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1. 发明申请

US20070097605A1 Actuation mechanism for mating electronic card interconnect systems 有权
标题翻译：配电电子卡互连系统的启动机制
公开(公告)号：US20070097605A1
公开(公告)日：2007-05-03
申请号：US11262047
申请日：2005-10-28
申请人： Shawn Canfield , John Loparco , Emanuele Lopergolo , Budy Notohardjono , Michael Peets , John Torok
发明人： Shawn Canfield , John Loparco , Emanuele Lopergolo , Budy Notohardjono , Michael Peets , John Torok
IPC分类号： H05K5/00
CPC分类号： H05K5/0217
摘要： An actuation assembly and method is described for a computing environment comprising a main housing and a (first) wedge complementary to the main housing. This wedge is connected to the housing at least partially such that this wedge and the main housing form a unitary housing entity. The wedge is also formed such as to house a lead screw on one of its sides. A plurality of slide mechanisms is also provided. The slide mechanism is connected to opposing sides of the main housing and the wedge. A drive wedge is also provided. The drive wedge is connected to the main housing and the first wedge and formed such that it can be moved from a first position to a second position via a lead screw.
摘要翻译：描述了一种用于包括主壳体和与主壳体互补的（第一）楔）的计算环境的致动组件和方法。该楔形件至少部分地连接到壳体，使得该楔形件和主壳体形成整体式壳体实体。楔形物也形成为在其一侧上容纳导螺杆。还提供了多个滑动机构。滑动机构连接到主壳体和楔块的相对侧。还提供驱动楔。驱动楔连接到主壳体和第一楔形件并且形成为使得其可以经由导螺杆从第一位置移动到第二位置。

2. 发明申请

US20070095774A1 Integrated frame and central electronic complex structure 失效
标题翻译：集成框架和中央电子复合结构
公开(公告)号：US20070095774A1
公开(公告)日：2007-05-03
申请号：US11262051
申请日：2005-10-28
申请人： Shawn Canfield , John Loparco , Budy Notohardjono , John Torok
发明人： Shawn Canfield , John Loparco , Budy Notohardjono , John Torok
IPC分类号： A47B47/00
CPC分类号： H05K7/183
摘要： A method and incorporated assembly is provided that can be quickly assembled and disassembled inside side racks used for purpose of housing computer systems. The assembly comprises a plurality of side plates that can be secured to inside rack sides, preferably through flexible flanges, a plurality of top and bottom plates that can be secured to the side plates, and a mid-plate is disposed substantially horizontally between the top and bottom plates. Alternately, the assembly can also comprise at least one rear plate that can be secured to the side plates to provide a third side for the assembly. In one embodiment, the rear plates have openings designed to allow for front to back air flow ventilation. In another embodiment the assembly further comprises at least one divider plate, and preferably a plurality of divider plates, that can be secured to the top and bottom and/or mid-plate(s). In such a case, the divider plates are disposed above and/or below the mid-plate and preferably each comprise of upper and lower divider plates.
摘要翻译：提供了一种方法和组合的组件，其可以在用于容纳计算机系统的侧面机架中快速组装和拆卸。组件包括多个侧板，其可以优选地通过柔性凸缘固定在机架侧面内;多个顶板和底板可固定到侧板，中间板基本上水平地设置在顶部和底板。或者，组件还可以包括至少一个后板，其可固定到侧板以提供用于组件的第三侧。在一个实施例中，后板具有设计成允许前后空气流通气的开口。在另一个实施例中，组件还包括至少一个分隔板，并且优选地多个分隔板，其可固定到顶部和底部和/或中间板。在这种情况下，分隔板设置在中间板的上方和/或下方，并且优选地每个包括上部和下部分隔板。

3. 发明申请

US20070095569A1 Enhanced blind-mated input/output card cassette packaging concept 有权
标题翻译：增强盲插输入/输出卡片盒包装概念
公开(公告)号：US20070095569A1
公开(公告)日：2007-05-03
申请号：US11262050
申请日：2005-10-28
申请人： Gary Goth , John Loparco , Andrew Rybak , John Torok
发明人： Gary Goth , John Loparco , Andrew Rybak , John Torok
IPC分类号： H01L23/28
CPC分类号： H05K7/1487
摘要： An improved method and a cassette assembly for protecting electronic components, comprising of a housing that encloses the electronic components disposed over an insulator. The housing also encases a scissor jack component that can move from a first to a second position to enable actuation and unmating of the cassette assembly, such as to a next level of packaging. The housing has an overhang design, having complementary upper openings and lower cable shroud areas for supporting cable connections and for providing heat dissipation relief and EMC containment. Alternate designs provide for other components such as a honey comb screen and an EMC gasket to further enable EMC containment. In addition, other components such as an actuation trap door, a retention feature and card support members or support struts can be added to the design to enable better actuation and provide for an improved structural rigidity.
摘要翻译：一种改进的方法和用于保护电子部件的盒组件，包括外壳，其包围设置在绝缘体上的电子部件。壳体还包括可从第一位置移动到第二位置的剪刀千斤顶部件，以使得盒组件的致动和脱离能够进入下一级包装。壳体具有突出设计，具有互补的上部开口和下部电缆护罩区域，用于支撑电缆连接并提供散热释放和EMC防护。替代设计提供了其他组件，如蜂窝梳屏和EMC垫片，以进一步实现EMC容纳。此外，可以向设计中添加诸如致动捕获门，保持特征和卡支撑构件或支撑支柱的其它部件，以实现更好的致动并提供改进的结构刚性。

4. 发明申请

US20050146855A1 System and method for aligning and supporting interconnect systems 失效
标题翻译：用于对准和支持互连系统的系统和方法
公开(公告)号：US20050146855A1
公开(公告)日：2005-07-07
申请号：US10752969
申请日：2004-01-07
申请人： George Brehm , Keith Barton , John Loparco , Robert Mullady , John Torok
发明人： George Brehm , Keith Barton , John Loparco , Robert Mullady , John Torok
IPC分类号： H05K5/00 , H05K7/14
CPC分类号： H05K7/1454
摘要： An aligning apparatus comprising: a back plane, the back plane comprising at least one back plane connector; at least one daughter card, the daughter card comprising: a lower edge, the lower edge comprising a scalloped surface proximal to a rear surface of the lower edge, and a ramped surface proximal to a front surface of the lower edge; and a daughter card connector, the daughter card connector configured to be removably connectable to the back plane connector; and at least two guide rails extending from the back plane, the guide rail comprising a rear ramp and a front ramp. A method of aligning a daughter card to a back plane, the method comprising: sliding the daughter card towards the back plane; lifting the front end of the daughter; lifting the back end of the daughter card after lifting the front end of the daughter card; and providing the back end of the daughter card with a degree of freedom to lift and lower in order to align to the back plane, after lifting the back end of the daughter card.
摘要翻译：一种对准装置，包括：背面，所述背面包括至少一个背面连接器; 至少一个子卡，所述子卡包括：下边缘，所述下边缘包括靠近所述下边缘的后表面的扇形表面，以及靠近所述下边缘的前表面的倾斜表面; 和子卡连接器，子卡连接器被配置为可拆卸地连接到背板连接器; 以及从后平面延伸的至少两个导轨，所述导轨包括后斜面和前斜面。一种将子卡对准背板的方法，所述方法包括：将子卡朝着背面平面滑动; 抬起女儿的前端; 抬起子卡前端提起子卡的后端; 并且在提起子卡的后端之后，提供子卡的后端具有提升和降低的自由度以便与背板对准。

5. 发明授权

US07284992B2 Electronic package structures using land grid array interposers for module-to-board interconnection 有权
标题翻译：电子封装结构使用地面栅格阵列插入器进行模块到板的互连
公开(公告)号：US07284992B2
公开(公告)日：2007-10-23
申请号：US11386343
申请日：2006-03-22
申请人： Wiren Dale Becker , William Louis Brodsky , Evan George Colgan , Michael Ford McAllister , Edward Seminaro , John Torok
发明人： Wiren Dale Becker , William Louis Brodsky , Evan George Colgan , Michael Ford McAllister , Edward Seminaro , John Torok
IPC分类号： H01R12/00
CPC分类号： H01L23/49838 , H01L23/3675 , H01L23/42 , H01L23/49816 , H01L23/4985 , H01L2224/16225 , H01L2224/73253 , H01L2924/09701 , H05K1/141 , H05K3/325 , H05K3/368
摘要： Apparatus and methods are provided for constructing electronic package structures using LGA (land grid array) module-to-board connectors that are designed to provide higher count I/O interconnections by expanding LGA area, but without having to increase chip module footprint or reduce the pitch of area array I/O contacts of an LGA interposer or circuit board beyond practical limits.
摘要翻译：提供的装置和方法用于构建使用LGA（地面栅格阵列）模块到板连接器的电子封装结构，其被设计为通过扩展LGA面积来提供更高计数的I / O互连，但不必增加芯片模块占用面积或减少 LGA插入器或电路板的面积阵列I / O触点的间距超出实际限制。

6. 发明申请

US20070224845A1 ELECTRONIC PACKAGE STRUCTURES USING LAND GRID ARRAY INTERPOSERS FOR MODULE-TO-BOARD INTERCONNECTION 有权
标题翻译：电子封装结构使用LAND网格阵列间隔器进行模块间的互连
公开(公告)号：US20070224845A1
公开(公告)日：2007-09-27
申请号：US11386343
申请日：2006-03-22
申请人： Wiren Becker , William Brodsky , Evan Colgan , Michael McAllister , Edward Seminaro , John Torok
发明人： Wiren Becker , William Brodsky , Evan Colgan , Michael McAllister , Edward Seminaro , John Torok
IPC分类号： H01R12/00
CPC分类号： H01L23/49838 , H01L23/3675 , H01L23/42 , H01L23/49816 , H01L23/4985 , H01L2224/16225 , H01L2224/73253 , H01L2924/09701 , H05K1/141 , H05K3/325 , H05K3/368
摘要： Apparatus and methods are provided for constructing electronic package structures using LGA (land grid array) module-to-board connectors that are designed to provide higher count I/O interconnections by expanding LGA area, but without having to increase chip module footprint or reduce the pitch of area array I/O contacts of an LGA interposer or circuit board beyond practical limits.
摘要翻译：提供的装置和方法用于构建使用LGA（地面栅格阵列）模块到板连接器的电子封装结构，其被设计为通过扩展LGA面积来提供更高计数的I / O互连，但不必增加芯片模块占用面积或减少 LGA插入器或电路板的面积阵列I / O触点的间距超出实际限制。

7. 发明申请

US20070052111A1 LAND GRID ARRAY INTERPOSER COMPRESSIVE LOADING SYSTEM 失效
标题翻译： LAND网格阵列插座压缩装载系统
公开(公告)号：US20070052111A1
公开(公告)日：2007-03-08
申请号：US11162389
申请日：2005-09-08
申请人： David Long , William Brodsky , Jason Miller , John Torok , Jeffrey Zitz
发明人： David Long , William Brodsky , Jason Miller , John Torok , Jeffrey Zitz
IPC分类号： H01L23/48
CPC分类号： H01L23/4093 , H01L23/16 , H01L2224/16 , H01L2224/32014 , H01L2224/73253 , H01L2924/01005 , H01L2924/01033 , H01L2924/14 , H01L2924/15787 , H01L2924/16152 , H01L2924/00
摘要： An electronic module and a method of assembling the electronic module. A circuit board is connected to a chip substrate by an array of connectors, and a base member is on the side of the circuit board away from the chip substrate and connector array. An elastomeric structure is placed between the circuit board and the base member. The elastomeric structure has voids between a first defining plane adjacent the circuit board and a second defining plane adjacent the base member, with the voids adapted to permit local deformation of elastomeric material in the structure. The method includes applying a compressive force between the circuit board and base member to at least partially compressing the elastomeric structure to improve load equalization on the circuit board.
摘要翻译：电子模块和组装电子模块的方法。电路板通过连接器阵列连接到芯片基板，并且基座部件位于电路板的远离芯片基板和连接器阵列的一侧。弹性体结构被放置在电路板和基底构件之间。弹性体结构在邻近电路板的第一限定平面和邻近基底构件的第二限定平面之间具有空隙，空隙适于允许弹性材料在结构中的局部变形。该方法包括在电路板和基底构件之间施加压缩力以至少部分地压缩弹性体结构以改善电路板上的负载均衡。

8. 发明申请

US20060260123A1 Land grid array structures and methods for engineering change 有权
标题翻译：土地格栅阵列结构和工程变更方法
公开(公告)号：US20060260123A1
公开(公告)日：2006-11-23
申请号：US11414020
申请日：2006-04-28
申请人： Michael McAllister , John Torok
发明人： Michael McAllister , John Torok
IPC分类号： H05K3/10
CPC分类号： H05K3/225 , H05K1/0231 , H05K1/0292 , H05K1/141 , H05K3/321 , H05K2201/09309 , H05K2201/0959 , H05K2201/10378 , H05K2201/10719 , Y10T29/49126 , Y10T29/49147 , Y10T29/49155 , Y10T29/49718 , Y10T29/4973 , Y10T29/49737
摘要： A Land Grid Array structure is enhanced with a flex film interposer that not only provides a Land Grid Array (LGA) electrical connection between a Multi-Chip Module (MCM) and the next level of integration such as a system board, but also provides a reliable means to implement desired Engineering Change (EC) capability as well as a means for decoupling power to ground structure to minimize switching activity effects on the System. The invention as described can be implemented for EC repair, for Capacitive Decoupling or both, using a removable and restorable engineering change plug.
摘要翻译：使用柔性膜插入器增强了栅格阵列结构，不仅在多芯片模块（MCM）和下一级集成（例如系统板）之间提供了一个栅格阵列（LGA）电连接，而且提供了一个可靠的手段来实现所需的工程变更（EC）能力，以及将功率与地面结构分离的手段，以最小化对系统的开关活动影响。所描述的发明可以实现用于EC修复，用于电容去耦或两者，使用可拆卸和可恢复的工程更换插头。

9. 发明授权

US4317748A Process for the preparation of supported nickel catalysts 失效
标题翻译：负载型镍催化剂的制备方法
公开(公告)号：US4317748A
公开(公告)日：1982-03-02
申请号：US200181
申请日：1980-10-24
申请人： John Torok , Eugene F. McCaffrey , Roland H. Riem , Wing S. Cheung
发明人： John Torok , Eugene F. McCaffrey , Roland H. Riem , Wing S. Cheung
IPC分类号： B01J23/755 , B01J37/20 , B01J23/74
CPC分类号： B01J37/20 , B01J23/755
摘要： Highly effective supported nickel catalysts having finely divided metallic nickel deposited thereon and high specific metal surface areas are obtained by a process wherein a support material is contacted with a nickel soap in an inert hydrocarbon and the resulting nickel-bearing support subsequently subjected to a sulfiding step followed by reductive treatment. The present catalyst compositions are useful as hydrogenation catalysts, particularly for the hydrogenation of fatty materials.
摘要翻译：通过其中支撑材料与惰性烃中的镍皂接触的方法获得具有沉积在其上的细分金属镍和高比金属表面积的高效负载型镍催化剂，随后将所得的含镍载体进行硫化步骤其次是还原治疗。本发明的催化剂组合物可用作氢化催化剂，特别是用于脂肪材料的氢化。

10. 发明申请

US20070232090A1 Space transforming land grid array interposers 有权
标题翻译：空间变换土地格栅阵列插值
公开(公告)号：US20070232090A1
公开(公告)日：2007-10-04
申请号：US11395355
申请日：2006-03-31
申请人： Evan Colgan , Paul Coteus , Hubert Harrer , Gareth Hougham , John Magerlein , John Torok
发明人： Evan Colgan , Paul Coteus , Hubert Harrer , Gareth Hougham , John Magerlein , John Torok
IPC分类号： H01R12/00
CPC分类号： H05K1/141 , H01L23/13 , H01L23/49811 , H01L23/49838 , H01L2224/16225 , H01L2224/73253 , H01L2924/09701 , H01L2924/3011 , H01R12/7082 , H01R13/2414 , H05K2201/0367 , H05K2201/049 , H05K2201/10378 , H05K2201/10719
摘要： LGA (land grid array) interposers having variable pitch connectors and distribution wiring to support space transforming I/O interconnections between first level chip modules and second level packaging. Apparatus and methods for constructing high-performance electronic modules (such as processor modules for computer systems) using LGA interposers that provide space transform I/O interconnections between fine pitch I/O contacts on a chip module and coarse pitch contacts on a circuit board.
摘要翻译：具有可变节距连接器和配线的LGA（地面栅格阵列）插入器，以支持第一级芯片模块与第二级封装之间的空间转换I / O互连。使用LGA插入器构建高性能电子模块（例如计算机系统的处理器模块）的装置和方法，其提供芯片模块上的精细间距I / O触点与电路板上的粗略俯仰触点之间的空间变换I / O互连。

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