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1. 发明授权

US07855889B2 Resilient fastener and thermal module incorporating the same 有权
标题翻译：弹性紧固件和结合其的热模块
公开(公告)号：US07855889B2
公开(公告)日：2010-12-21
申请号：US11735806
申请日：2007-04-16
申请人： Jui-Wen Hung , Shang-Chih Liang
发明人： Jui-Wen Hung , Shang-Chih Liang
IPC分类号： H05K7/20 , F28F7/00 , F28D15/00 , H01L23/34
CPC分类号： F28D15/0275 , F28D15/0233 , G06F1/20 , H01L23/427 , H01L2023/4062 , H01L2023/4081 , H01L2924/0002 , H01L2924/00
摘要： A thermal module (10) includes a fin assembly (14), a heat pipe (16) thermally contacting with a heat generating electronic component (60) disposed on a printed circuit board (50) and the fin assembly, and a resilient fastener (20) attaching an evaporation section (164) of the heat pipe to the heat generating electronic component. The fastener includes a mounting element (40) being attached to the printed circuit board, and an engaging element (30) embedded in the mounting element. The engaging element includes a base plate (32) having a first surface contacting with the evaporation section of the heat pipe and a second surface thermally contacting with the heat generating electronic component, and at least a resilient strip (34) sandwiched between the first surface of the base plate of the engaging element and the mounting element.
摘要翻译：热模块（10）包括翅片组件（14），与设置在印刷电路板（50）和翅片组件上的发热电子部件（60）热接触的热管（16）和弹性紧固件 20）将所述热管的蒸发部（164）附接到所述发热电子部件。紧固件包括附接到印刷电路板的安装元件（40）和嵌入安装元件中的接合元件（30）。接合元件包括具有与热管的蒸发部分接触的第一表面和与发热电子部件热接触的第二表面的基板（32），以及至少夹在第一表面的接合元件的基板和安装元件。

2. 发明授权

US07589965B2 Thermal module and electronic assembly incorporating the same 有权
标题翻译：热模块和电子组件结合在一起
公开(公告)号：US07589965B2
公开(公告)日：2009-09-15
申请号：US11746607
申请日：2007-05-09
申请人： Shang-Chih Liang , Jui-Wen Hung
发明人： Shang-Chih Liang , Jui-Wen Hung
IPC分类号： H05K7/20 , F28F7/00
CPC分类号： H05K7/20154
摘要： An electronic assembly includes a casing (10) of an electronic product, and a thermal module disposed in the casing. The casing has a sidewall (102) defining a plurality of slots (1011) therein. The thermal module includes a centrifugal blower (50), a fin assembly (40) and a plurality of sub-fins (701). The centrifugal blower defines an air outlet (502) therein. The fin assembly is disposed at the air outlet of the centrifugal blower and includes a plurality of fins (401) and has a plurality of air passages (402) formed between adjacent fins. The sub-fins are located between the fin assembly and the sidewall of the casing, and forming a plurality of air channels (702) therebetween. The air channels of the sub-fins communicate the air passages of the fin assembly with the slots of the sidewall of the casing.
摘要翻译：电子组件包括电子产品的壳体（10）和设置在壳体中的热模块。壳体具有在其中限定多个狭槽（1011）的侧壁（102）。热模块包括离心式鼓风机（50），翅片组件（40）和多个散热片（701）。离心鼓风机在其中限定出气口（502）。翅片组件设置在离心鼓风机的出风口处，并且包括多个翅片（401），并且在相邻翅片之间具有多个空气通道（402）。副散热片位于翅片组件和壳体的侧壁之间，并且在它们之间形成多个空气通道（702）。副翅片的空气通道将翅片组件的空气通道与壳体的侧壁的狭槽连通。

3. 发明授权

US08292464B2 LED lamp 有权
标题翻译：点灯
公开(公告)号：US08292464B2
公开(公告)日：2012-10-23
申请号：US13169037
申请日：2011-06-27
申请人： Jui-Wen Hung , Ben-Fan Xia
发明人： Jui-Wen Hung , Ben-Fan Xia
IPC分类号： F21V29/00
CPC分类号： F21V29/51 , B21D53/02 , F21K9/23 , F21V3/00 , F21V29/006 , F21V29/77 , F21Y2115/10
摘要： An LED lamp includes a heat sink, a reflecting cup, a heat pipe and an LED. The heat sink includes fins cooperatively defining a receiving space therein. Each of the fins includes a plate-shaped main body and a flange extending rearward from a periphery side of the main body. The flanges are connected to each other to cooperatively form an annular supporting surface. The reflecting cup is received in the receiving space of the heat sink. The heat pipe includes an evaporating section located above the reflecting cup and a condensing section thermally connecting with the annular supporting surface of the heat sink. The LED is directly mounted on the evaporating section with a light emitting surface facing downwardly towards the reflecting cup.
摘要翻译： LED灯包括散热器，反射杯，热管和LED。散热器包括在其中协作地限定其中的接收空间的翅片。每个翅片包括板状主体和从主体的周边向后延伸的凸缘。凸缘彼此连接以协同地形成环形支撑表面。反射杯被接收在散热器的接收空间中。热管包括位于反射杯上方的蒸发部分和与散热片的环形支撑表面热连接的冷凝部分。 LED直接安装在蒸发部分上，发光面向下朝向反射杯。

4. 发明授权

US08079406B2 Thermal module 有权
标题翻译：散热模块
公开(公告)号：US08079406B2
公开(公告)日：2011-12-20
申请号：US11873786
申请日：2007-10-17
申请人： Jui-Wen Hung , Ching-Bai Hwang , Jie Zhang
发明人： Jui-Wen Hung , Ching-Bai Hwang , Jie Zhang
IPC分类号： H05K7/20
CPC分类号： F16B2/241
摘要： A thermal module includes a centrifugal blower (10), a heat sink (20) mounted to an air outlet (11) of the centrifugal blower, a heat pipe (40) connecting the heat sink with a heat generating electronic component, and a resilient clip (80) for mounting the heat pipe onto the heat generating electronic component. The resilient clip includes an M-shaped pressing portion (82) disposed above an evaporation section (44) of the heat pipe, a plate portion (83) disposed at one end of the pressing portion for being fixed to a sidewall (53d), and an abutting portion (85) disposed at the other end of the pressing portion and including an abutting plate (85b) for abutting against a bottom surface of another sidewall (53b).
摘要翻译：热模块包括离心式鼓风机（10），安装在离心式鼓风机的出风口（11）上的散热器（20），连接散热器和发热电子部件的热管（40）夹具（80），用于将热管安装到发热电子部件上。弹性夹包括设置在热管的蒸发部分（44）上方的M形按压部分（82），设置在按压部分的一端处以固定到侧壁（53d）的板部分（83）以及设置在所述按压部的另一端的抵接部（85），并且具有抵靠另一侧壁（53b）的底面的抵接板（85b）。

5. 发明授权

US07948750B2 Portable electronic device incorporating extendable thermal module 有权
标题翻译：便携式电子设备，包括可扩展的热模块
公开(公告)号：US07948750B2
公开(公告)日：2011-05-24
申请号：US12503082
申请日：2009-07-15
申请人： Jui-Wen Hung , Nien-Tien Cheng , Ping-Yang Chuang
发明人： Jui-Wen Hung , Nien-Tien Cheng , Ping-Yang Chuang
IPC分类号： G06F1/20 , H05K7/20
CPC分类号： G06F1/203 , G06F1/183 , H01L23/3677 , H01L23/427 , H01L23/467 , H01L2924/0002 , H01L2924/00
摘要： An electronic device includes a chassis, an electronic component, a heat sink having a base and a thermal module. The chassis includes a bottom plate and a side plate surrounding the bottom plate. A cutout is defined in the side plate. The electronic component is arranged on the bottom plate and faces the cutout of the side plate. The base of the heat sink is arranged on the electronic component, and the thermal module is arranged on the base of the heat sink. The thermal module is assembled onto the base by extending through the cutout and can be taken out of the chassis through the cutout. The thermal module and the heat sink together dissipate heat generated by the electronic component when the thermal module is inserted into the chassis.
摘要翻译：电子设备包括底盘，电子部件，具有底座和散热模块的散热器。底盘包括底板和围绕底板的侧板。侧板上设有切口。电子部件布置在底板上并面向侧板的切口。散热器的底座布置在电子部件上，散热模块布置在散热片的底部。热模块通过延伸穿过切口组装在基座上，并可通过切口从机架中取出。当热模块插入机箱时，热模块和散热器一起散发电子部件产生的热量。

6. 发明授权

US07613000B2 Heat dissipation device and electronic device with the same 有权
公开(公告)号：US07613000B2
公开(公告)日：2009-11-03
申请号：US11953714
申请日：2007-12-10
申请人： Jui-Wen Hung , Ching-Bai Hwang
发明人： Jui-Wen Hung , Ching-Bai Hwang
IPC分类号： H05K7/20 , F28F7/00 , F28F13/00 , F03D11/04 , F04D29/40
CPC分类号： F04D25/0613 , F04D25/0693
摘要： A heat dissipation device includes a fan (200), a first wire collection structure (280) and a second wire collection structure (290). The fan (200) includes a frame (210) and an impeller (240) disposed in the frame (210). The first wire collection structure (280) is formed on the frame (210) to collect wires (270) of the fan (200). The second wire collection structure (290) is formed on the frame (210) and configured for collecting wires (460) of another component other than the fan (200).

7. 发明授权

US07489510B1 Fastening device for mounting thermal module to electronic component 有权
标题翻译：用于将热模块安装到电子部件的紧固装置
公开(公告)号：US07489510B1
公开(公告)日：2009-02-10
申请号：US11964905
申请日：2007-12-27
申请人： Jui-Wen Hung , Cheng-Jen Liang
发明人： Jui-Wen Hung , Cheng-Jen Liang
IPC分类号： H05K7/20 , F28F7/00
CPC分类号： H01L23/467 , H01L23/4006 , H01L23/427 , H01L2924/0002 , H01L2924/00
摘要： A thermal module includes a heat sink (400), a heat pipe (200) and a fastening device (300). The heat pipe (200) includes an evaporator (240) and a condenser (220) connected with the heat sink. The fastening device includes a base member (320) and a spring member (340). The base member includes a contacting plate (322) and two locating pins (324). Each locating pin includes a head portion (3240) and a neck portion (3244). The spring member includes a pressing portion (342) pressing the evaporator towards the contacting plate. Two locating holes (348) are defined in the pressing portion. The spring member is mounted on the base member via engagement of the locating holes with the locating pins. The spring member has a thickness smaller than a length of each of the neck portions and is movable along the neck portions to suit for a size of the evaporator.
摘要翻译：热模块包括散热器（400），热管（200）和紧固装置（300）。热管（200）包括与散热器连接的蒸发器（240）和冷凝器（220）。紧固装置包括基部构件（320）和弹簧构件（340）。基座构件包括接触板（322）和两个定位销（324）。每个定位销包括头部（3240）和颈部（3244）。弹簧构件包括将蒸发器压向接触板的按压部分（342）。两个定位孔（348）被限定在按压部分中。弹簧构件通过定位孔与定位销的接合而安装在基座构件上。弹簧构件的厚度小于每个颈部的长度，并且可以沿颈部移动以适合于蒸发器的尺寸。

8. 发明授权

US07414850B2 Heat dissipation module for electronic device 失效
标题翻译：电子设备散热模块
公开(公告)号：US07414850B2
公开(公告)日：2008-08-19
申请号：US11309624
申请日：2006-09-01
申请人： Jui-Wen Hung
发明人： Jui-Wen Hung
IPC分类号： H05K7/20
CPC分类号： H01L23/4093 , H01L23/427 , H01L23/467 , H01L2924/0002 , H01L2924/00
摘要： A heat dissipation module for removing heat from a heat-generating electronic component includes a base (106) and a clip (40, 40a). The clip includes a connecting arm (42, 42a) and a securing arm (44, 44a) for locking the base to the heat-generating electronic component. The connecting arm engages with the base. The securing arm extends from the contacting arm and is curve-shaped with a free end thereof being for being depressed whereby the securing arm exerts a downward force on the base so that the base and the electronic component can have an intimate contact with each other.
摘要翻译：用于从发热电子部件除去热量的散热模块包括基座（106）和夹子（40,40a）。夹具包括连接臂（42,42a）和用于将基座锁定到发热电子部件的固定臂（44,47a）。连接臂与基座接合。固定臂从接触臂延伸并且具有弯曲形状，其自由端被压下，由此固定臂在基座上施加向下的力，使得基座和电子部件可以彼此紧密接触。

9. 发明授权

US08885346B2 Electronic deviec having heat dissipation device 有权
标题翻译：具有散热装置的电子偏差
公开(公告)号：US08885346B2
公开(公告)日：2014-11-11
申请号：US13418366
申请日：2012-03-13
申请人： Shih-Yao Li , Jui-Wen Hung , Ching-Bai Hwang
发明人： Shih-Yao Li , Jui-Wen Hung , Ching-Bai Hwang
IPC分类号： H05K7/20
CPC分类号： F28F3/022 , F28D2021/0029 , F28F7/00 , F28F2255/02
摘要： An exemplary electronic device includes a printed circuit board, electronic components mounted on a top surface of the printed circuit board, and a heat dissipation device. The heat dissipation device contacts the electronic components to absorb heat generated from the electronic components and dissipate the heat by natural convection and thermal radiation. The heat dissipation device includes a base plate contacting the electronic components to absorb heat generated therefrom and thermal hairs mounted on a top surface of the base plate. The thermal hairs wave with heated airflow at an inner of the electronic device to dissipate heat transferred from the base plate.
摘要翻译：示例性电子设备包括印刷电路板，安装在印刷电路板的顶表面上的电子部件和散热装置。散热装置接触电子部件以吸收由电子部件产生的热量，并通过自然对流和热辐射消散热量。散热装置包括与电子部件接触以吸收由此产生的热量的底板和安装在基板顶表面上的热毛发。热毛发在电子设备的内部具有加热的气流波浪，以散发从基板传递的热量。

10. 发明授权

US08109718B2 Centrifugal blower 有权
标题翻译：离心式鼓风机
公开(公告)号：US08109718B2
公开(公告)日：2012-02-07
申请号：US11840181
申请日：2007-08-16
申请人： Ching-Bai Hwang , Jui-Wen Hung
发明人： Ching-Bai Hwang , Jui-Wen Hung
IPC分类号： F04D29/58
CPC分类号： F04D25/0613 , F04D29/582 , F04D29/601 , G06F1/203
摘要： A centrifugal blower (10) includes a casing (12) and a rotor (14) rotatable disposed in the casing. The casing includes a base plate (121), a sidewall (122) extending from the base plate and a cover (123) covering the sidewall. The sidewall is a multilayer structure and includes a first section (128a) and a second section (128c). A distance between a central axis (A) of the rotor and an inner surface of the second section is greater than that between the central axis of the rotor and an inner surface of the first section. The first section is located below a mother board (20) and the second section sits on a top surface of the motherboard when the centrifugal blower is mounted to the mother board.
摘要翻译：离心式鼓风机（10）包括壳体（12）和可旋转地设置在壳体中的转子（14）。壳体包括基板（121），从基板延伸的侧壁（122）和覆盖侧壁的盖（123）。侧壁是多层结构，并且包括第一部分（128a）和第二部分（128c）。转子的中心轴线（A）和第二部分的内表面之间的距离大于转子的中心轴线与第一部分的内表面之间的距离。第一部分位于母板（20）的下方，当离心鼓风机安装在母板上时，第二部分位于母板的顶面上。

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