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1. 发明授权

US06781056B1 Heater for temperature control integrated in circuit board and method of manufacture 失效
标题翻译：集成在电路板中的温度控制加热器和制造方法
公开(公告)号：US06781056B1
公开(公告)日：2004-08-24
申请号：US10376858
申请日：2003-02-28
申请人： Shawn O'Rourke , Daniel J. Sadler , Marc K. Chason , Manes Eliacin , Claudia V. Gamboa , Robert Terbrueggen , Ke K. Lian
发明人： Shawn O'Rourke , Daniel J. Sadler , Marc K. Chason , Manes Eliacin , Claudia V. Gamboa , Robert Terbrueggen , Ke K. Lian
IPC分类号： H05K103
CPC分类号： H05K1/0212 , H05K1/0298 , H05K1/167 , H05K3/429 , H05K2201/09536 , H05K2203/304
摘要： Circuit boards (1100, 1500, 1600, 1700) and methods for fabricating circuit boards that include heaters for maintaining temperature sensitive components at an operating temperature are provided. Resistive traces (602, 702,704) are included in the circuit boards proximate temperature sensitive apparatus (1004, 1304, 1602, 1712). Thermally conductive patches (802, 902, 904) are interposed between the resistive traces and the temperature sensitive components. The thermally conductive patches establish zones of relatively uniform temperatures. According to a preferred embodiment of the invention the temperature sensitive apparatus comprises a fluid conduit (1004).
摘要翻译：提供电路板（1100,1500,1600,1700）以及用于制造电路板的方法，该电路板包括用于将温度敏感元件保持在工作温度的加热器。电阻迹线（602,702,704）包括在温度敏感设备（1004,1304,1602,1712）附近的电路板中。导热贴片（802,902,904）插在电阻迹线和温度敏感元件之间。导热贴片建立相对均匀温度的区域。根据本发明的优选实施例，温度敏感设备包括流体导管（1004）。

2. 发明申请

US20080152792A1 METHOD OF MANUFACTURING A BISTABLE MICROELECTRONIC SWITCH STACK 审中-公开
标题翻译：制造微电子开关堆栈的方法
公开(公告)号：US20080152792A1
公开(公告)日：2008-06-26
申请号：US11614472
申请日：2006-12-21
申请人： Ke K. Lian , Marc K. Chason
发明人： Ke K. Lian , Marc K. Chason
IPC分类号： B05D5/12
CPC分类号： H01L51/0004 , H01L51/0037 , H01L51/0083 , H01L51/0575
摘要： A stack for a bistable microelectronic switch is fabricated by providing a first metal electrode on a supporting substrate. A bistable macrocyclic compound is printed over the first electrode using a high speed printing process. A conductive polymer is then printed over the bistable macrocyclic compound using a high speed printing process, and a second electrode is then formed on the conductive polymer. Copper phthalocyanine is one bistable compound, and a combination of poly-(3,4-ethylenedioxythiophene) and poly-(styrenesulphonic acid) is the conductive polymer. The upper and lower electrodes are formed in a crossbar formation to create an addressable random access memory device. When a voltage less than a switching voltage is applied between two intersecting electrodes, the resistance is very high, and when a voltage greater than the switching voltage is applied, the resistance is generally two orders of magnitude lower.
摘要翻译：通过在支撑衬底上设置第一金属电极来制造用于双稳态微电子开关的堆叠。使用高速印刷方法将双稳态大环化合物印刷在第一电极上。然后使用高速印刷方法将导电聚合物印刷在双稳态大环化合物上，然后在导电聚合物上形成第二电极。铜酞菁是一种双稳态化合物，聚（3,4-亚乙基二氧噻吩）和聚（苯乙烯磺酸）的组合是导电聚合物。上电极和下电极形成在横梁结构中以产生可寻址随机存取存储器件。当在两个相交电极之间施加小于开关电压的电压时，电阻非常高，当施加大于开关电压的电压时，电阻通常比两个数量级更低。

3. 发明授权

US07199724B2 Method and apparatus to aide in emergency egress 有权
标题翻译：紧急出口方式和设备
公开(公告)号：US07199724B2
公开(公告)日：2007-04-03
申请号：US11130648
申请日：2005-05-17
申请人： Janice M. Danvir , Marc K. Chason , Katherine M. Devanie , David A. Hume
发明人： Janice M. Danvir , Marc K. Chason , Katherine M. Devanie , David A. Hume
IPC分类号： G08B3/00 , G08B5/00 , G08B7/00
CPC分类号： G08B7/062 , G08B7/066
摘要： A method and apparatus are provided to aide in emergency egress of a structure. More particularly, egress indicators are co-located with hazard sensors. During detection of a hazard condition, locations of sensors detecting the hazard are identified and a pathway directing traffic away from the hazard is determined. Finally, the egress indicators are operated to direct traffic down the determined pathway.
摘要翻译：提供了一种在结构的紧急出口中辅助的方法和装置。更特别地，出口指示器与危险传感器共处。在检测到危险状况时，识别出检测到危险的传感器的位置，并确定了将危险行驶的路径指向。最后，出口指示器被操作以将流量导向确定的路径。

4. 发明授权

US5248851A Pseudo-rod fabricated from discrete planar conductors 失效
标题翻译：由分立的平面导体制造的伪棒
公开(公告)号：US5248851A
公开(公告)日：1993-09-28
申请号：US985247
申请日：1992-12-02
申请人： Marc K. Chason , Richard S. Kommrusch , Pankaj B. Desai
发明人： Marc K. Chason , Richard S. Kommrusch , Pankaj B. Desai
IPC分类号： H01L39/14
CPC分类号： H01L39/14 , H01L39/143 , Y10S505/704 , Y10S505/884 , Y10S505/886 , Y10S505/887
摘要： A pseudo rod, fabricated from several plate sections joined together at their edges and having a cross-section resembling a polygon approximates a rod having a circular cross section. Using multiple plates joined at their edges permits growing a crystalline material on the planar faced substrates and if the plates are crystalline material, the crystalline material grown thereon can have improved current carrying capability.
摘要翻译：由几个平板部分制成的假杆在其边缘处连接在一起并且具有类似多边形的横截面近似于具有圆形横截面的杆。使用在其边缘连接的多个板允许在平面的基板上生长结晶材料，并且如果板是结晶材料，则其上生长的结晶材料可以具有改善的载流能力。

5. 发明授权

US4639631A Electrostatically sealed piezoelectric device 失效
标题翻译：静电密封压电器件
公开(公告)号：US4639631A
公开(公告)日：1987-01-27
申请号：US750455
申请日：1985-07-01
申请人： Marc K. Chason , Carl A. Kotecki , Joseph P. Tomase , Michael J. Onystok , Donald J. Ryback , Robert G. Kinsman , Lawrence N. Dworsky , Kenneth J. Nield , Steven C. Moore
发明人： Marc K. Chason , Carl A. Kotecki , Joseph P. Tomase , Michael J. Onystok , Donald J. Ryback , Robert G. Kinsman , Lawrence N. Dworsky , Kenneth J. Nield , Steven C. Moore
IPC分类号： H03H9/02 , H01L41/053 , H03H9/10 , H01L41/08
CPC分类号： H03H9/1014 , H03H9/1021
摘要： A piezoelectric device package consists of a base and a cover which are sealed together to hermetically seal a piezoelectric device such as a quartz crystal therebetween. A recess in the cover receives the quartz crystal. Feedthrough holes in the base, or the cover, or both, which have electrostatic seals formed over them provide a means for making electrical connections with the quartz wafer while still maintaining the hermetic seal.
摘要翻译：一种压电器件封装由基底和盖子组成，它们密封在一起以密封其间的石英晶体等压电器件。盖中的凹槽接收石英晶体。底部或盖子中的穿通孔，其上形成有静电密封件，提供了与石英晶片进行电连接同时仍然保持气密密封的装置。

6. 发明授权

US5173836A Hermetically sealed interface 失效
标题翻译：密封接口
公开(公告)号：US5173836A
公开(公告)日：1992-12-22
申请号：US846109
申请日：1992-03-05
申请人： Joseph P. Tomase , Shiuh-Hui Chen , Gregory D. Stamm , Marc K. Chason
发明人： Joseph P. Tomase , Shiuh-Hui Chen , Gregory D. Stamm , Marc K. Chason
IPC分类号： G01L9/00
CPC分类号： G01L9/0042 , Y10T29/43
摘要： A hermetically sealed interface is constructed with a substrate (101) having a first surface (103) with a first orifice (201). The substrate (101) also has an opposing second surface (105) with a second orifice (205). The first and second orifices (201, 205) are connected via a passageway (107). The passageway (107) has an inner surface (209) with a first metal coating (111). The first metal coating (111) and the substrate (101) provide a first predetermined thermal coefficient of expansion for the passageway (107). A plug (221) with an outer surface (223) has a second metal coating (225). The second metal coating (225) and the plug (221) provide a second predetermined thermal coefficient of expansion substantially similar to the first predetermined thermal coefficient of expansion of the passageway (107). The plug (221) is disposed in the passageway (107) of the substrate (101). The first metal coating (111), of the inner surface ( 209) of the passageway (107), and the second metal coating (225), of the outer surface (223) of the plug (221), are bonded together and provide, with the plug, (221) a hermetic barrier between the first and second orifices (201, 205) of the substrate (101). Preferably, this hermetically sealed interface is used in a capacitive pressure sensor.
摘要翻译：密封界面由具有第一孔（101）的第一表面（103）的基底（101）构成。衬底（101）还具有带有第二孔口（205）的相对的第二表面（105）。第一和第二孔（201,205）经由通道（107）连接。通道（107）具有带有第一金属涂层（111）的内表面（209）。第一金属涂层（111）和基板（101）为通道（107）提供第一预定的热膨胀系数。具有外表面（223）的插头（221）具有第二金属涂层（225）。第二金属涂层（225）和插塞（221）提供基本上类似于通道（107）的第一预定热膨胀系数的第二预定热膨胀系数。插头（221）设置在基板（101）的通路（107）中。插头（221）的外表面（223）的通道（107）的内表面（209）和第二金属涂层（225）的第一金属涂层（111）结合在一起并提供，其中所述插头（221）在所述基板（101）的所述第一和第二孔（201,205）之间具有密封屏障。优选地，该密封接口用于电容式压力传感器。

7. 发明授权

US5083236A Inductor structure with integral components 失效
标题翻译：具有整体元件的电感结构
公开(公告)号：US5083236A
公开(公告)日：1992-01-21
申请号：US589954
申请日：1990-09-28
申请人： Marc K. Chason , Robert A. Kellen , Leng H. Ooi , George Revtai
发明人： Marc K. Chason , Robert A. Kellen , Leng H. Ooi , George Revtai
IPC分类号： H01F17/00 , H05K1/02 , H05K1/03 , H05K1/14 , H05K1/16 , H05K1/18
CPC分类号： H05K1/186 , H01F17/0006 , H05K1/0243 , H05K1/144 , H05K1/165 , H05K1/0237 , H05K1/0306 , H05K2201/0715 , H05K2201/09254 , H05K2201/10015 , H05K2201/10166 , H05K2201/10689
摘要： An inductor structure, that houses a shorted transmission line inductor, includes components mounted within the volume carrying the shorted transmission line. Dielectric substrate layers which carry the shorted transmission line components and the electronic devices when sandwiched together can be coated with a metallic layer that acts as a shield protecting the internal components from external undesired sources. Mounting components within the inductor volume potentially saves space on a circuit board.
摘要翻译：容纳短路传输线电感器的电感器结构包括安装在承载短路传输线的体积内的部件。携带短路传输线部件和电子器件夹在一起的电介质基底层可以涂覆有金属层，该金属层用作保护内部组件免受外部不希望的源的屏蔽。电感体积内的安装元件可以节省电路板上的空间。

8. 发明授权

US5659457A Carbon electrodes and energy storage device made thereof 失效
标题翻译：碳电极及储能装置
公开(公告)号：US5659457A
公开(公告)日：1997-08-19
申请号：US418353
申请日：1995-04-07
申请人： Keryn Ke Lian , Changming Li , Lijun Bai , Marc K. Chason
发明人： Keryn Ke Lian , Changming Li , Lijun Bai , Marc K. Chason
IPC分类号： H01G9/00 , H01G9/155
CPC分类号： H01G9/155 , Y02E60/13
摘要： An electrode for an energy storage device uses a protonated polymer that is imbedded with an electroactive metal and coated onto activated carbon. Protonated poly(4-vinylpyridine) is coated onto particles of activated carbon that have high surface area, and the coating is then imbedded with a metal that exhibits electroactive behavior. In one embodiment, ruthenium is plated onto the poly(4-vinylpyridine) to create the electrode. Optionally, a coating of an ionically conductive negatively charged polymer is applied over the ruthenium-imbedded coating. The improved electrode is used to make a capacitor.
摘要翻译：用于能量存储装置的电极使用嵌入有电活性金属并涂覆在活性炭上的质子化聚合物。将质子化聚（4-乙烯基吡啶）涂覆到具有高表面积的活性炭颗粒上，然后用显示电活性的金属嵌入涂层。在一个实施方案中，将钌镀在聚（4-乙烯基吡啶）上以产生电极。任选地，在钌嵌入的涂层上施加离子导电的带负电荷的聚合物的涂层。改进的电极用于制造电容器。

9. 发明授权

US5120705A Superconducting transmission line cable connector providing capacative and thermal isolation 失效
标题翻译：超导传输线电缆连接器提供电容和热隔离
公开(公告)号：US5120705A
公开(公告)日：1992-06-09
申请号：US571390
申请日：1990-08-22
申请人： Allen L. Davidson , Marc K. Chason
发明人： Allen L. Davidson , Marc K. Chason
IPC分类号： H01R4/68 , H01B12/02 , H01P1/04 , H01R24/02 , H04B3/00
CPC分类号： H01P1/045 , Y10S505/704 , Y10S505/866 , Y10S505/885 , Y10S505/886
摘要： A transmission line using superconductors instead of conventional conductors substantially reduces ohmic losses compared to conventional conductors. The superconductors are cooled by refrigerant flowing through a hollow superconducting inner conductor. The refrigerant is transported to the inner conductor using a novel connector.
摘要翻译：使用超导体代替常规导体的传输线与常规导体相比基本上降低了欧姆损耗。超导体被流过中空超导内导体的制冷剂冷却。使用新的连接器将制冷剂输送到内导体。

10. 发明授权

US4948030A Bond connection for components 失效
标题翻译：组件的连接连接
公开(公告)号：US4948030A
公开(公告)日：1990-08-14
申请号：US304052
申请日：1989-01-30
申请人： Marc K. Chason , Michael J. Onystok , Nathan P. Bellin
发明人： Marc K. Chason , Michael J. Onystok , Nathan P. Bellin
IPC分类号： B23K1/20 , H05K3/34
CPC分类号： H05K3/3426 , B23K1/20 , H01L2924/00013 , H05K2201/10689 , H05K2201/10909 , H05K2201/2081 , H05K2203/107 , H05K3/3494 , Y02P70/613
摘要： An electrical joint using spheroidal tipped leads improves the strength of a connection regardless of the material used to bond the connections. Axial leads of a component are formed into spheroids using an appropriate heat source to melt a small portion of the lead tip. Melting a portion of the lead alloys the lead with any non-wettable solder mask rendering a wettable spheroid. Surface tension in the molten metal forms the spheroid. The spheroid increases the area to which solder or other bonding agent adheres to. Solder mask remaining on the lead decreases solder wicking further up the lead. Reduced solder wicking retains the compliance of the lead. Controlled melting of the lead maintains planarity for multileaded components.
摘要翻译：使用球形尖端的电接头改善了连接的强度，而不管用于粘接连接的材料如何。使用适当的热源将部件的轴向引线形成为球体，以熔化引导尖端的一小部分。用引导可湿性球体的任何不可润湿的焊接掩模来熔化铅合金的一部分。熔融金属中的表面张力形成球体。球体增加焊料或其他粘合剂粘附到的面积。导线上残留的焊盘会使引线上的焊锡芯线进一步上升。减少焊锡芯吸保持铅的顺应性。铅的控制熔化保持了多层组件的平面性。

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