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    • 7. 发明申请
    • APPARATUS AND METHOD FOR TREATING A SUBSTRATE WITH UV RADIATION USING PRIMARY AND SECONDARY REFLECTORS
    • 用初级和次级反射器处理具有紫外线辐射的基板的装置和方法
    • US20070257205A1
    • 2007-11-08
    • US11686878
    • 2007-03-15
    • Juan Rocha-AlvarezThomas NowakDale Du BoisSanjeev BalujaScott HendricksonDustin HoAndrzei KaszubaTom Cho
    • Juan Rocha-AlvarezThomas NowakDale Du BoisSanjeev BalujaScott HendricksonDustin HoAndrzei KaszubaTom Cho
    • B01J19/08
    • B05D3/067
    • Embodiments of the invention relate generally to an ultraviolet (UV) cure chamber for curing a dielectric material disposed on a substrate and to methods of curing dielectric materials using UV radiation. A substrate processing tool according to one embodiment comprises a body defining a substrate processing region; a substrate support adapted to support a substrate within the substrate processing region; an ultraviolet radiation lamp spaced apart from the substrate support, the lamp configured to transmit ultraviolet radiation to a substrate positioned on the substrate support; and a motor operatively coupled to rotate at least one of the ultraviolet radiation lamp or substrate support at least 180 degrees relative to each other. The substrate processing tool may further comprise one or more reflectors adapted to generate a flood pattern of ultraviolet radiation over the substrate that has complementary high and low intensity areas which combine to generate a substantially uniform irradiance pattern if rotated. Other embodiments are also disclosed.
    • 本发明的实施方案一般涉及用于固化设置在基底上的介电材料的紫外(UV)固化室和使用UV辐射固化电介质材料的方法。 根据一个实施例的基板处理工具包括限定基板处理区域的主体; 衬底支撑件,适于支撑衬底处理区域内的衬底; 与衬底支撑件间隔开的紫外线辐射灯,所述灯被配置为将紫外线辐射透射到位于所述衬底支撑件上的衬底; 以及可操作地耦合以使所述紫外线辐射灯或衬底支撑体中的至少一个相对于彼此旋转至少180度的电动机。 衬底处理工具还可以包括一个或多个反射器,其适于在衬底上产生具有互补的高和低强度区域的紫外线辐射的泛化图案,其结合以在旋转时产生基本上均匀的辐照度图案。 还公开了其他实施例。
    • 9. 发明授权
    • Vaporization of precursors at point of use
    • 前体在使用点的蒸发
    • US06443435B1
    • 2002-09-03
    • US09695488
    • 2000-10-23
    • Scott Hendrickson
    • Scott Hendrickson
    • B01F304
    • H01J37/3244C23C16/4485Y10S261/65
    • An apparatus and method for vaporizing and delivering liquid precursors to a processing chamber is provided. In one aspect, the apparatus is a liquid delivery system including a liquid supply, a vaporization assembly fluidicly coupled to the liquid supply, the vaporization assembly consisting essentially of an ampoule and a mass flow controller connected to the ampoule, and a processing chamber fluidicly coupled to the vaporization assembly. The liquid precursor is vaporized in the ampoule. In a preferred embodiment, the ampoule is located adjacent the processing chamber to provide point of use vaporization of the liquid precursor. In another aspect, the method includes providing a liquid supply containing a liquid precursor, delivering the precursor to an ampoule, vaporizing a portion of the liquid precursor in the ampoule, and flowing vaporized precursor to a processing chamber.
    • 提供了一种用于将液体前体蒸发并输送到处理室的设备和方法。 在一个方面,该装置是液体输送系统,其包括液体供应源,流体耦合到液体供应源的汽化组件,蒸发组件基本上由安瓿和连接到安瓿的质量流量控制器组成,以及处理室,其流体耦合 到蒸发组件。 液体前体在安瓿中蒸发。 在优选实施例中,安瓿位于处理室附近以提供液体前体的使用点蒸发。 另一方面,所述方法包括提供含有液体前体的液体供应源,将前体输送到安瓿,蒸发安瓿中的液体前体的一部分,并将蒸发前体流动到处理室。
    • 10. 发明授权
    • Method and apparatus for processing semiconductive wafers
    • 用于处理半导体晶片的方法和设备
    • US06300255B1
    • 2001-10-09
    • US09257467
    • 1999-02-24
    • Shankar VenkatarananScott HendricksonInna ShmurunSon T. Nguyen
    • Shankar VenkatarananScott HendricksonInna ShmurunSon T. Nguyen
    • H01L2131
    • C23C16/45565C23C16/455C23C16/45512
    • There are provided a method and apparatus for forming by chemical vapor deposition on large diameter (e.g., 300 mm) semiconductive wafers thin insulating layers of silicon oxide (SiO2) having high uniformity from rim to rim across any diameter through the centers of the wafers. Such high degree of uniformity of the layers is obtained by directing separately a first reactive gas stream and a second reactive gas stream into close proximity to an exposed surface of a wafer to a be coated by the gasses with an insulating layer, the gas streams when mixed together reacting with each other to deposit an insulating layer on a wafer; forming a whirlpool-like swirling mixture of the first and second gas streams to thoroughly mix together the gasses thereof; forming a highly uniform mixture of the reactive gasses; and promptly flowing the mixture of reactive gasses over and upon the surface of the wafer. The apparatus also provides dual wafer processing chamber cavities.
    • 提供了一种用于通过化学气相沉积在大直径(例如,300mm)半导体晶片上形成薄膜绝缘层的氧化硅(SiO 2)的方法和装置,所述氧化硅(SiO 2)的绝缘层从边缘到边缘具有高度均匀性,并通过晶片中心的任何直径。 通过将第一反应性气体流和第二反应气体流分别靠近晶片的暴露表面引导以由具有绝缘层的气体涂覆而获得这些高度的均匀度,气体流 混合在一起反应以在晶片上沉积绝缘层; 形成第一和第二气流的漩涡状旋转混合物以将其气体充分混合在一起; 形成高度均匀的反应性气体混合物; 并迅速将反应性气体的混合物流过晶片表面上和表面。 该设备还提供双晶片处理室腔。