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1. 发明授权

US07550375B2 Method for forming metal bumps 有权
标题翻译：金属凸块的形成方法
公开(公告)号：US07550375B2
公开(公告)日：2009-06-23
申请号：US11635498
申请日：2006-12-08
申请人： Sheng-Ming Wang , Shuo-Hsun Chang , Kuo-Hua Chang , Chi-Chih Huang , Chih-Cheng Chen
发明人： Sheng-Ming Wang , Shuo-Hsun Chang , Kuo-Hua Chang , Chi-Chih Huang , Chih-Cheng Chen
IPC分类号： H01L21/44
CPC分类号： H05K3/4007 , H01L21/4853 , H01L24/11 , H01L2224/114 , H01L2224/116 , H01L2224/11902 , H01L2224/13082 , H01L2224/13111 , H01L2224/13113 , H01L2224/13116 , H01L2224/13139 , H01L2224/13147 , H01L2224/1357 , H01L2224/13611 , H01L2224/13613 , H01L2224/13616 , H01L2224/13618 , H01L2224/13624 , H01L2224/13639 , H01L2224/13644 , H01L2224/13647 , H01L2224/13655 , H01L2224/1366 , H01L2224/13664 , H01L2924/00013 , H01L2924/01011 , H01L2924/01013 , H01L2924/01019 , H01L2924/01029 , H01L2924/0103 , H01L2924/01033 , H01L2924/01046 , H01L2924/01047 , H01L2924/01075 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H05K3/064 , H05K3/28 , H05K2201/0367 , H05K2201/09881 , H05K2203/054 , H05K2203/0542 , H05K2203/0574 , H01L2924/00014 , H01L2224/13099
摘要： A method for forming metal bumps is disclosed. Steps of the method include supplying a substrate containing a plurality of pads; forming a first photoresist layer on the substrate, herein the first photoresist layer covers the pads; performing a planarization step to remove a portion of the first photoresist layer so as to expose the pads; forming a conductive layer on the first photoresist layer and the pads; electroplating a metal layer on the conductive layer; forming a patterned second photoresist layer on the metal layer; a portion of the metal layer and the conductive layer which are not covered by the patterned second photoresist layer is removed by using the patterned second photoresist layer as a mask; removing the patterned second photoresist layer; and forming a solder mask on the substrate, wherein the solder mask has a plurality of openings to expose the metal layer located on the pads.
摘要翻译：公开了一种用于形成金属凸块的方法。该方法的步骤包括提供含有多个焊盘的衬底; 在衬底上形成第一光致抗蚀剂层，这里第一光致抗蚀剂层覆盖衬垫; 执行平面化步骤以去除第一光致抗蚀剂层的一部分以暴露焊盘; 在所述第一光致抗蚀剂层和所述焊盘上形成导电层; 在导电层上电镀金属层; 在所述金属层上形成图案化的第二光致抗蚀剂层; 通过使用图案化的第二光致抗蚀剂层作为掩模去除未被图案化的第二光致抗蚀剂层覆盖的金属层和导电层的一部分; 去除图案化的第二光致抗蚀剂层; 以及在所述衬底上形成焊料掩模，其中所述焊接掩模具有多个开口以暴露位于焊盘上的金属层。

2. 发明申请

US20070218676A1 Method for forming metal bumps 有权
标题翻译：金属凸块的形成方法
公开(公告)号：US20070218676A1
公开(公告)日：2007-09-20
申请号：US11635498
申请日：2006-12-08
申请人： Sheng-Ming Wang , Shuo-Hsun Chang , Kuo-Hua Chang , Chi-Chih Huang , Chih-Cheng Chen
发明人： Sheng-Ming Wang , Shuo-Hsun Chang , Kuo-Hua Chang , Chi-Chih Huang , Chih-Cheng Chen
IPC分类号： H01L21/44
CPC分类号： H05K3/4007 , H01L21/4853 , H01L24/11 , H01L2224/114 , H01L2224/116 , H01L2224/11902 , H01L2224/13082 , H01L2224/13111 , H01L2224/13113 , H01L2224/13116 , H01L2224/13139 , H01L2224/13147 , H01L2224/1357 , H01L2224/13611 , H01L2224/13613 , H01L2224/13616 , H01L2224/13618 , H01L2224/13624 , H01L2224/13639 , H01L2224/13644 , H01L2224/13647 , H01L2224/13655 , H01L2224/1366 , H01L2224/13664 , H01L2924/00013 , H01L2924/01011 , H01L2924/01013 , H01L2924/01019 , H01L2924/01029 , H01L2924/0103 , H01L2924/01033 , H01L2924/01046 , H01L2924/01047 , H01L2924/01075 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H05K3/064 , H05K3/28 , H05K2201/0367 , H05K2201/09881 , H05K2203/054 , H05K2203/0542 , H05K2203/0574 , H01L2924/00014 , H01L2224/13099
摘要： A method for forming metal bumps is disclosed. Steps of the method include supplying a substrate containing a plurality of pads; forming a first photoresist layer on the substrate, herein the first photoresist layer covers the pads; performing a planarization step to remove a portion of the first photoresist layer so as to expose the pads; forming a conductive layer on the first photoresist layer and the pads; electroplating a metal layer on the conductive layer; forming a patterned second photoresist layer on the metal layer; a portion of the metal layer and the conductive layer which are not covered by the patterned second photoresist layer is removed by using the patterned second photoresist layer as a mask; removing the patterned second photoresist layer; and forming a solder mask on the substrate, wherein the solder mask has a plurality of openings to expose the metal layer located on the pads.
摘要翻译：公开了一种用于形成金属凸块的方法。该方法的步骤包括提供含有多个焊盘的衬底; 在衬底上形成第一光致抗蚀剂层，这里第一光致抗蚀剂层覆盖衬垫; 执行平面化步骤以去除第一光致抗蚀剂层的一部分以暴露焊盘; 在所述第一光致抗蚀剂层和所述焊盘上形成导电层; 在导电层上电镀金属层; 在所述金属层上形成图案化的第二光致抗蚀剂层; 通过使用图案化的第二光致抗蚀剂层作为掩模去除未被图案化的第二光致抗蚀剂层覆盖的金属层和导电层的一部分; 去除图案化的第二光致抗蚀剂层; 以及在所述衬底上形成焊料掩模，其中所述焊接掩模具有多个开口以暴露位于焊盘上的金属层。

3. 发明申请

US20070232051A1 Method for forming metal bumps 审中-公开
标题翻译：金属凸块的形成方法
公开(公告)号：US20070232051A1
公开(公告)日：2007-10-04
申请号：US11589714
申请日：2006-10-31
申请人： Sheng-Ming Wang , Shuo-Hsun Chang , Kuo-Hua Chang , Chi-Chih Huang , Chih-Cheng Chen
发明人： Sheng-Ming Wang , Shuo-Hsun Chang , Kuo-Hua Chang , Chi-Chih Huang , Chih-Cheng Chen
IPC分类号： H01L21/44
CPC分类号： H05K3/3473 , H01L21/4853 , H01L24/03 , H01L24/11 , H01L2224/0401 , H01L2224/114 , H01L2224/1147 , H01L2224/11474 , H01L2224/11502 , H01L2224/116 , H01L2224/11849 , H01L2224/13022 , H01L2224/13099 , H01L2924/01011 , H01L2924/01013 , H01L2924/01019 , H01L2924/01028 , H01L2924/01029 , H01L2924/0103 , H01L2924/01033 , H01L2924/01046 , H01L2924/01047 , H01L2924/0105 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H05K3/243 , H05K3/3452 , H05K2203/043 , H05K2203/054 , H05K2203/0588
摘要： A method for forming metal bumps is disclosed, comprising: providing a substrate including a plurality of pads; forming a solder mask on the substrate, wherein the solder mask has first openings to expose the pads; forming a photoresist layer on the solder mask, wherein the photoresist layer has second openings to expose the pads; forming a conductive layer on the phototresist layer, wherein a sidewall of each second opening, a sidewall of each first opening and the pads are covered with the conductive layer; forming a metal layer on the conductive layer by electroplating to fill the first and second openings; performing a planarization step to remove the conductive layer and the metal layer on the photoresist layer so as to remain the conductive layer and the metal layer in the first and second openings; removing the photoresist layer and performing a reflow step to form metal bumps.
摘要翻译：公开了一种用于形成金属凸块的方法，包括：提供包括多个焊盘的基板; 在所述基板上形成焊接掩模，其中所述焊接掩模具有第一开口以暴露所述焊盘; 在所述焊接掩模上形成光致抗蚀剂层，其中所述光致抗蚀剂层具有第二开口以暴露所述焊盘; 在光致抗蚀剂层上形成导电层，其中每个第二开口的侧壁，每个第一开口的侧壁和焊盘被导电层覆盖; 通过电镀在所述导电层上形成金属层以填充所述第一和第二开口; 执行平坦化步骤以去除光致抗蚀剂层上的导电层和金属层，以便在第一和第二开口中保持导电层和金属层; 去除光致抗蚀剂层并进行回流步骤以形成金属凸块。

4. 发明申请

US20070163269A1 HEAT DISSIPATION MODULE 审中-公开
标题翻译：散热模块
公开(公告)号：US20070163269A1
公开(公告)日：2007-07-19
申请号：US11564854
申请日：2006-11-30
申请人： Chao-Tsai Chung , Kuo-Hua Chang
发明人： Chao-Tsai Chung , Kuo-Hua Chang
IPC分类号： F25B21/02
CPC分类号： F25B21/02 , F25B2321/023 , F28D15/0233 , F28D15/0266 , F28F3/02 , H01L23/38 , H01L2924/0002 , H01L2924/00
摘要： A heat dissipation module suitable for performing heat dissipation on a heat source is provided. The heat dissipation module includes a first base, a first radiator, a thermoelectric cooler and a second radiator. The first base has a first surface and a second surface, wherein the first surface contacts the heat source. Both the first radiator and the thermoelectric cooler contact the second surface, while the second radiator is disposed on the thermoelectric cooler.
摘要翻译：提供了适用于在热源上进行散热的散热模块。散热模块包括第一基座，第一辐射器，热电冷却器和第二辐射器。第一基座具有第一表面和第二表面，其中第一表面接触热源。第一散热器和热电冷却器都接触第二表面，而第二散热器设置在热电冷却器上。

5. 发明申请

US20060261620A1 Anti-shock mechanisms 审中-公开
标题翻译：防震机制
公开(公告)号：US20060261620A1
公开(公告)日：2006-11-23
申请号：US11417785
申请日：2006-05-03
申请人： Lung-Chi Lu , Kuo-Hua Chang
发明人： Lung-Chi Lu , Kuo-Hua Chang
IPC分类号： B60J9/00
CPC分类号： G11B33/08 , G06F1/187
摘要： Anti-shock mechanisms for electronic devices are provided. An anti-shock mechanism includes a plurality of first rods and first buffers. The first rods perpendicularly project from a first side of the electronic device, wherein the first side is substantially parallel to a moving direction of the vehicle. Each of the first buffers comprises a first opening, and the first rods are inserted in the first openings respectively.
摘要翻译：提供了电子设备的抗冲击机制。抗冲击机构包括多个第一杆和第一缓冲器。第一杆从电子设备的第一侧垂直地突出，其中第一侧基本上平行于车辆的移动方向。每个第一缓冲器包括第一开口，并且第一杆分别插入第一开口中。

6. 发明授权

US07228408B2 Computer system capable of operating in multiple operation modes and the operating method thereof 有权
标题翻译：能够以多种操作模式操作的计算机系统及其操作方法
公开(公告)号：US07228408B2
公开(公告)日：2007-06-05
申请号：US10796476
申请日：2004-03-09
申请人： Chien-Hao Wu , Kuo-Hua Chang , Ming-Chih Ko , Shih-Chieh Kuo
发明人： Chien-Hao Wu , Kuo-Hua Chang , Ming-Chih Ko , Shih-Chieh Kuo
IPC分类号： G06F9/24 , G06F1/24 , G06F13/00
CPC分类号： G06F9/441
摘要： A multi-mode operation system and method for computer systems is proposed. The system includes a storage device having first and second disk partitions, a mode controller and a master boot program. The master boot program checks the status of the mode controller. If the computer system is running in PC mode, the master boot program hides the second disk partition, boots from the first disk partition, and loads a complete version of an operating system therein, thereby enables the computer system to run in the PC mode. If the computer system is running in a sub-mode being defined as an entry of a multimedia mode class, such as a music playing mode or video playing mode, the master boot program activates the second disk partition, boots therefrom, and loads a refined version of the operating system therein, thereby enables the computer system to run in the selected sub-mode.
摘要翻译：提出了一种用于计算机系统的多模式操作系统和方法。该系统包括具有第一和第二磁盘分区的存储设备，模式控制器和主引导程序。主引导程序检查模式控制器的状态。如果计算机系统以PC模式运行，则主引导程序将隐藏第二个磁盘分区，从第一个磁盘分区引导，并在其中加载完整版本的操作系统，从而使计算机系统能够以PC模式运行。如果计算机系统以被定义为诸如音乐播放模式或视频播放模式的多媒体模式类别的条目的子模式运行，则主引导程序激活第二磁盘分区，从其引导并加载精炼版本的操作系统，从而使得计算机系统能够以所选择的子模式运行。

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