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1. 发明申请

US20110070775A1 DELAYED CONTACT ACTION CONNECTOR 失效
标题翻译：延迟接触动作连接器
公开(公告)号：US20110070775A1
公开(公告)日：2011-03-24
申请号：US12563351
申请日：2009-09-21
申请人： H. John Healey , Emanuele F. Lopergolo , Prabjit Singh
发明人： H. John Healey , Emanuele F. Lopergolo , Prabjit Singh
IPC分类号： H01R4/48 , H01R24/00
CPC分类号： H01R12/87 , H01R12/714 , H01R12/721 , H01R12/88 , H01R13/11 , H01R13/7036
摘要： A connector having a plurality of terminals for connecting to a circuit card and a method therefore are disclosed. The connector includes a socket having a casing with an aperture for receiving the circuit card therein and a plurality of terminals made of electrically conductive material. At least one of the plurality of terminals includes an elongated portion and a substantially L-shaped portion joined together by a U-shaped portion. The elongated portion has a proximal end and a distal end, and includes a support section and a bending section between the proximal end and the distal end. The terminal is secured to the casing by the support section at or near the proximal end of the elongated portion. The U-shaped portion is disposed at the distal end of the elongated portion. The terminal continues from the U-shaped portion to a region approximately halfway towards the proximal end of the elongated portion and turns away from the elongated portion thereby forming the substantially L-shaped portion. The L-shaped portion ends in a lip section curving towards the proximal end of the elongated portion.
摘要翻译：公开了一种具有用于连接到电路卡的多个端子的连接器及其方法。连接器包括具有壳体的插座，其具有用于在其中接收电路卡的孔，以及由导电材料制成的多个端子。多个端子中的至少一个端子包括由U形部分连接在一起的细长部分和大致L形部分。细长部分具有近端和远端，并且包括支撑部分和在近端和远端之间的弯曲部分。端子通过支撑部分在细长部分的近端处或附近固定到壳体。 U形部分设置在细长部分的远端处。端子从U形部分延伸到近似于长形部分的近端的一半的区域，并且远离细长部分，从而形成大致L形的部分。 L形部分在朝向细长部分的近端弯曲的唇部中终止。

2. 发明授权

US08662931B2 Delayed contact action connector 失效
标题翻译：延迟接触动作连接器
公开(公告)号：US08662931B2
公开(公告)日：2014-03-04
申请号：US13540522
申请日：2012-07-02
申请人： H. John Healey , Emanuele F. Lopergolo , Prabjit Singh
发明人： H. John Healey , Emanuele F. Lopergolo , Prabjit Singh
IPC分类号： H01R24/00
CPC分类号： H01R12/87 , H01R12/714 , H01R12/721 , H01R12/88 , H01R13/11 , H01R13/7036
摘要： A method for using a connector with terminals for connecting to a circuit card. The connector includes a socket having a casing with an aperture for receiving the circuit card therein and electrically conductive terminals. The terminals include an elongated portion and a substantially L-shaped portion joined together by a U-shaped portion. The elongated portion has a proximal end and a distal end, and includes a support section and a bending section between the proximal end and the distal end. The U-shaped portion is disposed at the distal end of the elongated portion. The terminal continues from the U-shaped portion to approximately halfway towards the proximal end of the elongated portion and turns away from the elongated portion thereby forming the substantially L-shaped portion. The L-shaped portion ends in a lip section curving towards the proximal end of the elongated portion.
摘要翻译：一种使用带端子的连接器连接到电路卡的方法。连接器包括具有壳体的插座，其具有用于在其中接收电路卡的孔和导电端子。端子包括由U形部分连接在一起的细长部分和大致L形部分。细长部分具有近端和远端，并且包括支撑部分和在近端和远端之间的弯曲部分。 U形部分设置在细长部分的远端。端子从U形部分延伸到近似于长形部分的近端的一半并且远离细长部分，从而形成大致L形的部分。 L形部分在朝向细长部分的近端弯曲的唇部中终止。

3. 发明授权

US08282420B2 Delayed contact action connector 失效
标题翻译：延迟接触动作连接器
公开(公告)号：US08282420B2
公开(公告)日：2012-10-09
申请号：US12563351
申请日：2009-09-21
申请人： H. John Healey , Emanuele F. Lopergolo , Prabjit Singh
发明人： H. John Healey , Emanuele F. Lopergolo , Prabjit Singh
IPC分类号： H01R4/48
CPC分类号： H01R12/87 , H01R12/714 , H01R12/721 , H01R12/88 , H01R13/11 , H01R13/7036
摘要： A connector having a plurality of terminals for connecting to a circuit card and a method therefore are disclosed. The connector includes a socket having a casing with an aperture for receiving the circuit card therein and a plurality of terminals made of electrically conductive material. At least one of the plurality of terminals includes an elongated portion and a substantially L-shaped portion joined together by a U-shaped portion. The elongated portion has a proximal end and a distal end, and includes a support section and a bending section between the proximal end and the distal end. The terminal is secured to the casing by the support section at or near the proximal end of the elongated portion. The U-shaped portion is disposed at the distal end of the elongated portion. The terminal continues from the U-shaped portion to a region approximately halfway towards the proximal end of the elongated portion and turns away from the elongated portion thereby forming the substantially L-shaped portion. The L-shaped portion ends in a lip section curving towards the proximal end of the elongated portion.
摘要翻译：公开了一种具有用于连接到电路卡的多个端子的连接器及其方法。连接器包括具有壳体的插座，其具有用于在其中接收电路卡的孔，以及由导电材料制成的多个端子。多个端子中的至少一个端子包括由U形部分连接在一起的细长部分和大致L形部分。细长部分具有近端和远端，并且包括支撑部分和在近端和远端之间的弯曲部分。端子通过支撑部分在细长部分的近端处或附近固定到壳体。 U形部分设置在细长部分的远端。端子从U形部分延伸到近似于长形部分的近端的一半的区域，并且远离细长部分，从而形成大致L形的部分。 L形部分在朝向细长部分的近端弯曲的唇部中终止。

4. 发明申请

US20110067910A1 COMPONENT SECURING SYSTEM AND ASSOCIATED METHOD 审中-公开
标题翻译：组件安全系统及相关方法
公开(公告)号：US20110067910A1
公开(公告)日：2011-03-24
申请号：US12562499
申请日：2009-09-18
申请人： Michael J. Domitrovits , Emanuele F. Lopergolo , Prabjit Singh
发明人： Michael J. Domitrovits , Emanuele F. Lopergolo , Prabjit Singh
IPC分类号： H05K1/18 , H05K3/30
CPC分类号： H05K3/3421 , H05K3/3452 , H05K2201/10189 , H05K2203/0191 , H05K2203/167 , Y02P70/613 , Y10T29/4913
摘要： A system to secure a component to a circuit board may include a printed circuit board, a surface mounted component, and a lead carried by the surface mounted component. The system may also include a stencil adhered between at least one of the printed circuit board and the surface mounted component, and the lead adjacent the stencil.
摘要翻译：将组件固定到电路板的系统可以包括印刷电路板，表面安装部件和由表面安装部件承载的引线。该系统还可以包括粘附在印刷电路板和表面安装部件中的至少一个之间的模板以及与模板相邻的引线。

5. 发明授权

US08672688B2 Land grid array interposer with compressible conductors 有权
标题翻译：具有可压缩导体的土地栅格阵列插入器
公开(公告)号：US08672688B2
公开(公告)日：2014-03-18
申请号：US13351731
申请日：2012-01-17
申请人： Robert F. Florence, Jr. , Emanuele F. Lopergolo , Prabjit Singh
发明人： Robert F. Florence, Jr. , Emanuele F. Lopergolo , Prabjit Singh
IPC分类号： H01R12/00
CPC分类号： H01R12/52 , H01R12/714
摘要： An electrical interconnect is provided for use within, for example, a land grid array (LGA) interposer such as a module-to-board connector. The electrical interconnect includes an electrically-conductive, compressible conductor which has a first conductor end portion and a second conductor end portion. The first and second conductor end portions physically contact in slidable relation each other with compression of the compressible conductor to facilitate inhibiting rotation of the compressible conductor. In one embodiment, the first end portion includes at least one first leg and the second end portion includes at least two second legs, and the at least one first leg and at least two second legs are interdigitated. Further, in one embodiment, the first end portion and the second end portion are each in slidable contact with an inner-facing surface of the compressible conductor.
摘要翻译：提供电互连以用于例如诸如模块到板连接器的平面栅格阵列（LGA）插入器。电互连包括导电的可压缩导体，其具有第一导体端部和第二导体端部。第一和第二导体端部通过压缩可压缩导体的压缩而以可滑动的关系彼此物理接触，以便于抑制可压缩导体的旋转。在一个实施例中，第一端部包括至少一个第一腿部，并且第二端部部分包括至少两个第二腿部，并且所述至少一个第一腿部和至少两个第二腿部交叉。此外，在一个实施例中，第一端部和第二端部各自与可压缩导体的内表面滑动接触。

6. 发明授权

US07547231B1 Large array connector for coupling wafers with a printed circuit board 失效
标题翻译：用于将晶片与印刷电路板耦合的大阵列连接器
公开(公告)号：US07547231B1
公开(公告)日：2009-06-16
申请号：US12036878
申请日：2008-02-25
申请人： Michael J. Domitrovits , Emanuele F. Lopergolo , Prabjit Singh
发明人： Michael J. Domitrovits , Emanuele F. Lopergolo , Prabjit Singh
IPC分类号： H01R13/648
CPC分类号： H01R12/57 , H01R12/712 , H01R13/504 , H01R13/514
摘要： A large array connector is disclosed. The connector includes a plate comprising front, rear, top, bottom, first side, and second side portions. A plurality of guide blocks provide rigid support to at least the plate. A first guide block is mechanically coupled to a first end of the front portion. A second guide block is mechanically coupled to a second end of the front portion. A plurality of wafers is located between the first guide block and the second guide block. A front portion of each of the wafers is mateable with a mid-plane. A fill material is provided between a first portion of each of the wafers and the front portion of the plate. The fill material substantially mechanically couples the first portion of each of the wafers and the front portion of the plate, and provides rigid support to each of the wafers during plug-in with the mid-plane.
摘要翻译：公开了一种大型阵列连接器。连接器包括一个包括前，后，顶，底，第一侧和第二侧部的板。多个引导块向至少该板提供刚性支撑。第一引导块机械地联接到前部的第一端。第二引导块机械地联接到前部的第二端。多个晶片位于第一引导块和第二引导块之间。每个晶片的前部可与中间平面配合。在每个晶片的第一部分和板的前部之间提供填充材料。填充材料基本上机械地联接每个晶片的第一部分和板的前部，并且在插入中间平面期间为每个晶片提供刚性支撑。

7. 发明授权

US07758390B2 Large array surface mount technology connector cradle assembly 失效
标题翻译：大型阵列表面贴装技术连接器支架组件
公开(公告)号：US07758390B2
公开(公告)日：2010-07-20
申请号：US12036933
申请日：2008-02-25
申请人： Michael J. Domitrovits , Emanuele F. Lopergolo , Prabjit Singh , Joseph J. George
发明人： Michael J. Domitrovits , Emanuele F. Lopergolo , Prabjit Singh , Joseph J. George
IPC分类号： H01R9/22
CPC分类号： H01R13/514 , H01R12/712
摘要： A large array connector assembly for containing a plurality of wafers is disclosed. The large array connector assembly includes a plurality of guide blocks that includes first and second guide blocks. The first guide block being located at a first end of the assembly. The second guide block being located at a second end of the assembly. A first plate is mechanically coupled to a first portion of the first guide block and a first portion of the second guide block. The first plate includes a plurality of slots each for receiving a tab extending from a corresponding wafer so as to substantially prevent movement of the corresponding wafer in first and second directions while allowing a given degree of movement in a third direction. A second plate is mechanically coupled to a second portion of the first guide block and a second portion of the second guide block.
摘要翻译：公开了一种用于容纳多个晶片的大阵列连接器组件。大阵列连接器组件包括多个引导块，其包括第一和第二引导块。第一引导块位于组件的第一端。第二引导块位于组件的第二端。第一板被机械联接到第一引导块的第一部分和第二引导块的第一部分。第一板包括多个槽，每个槽用于接收从相应的晶片延伸的突出部，以便基本上防止相应的晶片在第一和第二方向上移动，同时允许沿第三方向的给定程度的运动。第二板机械地联接到第一引导块的第二部分和第二引导块的第二部分。

8. 发明申请

US20090215289A1 LARGE ARRAY SURFACE MOUNT TECHNOLOGY CONNECTOR CRADLE ASSEMBLY 失效
标题翻译：大阵列表面安装技术连接器组件
公开(公告)号：US20090215289A1
公开(公告)日：2009-08-27
申请号：US12036933
申请日：2008-02-25
申请人： MICHAEL J. DOMITROVITS , Emanuele F. Lopergolo , Prabjit Singh , Joseph J. George
发明人： MICHAEL J. DOMITROVITS , Emanuele F. Lopergolo , Prabjit Singh , Joseph J. George
IPC分类号： H01R12/00
CPC分类号： H01R13/514 , H01R12/712
摘要： A large array connector assembly for containing a plurality of wafers is disclosed. The large array connector assembly includes a plurality of guide blocks that includes first and second guide blocks. The first guide block being located at a first end of the assembly. The second guide block being located at a second end of the assembly. A first plate is mechanically coupled to a first portion of the first guide block and a first portion of the second guide block. The first plate includes a plurality of slots each for receiving a tab extending from a corresponding wafer so as to substantially prevent movement of the corresponding wafer in first and second directions while allowing a given degree of movement in a third direction. A second plate is mechanically coupled to a second portion of the first guide block and a second portion of the second guide block.
摘要翻译：公开了一种用于容纳多个晶片的大阵列连接器组件。大阵列连接器组件包括多个引导块，其包括第一和第二引导块。第一引导块位于组件的第一端。第二引导块位于组件的第二端。第一板被机械联接到第一引导块的第一部分和第二引导块的第一部分。第一板包括多个槽，每个槽用于接收从相应的晶片延伸的突出部，以便基本上防止相应的晶片在第一和第二方向上移动，同时允许沿第三方向的给定程度的运动。第二板机械地联接到第一引导块的第二部分和第二引导块的第二部分。

9. 发明授权

US6051119A Plating structure for a pin grid array package 失效
标题翻译：针阵列封装的电镀结构
公开(公告)号：US6051119A
公开(公告)日：2000-04-18
申请号：US5873
申请日：1998-01-12
申请人： Paul F. Findeis , Kenneth R. Idler , Minkailu A. Jalloh , Thomas A. Kelly , Emanuele F. Lopergolo
发明人： Paul F. Findeis , Kenneth R. Idler , Minkailu A. Jalloh , Thomas A. Kelly , Emanuele F. Lopergolo
IPC分类号： C25D17/00 , H01L21/48 , C25D17/04
CPC分类号： H01L21/4889 , C25D17/005 , Y10T29/49117
摘要： Disclosed is a plating structure including a substrate having a plurality of pins to be plated and a metallic plating screen having a plurality of apertures, wherein each of the apertures has at least two tabs spaced apart from each other, wherein the metallic plating screen is placed over the pins so that at least two pins penetrate each aperture, each of the pins contacting a tab of the aperture. Also disclosed is a method of electrolytically plating a plurality of pins utilizing the above metallic plating screen.
摘要翻译：公开了一种电镀结构，包括具有多个要被电镀的引脚的基板和具有多个孔的金属电镀屏，其中每个孔具有彼此间隔开的至少两个突片，其中金属电镀屏被放置使得至少两个销穿过每个孔，每个销接触孔的突片。还公开了利用上述金属电镀屏幕对多个销进行电解电镀的方法。

10. 发明授权

US07505251B2 Actuation mechanism for mating electronic card interconnect systems 有权
标题翻译：配电电子卡互连系统的启动机制
公开(公告)号：US07505251B2
公开(公告)日：2009-03-17
申请号：US11262047
申请日：2005-10-28
申请人： Shawn M. Canfield , John J. Loparco , Emanuele F. Lopergolo , Budy D. Notohardjono , Michael T. Peets , John G. Torok
发明人： Shawn M. Canfield , John J. Loparco , Emanuele F. Lopergolo , Budy D. Notohardjono , Michael T. Peets , John G. Torok
IPC分类号： G06F1/16
CPC分类号： H05K5/0217
摘要： An actuation assembly and method is provided for mating electronic unto a computer rack comprising a main housing engageably securable to a slide assembly. The slide assembly is capable of being secured to a side of the computer rack and having sliding features such that the slide assembly and the main housing when engaged can be telescoped out or returned to a closed position. The main housing having a vertical wedge for securing said assembly to said rack more securely and a drive wedge for moving the vertical wedge such that it can telescope into and out of said rack with said slide mechanism via a lead screw.
摘要翻译：提供了一种用于将电子装配到计算机机架的致动组件和方法，所述计算机机架包括可接合地固定到滑动组件的主壳体。滑动组件能够被固定到计算机机架的一侧并且具有滑动特征，使得当接合时滑动组件和主壳体可以伸缩或返回到关闭位置。主壳体具有用于将所述组件更牢固地固定到所述机架上的垂直楔块，以及用于移动垂直楔块的驱动楔块，使得其可以通过导螺杆用所述滑动机构望远镜进入和离开所述齿条。

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