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1. 发明申请

US20080151500A1 THERMAL MODULE AND ELECTRONIC ASSEMBLY INCORPORATING THE SAME 有权
标题翻译：与其组合的热模块和电子组件
公开(公告)号：US20080151500A1
公开(公告)日：2008-06-26
申请号：US11746607
申请日：2007-05-09
申请人： SHANG-CHIH LIANG , JUI-WEN HUNG
发明人： SHANG-CHIH LIANG , JUI-WEN HUNG
IPC分类号： H05K7/20
CPC分类号： H05K7/20154
摘要： An electronic assembly includes a casing (10) of an electronic product, and a thermal module disposed in the casing. The casing has a sidewall (102) defining a plurality of slots (1011) therein. The thermal module includes a centrifugal blower (50), a fin assembly (40) and a plurality of sub-fins (701). The centrifugal blower defines an air outlet (502) therein. The fin assembly is disposed at the air outlet of the centrifugal blower and includes a plurality of fins (401) and has a plurality of air passages (402) formed between adjacent fins. The sub-fins are located between the fin assembly and the sidewall of the casing, and forming a plurality of air channels (702) therebetween. The air channels of the sub-fins communicate the air passages of the fin assembly with the slots of the sidewall of the casing.
摘要翻译：电子组件包括电子产品的壳体（10）和设置在壳体中的热模块。壳体具有在其中限定多个狭槽（1011）的侧壁（102）。热模块包括离心式鼓风机（50），翅片组件（40）和多个散热片（701）。离心鼓风机在其中限定出气口（502）。翅片组件设置在离心鼓风机的出风口处，并且包括多个翅片（401），并且在相邻翅片之间具有多个空气通道（402）。副散热片位于翅片组件和壳体的侧壁之间，并且在它们之间形成多个空气通道（702）。副翅片的空气通道将翅片组件的空气通道与壳体的侧壁的狭槽连通。

2. 发明申请

US20070071063A1 APPARATUS FOR SIMULATION OF HEAT GENERATION OF ELECTRONIC COMPONENTS 失效
标题翻译：用于模拟电子元件的发热的装置
公开(公告)号：US20070071063A1
公开(公告)日：2007-03-29
申请号：US11309183
申请日：2006-07-07
申请人： TAY-JIAN LIU , SHANG-CHIH LIANG
发明人： TAY-JIAN LIU , SHANG-CHIH LIANG
IPC分类号： B60H1/00 , G01N25/68 , G01K17/00
CPC分类号： G01N25/20
摘要： Disclosed is an apparatus (10) for simulation of heat generation of a heat-generating electronic component. The apparatus includes a heat-transfer simulation device (110), a base (120) and at least one supporting post (150). The base is made of a heat-insulation material, and defines therein a recess (122). The heat-transfer simulation device is used for simulating heat generation from a heat-generating electronic component. The supporting post supportively mounts the heat-transfer simulation device within the recess defined in the base. A method of evaluating heat removal capacity of a heat dissipation device is also disclosed based on this apparatus.
摘要翻译：公开了一种用于模拟发热电子部件的发热的装置（10）。该装置包括热传递模拟装置（110），基座（120）和至少一个支撑柱（150）。基座由绝热材料制成，并在其中限定有凹部（122）。传热模拟装置用于模拟来自发热电子部件的发热。支撑柱支撑地将传热模拟装置安装在基座中限定的凹部内。还公开了一种评估散热装置的散热能力的方法。

3. 发明申请

US20060175038A1 Rotary-type total heat exchanger 失效
标题翻译：旋转型全热交换器
公开(公告)号：US20060175038A1
公开(公告)日：2006-08-10
申请号：US11211968
申请日：2005-10-20
申请人： Tay-Jian Liu , Shun-Yuan Jan , Shang-Chih Liang , Chih-Feng Fan
发明人： Tay-Jian Liu , Shun-Yuan Jan , Shang-Chih Liang , Chih-Feng Fan
IPC分类号： F23L15/02
CPC分类号： F24F13/30 , F24F1/0059 , F24F2203/104 , Y10S165/903
摘要： A rotary-type total heat exchanger (10) includes two blowers (21, 22), a rotary wheel (33), an air-guiding member (41) and an air-regulating member (42). The blowers are used to provide a first airflow and a second airflow into the total heat exchanger. The rotary wheel defines therein a plurality of air passageways (331). Upon rotation, the rotary wheel is capable of exchanging heat and moisture between the airflows when the airflows separately flow though the air passageways of the rotary wheel. The air-guiding member is in fluid communication with one of the blowers for guiding one of the airflows toward the rotary wheel. The air-regulating member is located between the rotary wheel and the air-guiding member for distributing the guided airflow over the air passageways of the rotary wheel.
摘要翻译：旋转型全热交换器（10）包括两个鼓风机（21,22），一个旋转轮（33），一个空气引导构件（41）和一个空气调节构件（42）。鼓风机用于向全热交换器提供第一气流和第二气流。旋转轮在其中限定有多个空气通道（331）。当旋转时，当气流分别流过旋转轮的空气通道时，转轮能够在气流之间交换热量和湿气。空气引导构件与其中一个鼓风机流体连通，用于将一个气流引向旋转轮。空气调节构件位于旋转轮和引导构件之间，用于将被引导的气流分布在旋转轮的空气通道上。

4. 发明授权

US07530385B2 Rotary-type total heat exchanger 失效
标题翻译：旋转型全热交换器
公开(公告)号：US07530385B2
公开(公告)日：2009-05-12
申请号：US11211968
申请日：2005-10-20
申请人： Tay-Jian Liu , Shun-Yuan Jan , Shang-Chih Liang , Chih-Feng Fan
发明人： Tay-Jian Liu , Shun-Yuan Jan , Shang-Chih Liang , Chih-Feng Fan
IPC分类号： F23L15/02 , F24H3/02
CPC分类号： F24F13/30 , F24F1/0059 , F24F2203/104 , Y10S165/903
摘要： A rotary-type total heat exchanger (10) includes two blowers (21, 22), a rotary wheel (33), an air-guiding member (41) and an air-regulating member (42). The blowers are used to provide a first airflow and a second airflow into the total heat exchanger. The rotary wheel defines therein a plurality of air passageways (331). Upon rotation, the rotary wheel is capable of exchanging heat and moisture between the airflows when the airflows separately flow though the air passageways of the rotary wheel. The air-guiding member is in fluid communication with one of the blowers for guiding one of the airflows toward the rotary wheel. The air-regulating member is located between the rotary wheel and the air-guiding member for distributing the guided airflow over the air passageways of the rotary wheel.
摘要翻译：旋转型全热交换器（10）包括两个鼓风机（21,22），一个旋转轮（33），一个空气引导构件（41）和一个空气调节构件（42）。鼓风机用于向全热交换器提供第一气流和第二气流。旋转轮在其中限定有多个空气通道（331）。当旋转时，当气流分别流过旋转轮的空气通道时，转轮能够在气流之间交换热量和湿气。空气引导构件与其中一个鼓风机流体连通，用于将一个气流引向旋转轮。空气调节构件位于旋转轮和引导构件之间，用于将被引导的气流分布在旋转轮的空气通道上。

5. 发明申请

US20060130508A1 Total heat exchanger 审中-公开
标题翻译：全热交换器
公开(公告)号：US20060130508A1
公开(公告)日：2006-06-22
申请号：US11166707
申请日：2005-06-24
申请人： Tay-Jian Liu , Ming-Chun Lee , Shang-Chih Liang , Lien-Jin Chiang
发明人： Tay-Jian Liu , Ming-Chun Lee , Shang-Chih Liang , Lien-Jin Chiang
IPC分类号： F25D23/00 , F25D17/06
CPC分类号： F24F3/147 , F28D15/0275 , F28F1/32
摘要： A total heat exchanger in accordance with a preferred embodiment includes air-guiding means (21), a heat-pipe heat exchanger (31) and a total heat exchange member (41). The air-guiding means is for providing a first airflow from outdoors and a second airflow from indoors. The heat-pipe heat exchanger includes at least one heat pipe (32) spanning across said first and second airflows simultaneously for conducting a sensible heat exchange between the airflows. The total heat exchange member is capable of exchanging sensible heat and latent heat between said first and second airflows, and defines therein a first air passage and a second air passage intersecting with and isolated from each other. A total heat exchange of sensible heat and latent heat between the first and second airflows is carried out in the total heat exchange member when the airflows flow through the first and second air passages respectively.
摘要翻译：根据优选实施例的全热交换器包括空气引导装置（21），热管式热交换器（31）和总热交换构件（41）。空气引导装置用于从室外提供第一气流和来自室内的第二气流。热管式热交换器包括至少一个跨越所述第一和第二气流的热管（32），用于在气流之间进行明显的热交换。总热交换构件能够在所述第一和第二气流之间交换显热和潜热，并且在其中限定第一空气通道和彼此相交和隔离的第二空气通道。当气流分别流过第一和第二空气通道时，在总热交换构件中进行第一和第二气流之间的显热和潜热的总热交换。

6. 发明授权

US07637659B2 Apparatus for simulation of heat generation of electronic components 失效
标题翻译：用于模拟电子部件的发热的装置
公开(公告)号：US07637659B2
公开(公告)日：2009-12-29
申请号：US11309183
申请日：2006-07-07
申请人： Tay-Jian Liu , Shang-Chih Liang
发明人： Tay-Jian Liu , Shang-Chih Liang
IPC分类号： G01K1/00 , G01K7/00
CPC分类号： G01N25/20
摘要： Disclosed is an apparatus (10) for simulation of heat generation of a heat-generating electronic component. The apparatus includes a heat-transfer simulation device (110), a base (120) and at least one supporting post (150). The base is made of a heat-insulation material, and defines therein a recess (122). The heat-transfer simulation device is used for simulating heat generation from a heat-generating electronic component. The supporting post supportively mounts the heat-transfer simulation device within the recess defined in the base. A method of evaluating heat removal capacity of a heat dissipation device is also disclosed based on this apparatus.
摘要翻译：公开了一种用于模拟发热电子部件的发热的装置（10）。该装置包括热传递模拟装置（110），基座（120）和至少一个支撑柱（150）。基座由绝热材料制成，并在其中限定有凹部（122）。传热模拟装置用于模拟来自发热电子部件的发热。支撑柱支撑地将传热模拟装置安装在基座中限定的凹部内。还公开了一种评估散热装置的散热能力的方法。

7. 发明申请

US20080202740A1 RESILIENT FASTENER AND THERMAL MODULE INCORPORATING THE SAME 有权
标题翻译：兼容紧固件和热模块
公开(公告)号：US20080202740A1
公开(公告)日：2008-08-28
申请号：US11735806
申请日：2007-04-16
申请人： JUI-WEN HUNG , SHANG-CHIH LIANG
发明人： JUI-WEN HUNG , SHANG-CHIH LIANG
IPC分类号： F28F7/00
CPC分类号： F28D15/0275 , F28D15/0233 , G06F1/20 , H01L23/427 , H01L2023/4062 , H01L2023/4081 , H01L2924/0002 , H01L2924/00
摘要： A thermal module (10) includes a fin assembly (14), a heat pipe (16) thermally contacting with a heat generating electronic component (60) disposed on a printed circuit board (50) and the fin assembly, and a resilient fastener (20) attaching an evaporation section (164) of the heat pipe to the heat generating electronic component. The fastener includes a mounting element (40) being attached to the printed circuit board, and an engaging element (30) embedded in the mounting element. The engaging element includes a base plate (32) having a first surface contacting with the evaporation section of the heat pipe and a second surface thermally contacting with the heat generating electronic component, and at least a resilient strip (34) sandwiched between the first surface of the base plate of the engaging element and the mounting element.
摘要翻译：热模块（10）包括翅片组件（14），与设置在印刷电路板（50）和翅片组件上的发热电子部件（60）热接触的热管（16）和弹性紧固件 20）将所述热管的蒸发部（164）附接到所述发热电子部件。紧固件包括附接到印刷电路板的安装元件（40）和嵌入安装元件中的接合元件（30）。接合元件包括具有与热管的蒸发部分接触的第一表面和与发热电子部件热接触的第二表面的基板（32），以及至少夹在第一表面的接合元件的基板和安装元件。

8. 发明授权

US07855889B2 Resilient fastener and thermal module incorporating the same 有权
标题翻译：弹性紧固件和结合其的热模块
公开(公告)号：US07855889B2
公开(公告)日：2010-12-21
申请号：US11735806
申请日：2007-04-16
申请人： Jui-Wen Hung , Shang-Chih Liang
发明人： Jui-Wen Hung , Shang-Chih Liang
IPC分类号： H05K7/20 , F28F7/00 , F28D15/00 , H01L23/34
CPC分类号： F28D15/0275 , F28D15/0233 , G06F1/20 , H01L23/427 , H01L2023/4062 , H01L2023/4081 , H01L2924/0002 , H01L2924/00
摘要： A thermal module (10) includes a fin assembly (14), a heat pipe (16) thermally contacting with a heat generating electronic component (60) disposed on a printed circuit board (50) and the fin assembly, and a resilient fastener (20) attaching an evaporation section (164) of the heat pipe to the heat generating electronic component. The fastener includes a mounting element (40) being attached to the printed circuit board, and an engaging element (30) embedded in the mounting element. The engaging element includes a base plate (32) having a first surface contacting with the evaporation section of the heat pipe and a second surface thermally contacting with the heat generating electronic component, and at least a resilient strip (34) sandwiched between the first surface of the base plate of the engaging element and the mounting element.
摘要翻译：热模块（10）包括翅片组件（14），与设置在印刷电路板（50）和翅片组件上的发热电子部件（60）热接触的热管（16）和弹性紧固件 20）将所述热管的蒸发部（164）附接到所述发热电子部件。紧固件包括附接到印刷电路板的安装元件（40）和嵌入安装元件中的接合元件（30）。接合元件包括具有与热管的蒸发部分接触的第一表面和与发热电子部件热接触的第二表面的基板（32），以及至少夹在第一表面的接合元件的基板和安装元件。

9. 发明授权

US07589965B2 Thermal module and electronic assembly incorporating the same 有权
标题翻译：热模块和电子组件结合在一起
公开(公告)号：US07589965B2
公开(公告)日：2009-09-15
申请号：US11746607
申请日：2007-05-09
申请人： Shang-Chih Liang , Jui-Wen Hung
发明人： Shang-Chih Liang , Jui-Wen Hung
IPC分类号： H05K7/20 , F28F7/00
CPC分类号： H05K7/20154
摘要： An electronic assembly includes a casing (10) of an electronic product, and a thermal module disposed in the casing. The casing has a sidewall (102) defining a plurality of slots (1011) therein. The thermal module includes a centrifugal blower (50), a fin assembly (40) and a plurality of sub-fins (701). The centrifugal blower defines an air outlet (502) therein. The fin assembly is disposed at the air outlet of the centrifugal blower and includes a plurality of fins (401) and has a plurality of air passages (402) formed between adjacent fins. The sub-fins are located between the fin assembly and the sidewall of the casing, and forming a plurality of air channels (702) therebetween. The air channels of the sub-fins communicate the air passages of the fin assembly with the slots of the sidewall of the casing.
摘要翻译：电子组件包括电子产品的壳体（10）和设置在壳体中的热模块。壳体具有在其中限定多个狭槽（1011）的侧壁（102）。热模块包括离心式鼓风机（50），翅片组件（40）和多个散热片（701）。离心鼓风机在其中限定出气口（502）。翅片组件设置在离心鼓风机的出风口处，并且包括多个翅片（401），并且在相邻翅片之间具有多个空气通道（402）。副散热片位于翅片组件和壳体的侧壁之间，并且在它们之间形成多个空气通道（702）。副翅片的空气通道将翅片组件的空气通道与壳体的侧壁的狭槽连通。

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