翻译：自动半导体晶片施加装置
公开(公告)号：US06249943B1
公开(公告)日：2001-06-26
申请号：US09198489
申请日：1998-11-24
申请人： Takao Matsushita , Shigeji Kuroda , Yoshinobu Ide
发明人： Takao Matsushita , Shigeji Kuroda , Yoshinobu Ide
IPC分类号： B23P2306
CPC分类号： H01L21/67132 , Y10T29/5142 , Y10T29/5143 , Y10T29/5193 , Y10T156/1343
摘要： Disclosed is an automatic semiconductor wafer applying apparatus capable of lightly easily stacking and loading ring frames onto a frame supply section. This apparatus has the following construction. An adhesive tape unwound from a tape roll is applied to a lower surface of the ring frame supplied to a tape applying position. The applied adhesive tape is cut out along the ring frame. The ring frame having the adhesive tape applied thereto is transported to a wafer applying position. A semiconductor wafer is applied onto the adhesive tape of the ring frame. In this apparatus, a frame supply truck movable with the ring frames stacked and held thereon is arranged so that it can be pushed/transported into and pulled out/transported from the frame supply section. A lift unit for receiving, lifting and supplying a group of ring frames stacked on the pushed and transported frame supply truck is installed in the frame supply section.
摘要翻译：公开了一种自动半导体晶片施加装置，其能够轻易地将环形框架堆叠和装载到框架供应部分上。该装置具有以下结构。将从卷带展开的胶带施加到提供给带施加位置的环形框架的下表面。所施加的胶带沿环形框架切出。具有施加到其上的胶带的环形框架被输送到晶片施加位置。半导体晶片被施加到环形框架的胶带上。在这种装置中，以可堆叠并保持在其上的环形框架可移动的框架供应车架被布置成能够被推送/运送到框架供应部分并从框架供应部分中拉出/运送。用于接收，提升和供应堆叠在被推送和运送的框架供给卡车上的一组环形框架的提升单元安装在框架供应部分中。

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