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1. 发明申请

US20070006456A1 Method for manufacturing circuit board with built-in electronic components 失效
标题翻译：制造具有内置电子部件的电路板的方法
公开(公告)号：US20070006456A1
公开(公告)日：2007-01-11
申请号：US11453790
申请日：2006-06-15
申请人： Seung Kim , Chang Ryu , Han Cho , Doo Lee , Hwa Park
发明人： Seung Kim , Chang Ryu , Han Cho , Doo Lee , Hwa Park
IPC分类号： H01K3/10 , H05K1/00
CPC分类号： H05K1/188 , H05K1/185 , H05K2201/0355 , H05K2201/10674 , Y10T29/49128 , Y10T29/4913 , Y10T29/49144 , Y10T29/49165
摘要： Disclosed is a method for manufacturing a circuit board, comprising step for preparing an insulating member and an electronic component having position-setting means on the lower surface thereof (S110), step for forming mounting holes in the insulating member (S120), step for mounting the electronic component on the insulating member to meet the position-setting means and the mounting holes (S130), step for forming copper cladding coated with an adhesive on the insulating member (S140), step for applying heat and/or pressure to the copper cladding (S150), and step for forming a via-hole in the copper cladding to be electrically connected to the electronic component, and step for forming a circuit pattern in the copper cladding (S160). The step (S150) can comprise a step (S240) for applying inter-adhesive on respective surfaces of the insulating member, and a step (S250) for applying copper cladding on respective surfaces of the inter-adhesive.
摘要翻译：公开了一种制造电路板的方法，包括在其下表面上制备绝缘构件和具有位置设定装置的电子部件的步骤（S110），用于在绝缘构件中形成安装孔的步骤（S120），步骤，用于将所述电子部件安装在所述绝缘部件上以满足所述位置设定装置和所述安装孔（S130），用于在所述绝缘部件上形成涂覆有粘合剂的铜包层的步骤（S140），用于施加热和/ 或对铜包层的压力（S150），以及用于在铜包层中形成电气连接到电子部件的通孔的步骤，以及用于在铜包层中形成电路图案的步骤（S160）。步骤（S150）可以包括用于在绝缘构件的相应表面上施加粘合剂的步骤（S 240），以及用于在粘合剂的各个表面上施加铜包层的台阶（S 250）。

2. 发明申请

US20060258053A1 Method for manufacturing electronic component-embedded printed circuit board 审中-公开
标题翻译：电子元件嵌入式印刷电路板的制造方法
公开(公告)号：US20060258053A1
公开(公告)日：2006-11-16
申请号：US11431742
申请日：2006-05-09
申请人： Doo Lee , Chang Ryu , Han Cho , Byoung Min
发明人： Doo Lee , Chang Ryu , Han Cho , Byoung Min
IPC分类号： H01L21/00
CPC分类号： H01L24/18 , H01L24/82 , H01L2224/16225 , H01L2224/18 , H01L2224/32225 , H01L2224/73204 , H01L2924/00011 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01011 , H01L2924/01015 , H01L2924/01016 , H01L2924/01019 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/01068 , H01L2924/01074 , H01L2924/01078 , H01L2924/01082 , H01L2924/014 , H01L2924/09701 , H01L2924/14 , H01L2924/19041 , H01L2924/19042 , H01L2924/19043 , H01L2924/19105 , H01L2924/3025 , H05K1/188 , H05K3/429 , H05K3/4602 , H05K2201/0355 , H05K2201/09536 , H05K2201/0959 , H01L2924/00 , H01L2224/0401
摘要： Disclosed herein is a method for manufacturing a component-embedded printed circuit board that is economically advantageous and simple. The method is characterized by stacking boards in which a high density of electronic components are mounted to form a core layer in which the electronic components are embedded, and by subsequently building up additional circuit layers.
摘要翻译：本文公开了一种经济有利且简单的组件嵌入式印刷电路板的制造方法。该方法的特征在于堆叠板，其中安装高密度的电子部件以形成其中嵌入电子部件的芯层，以及随后构建附加的电路层。

3. 发明申请

US20060157832A1 Printed circuit board including embedded chips and method of fabricating the same 失效
公开(公告)号：US20060157832A1
公开(公告)日：2006-07-20
申请号：US11137345
申请日：2005-05-24
申请人： Chang Ryu , Doo Lee , Jin Ahn , Myung Kang , Suk Cho
发明人： Chang Ryu , Doo Lee , Jin Ahn , Myung Kang , Suk Cho
IPC分类号： H01L23/02
CPC分类号： H01L23/5389 , H01L25/0655 , H01L25/16 , H01L2224/82039 , H01L2924/01078 , H01L2924/01087 , H05K1/186 , H05K3/4069 , H05K3/4602 , H05K3/4614 , H05K3/4652 , H05K2201/09563 , H05K2201/10674 , H05K2203/0191
摘要： A printed circuit board having embedded chips, composed of a central layer having an embedded chip, an insulating layer formed on one surface or both surfaces of the central layer and having a via hole filled with conductive ink, and a circuit layer formed on the insulating layer and having a via hole and a circuit pattern electrically connected to the chip of the central layer through the via hole of the insulating layer. In addition, a method of fabricating a printed circuit board including embedded chips is provided.

4. 发明申请

US20060145331A1 Printed circuit board including embedded chips and method of fabricating the same using plating 失效
标题翻译：包括嵌入式芯片的印刷电路板及其制造方法
公开(公告)号：US20060145331A1
公开(公告)日：2006-07-06
申请号：US11179864
申请日：2005-07-11
申请人： Suk Cho , Chang Ryu , Doo Lee
发明人： Suk Cho , Chang Ryu , Doo Lee
IPC分类号： H01L21/4763 , H01L23/12
CPC分类号： H05K1/185 , H01L21/4857 , H01L23/5389 , H01L24/19 , H01L24/82 , H01L2224/04105 , H01L2224/73267 , H01L2224/92244 , H01L2924/01005 , H01L2924/01006 , H01L2924/01015 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/01078 , H01L2924/01082 , H01L2924/014 , H01L2924/14 , H01L2924/19041 , H01L2924/19042 , H01L2924/19043 , H01L2924/30105 , H01L2924/30107 , H01L2924/3025 , H05K3/4623 , H05K3/4652 , H05K2201/09509 , H05K2201/10636 , H05K2201/10674 , Y02P70/611
摘要： A method of fabricating a printed circuit board (PCB) including embedded chips, composed of forming a hollow portion for chip insertion through a substrate, inserting the chip into the hollow portion, fixing the chip to the substrate by use of a plating process to form a central layer having an embedded chip, and then laminating a non-cured resin layer and a circuit layer having a circuit pattern on the central layer. Also, a PCB including embedded chips fabricated using the above method is provided.
摘要翻译：一种制造包括嵌入式芯片的印刷电路板（PCB）的方法，所述印刷电路板（PCB）由形成用于通过基板进行芯片插入的中空部分，将所述芯片插入所述中空部分中，通过电镀工艺将所述芯片固定到所述基板具有嵌入式芯片的中心层，然后在中心层上层叠未固化树脂层和具有电路图案的电路层。此外，提供了包括使用上述方法制造的嵌入式芯片的PCB。

5. 发明申请

US20080106879A1 PRINTED CIRCUIT BOARD INCLUDING EMBEDDED CHIPS AND METHOD OF FABRICATING THE SAME 审中-公开
标题翻译：印刷电路板，包括嵌入式电路板及其制造方法
公开(公告)号：US20080106879A1
公开(公告)日：2008-05-08
申请号：US11931771
申请日：2007-10-31
申请人： Chang Ryu , Doo Lee , Jin Ahn , Myung Kang , Suk Cho
发明人： Chang Ryu , Doo Lee , Jin Ahn , Myung Kang , Suk Cho
IPC分类号： H05K7/00
CPC分类号： H01L23/5389 , H01L25/0655 , H01L25/16 , H01L2224/82039 , H01L2924/01078 , H01L2924/01087 , H05K1/186 , H05K3/4069 , H05K3/4602 , H05K3/4614 , H05K3/4652 , H05K2201/09563 , H05K2201/10674 , H05K2203/0191
摘要： A printed circuit board having embedded chips, composed of a central layer having an embedded chip, an insulating layer formed on one surface or both surfaces of the central layer and having a via hole filled with conductive ink, and a circuit layer formed on the insulating layer and having a via hole and a circuit pattern electrically connected to the chip of the central layer through the via hole of the insulating layer. In addition, a method of fabricating a printed circuit board including embedded chips is provided.
摘要翻译：一种具有嵌入式芯片的印刷电路板，由具有嵌入式芯片的中心层，形成在中心层的一个表面或两个表面上的绝缘层，并且具有填充有导电油墨的通孔，以及形成在绝缘体上的电路层并且具有通孔和通过绝缘层的通孔与中心层的芯片电连接的电路图案。此外，提供了一种制造包括嵌入式芯片的印刷电路板的方法。

6. 发明申请

US20070007636A1 Parallel chip embedded printed circuit board and manufacturing method thereof 审中-公开
标题翻译：并联芯片嵌入式印刷电路板及其制造方法
公开(公告)号：US20070007636A1
公开(公告)日：2007-01-11
申请号：US11474974
申请日：2006-06-27
申请人： Jin-Yong Ahn , Chang Ryu , Suk-Hyeon Cho , Joon Kim , Han Cho
发明人： Jin-Yong Ahn , Chang Ryu , Suk-Hyeon Cho , Joon Kim , Han Cho
IPC分类号： H01L23/02 , H01L21/00
CPC分类号： H01L21/4857 , H01L23/49822 , H01L23/50 , H01L24/19 , H01L24/82 , H01L2224/04105 , H01L2224/24137 , H01L2224/2518 , H01L2224/73267 , H01L2224/82039 , H01L2224/82047 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01015 , H01L2924/01029 , H01L2924/01033 , H01L2924/01068 , H01L2924/01078 , H01L2924/01082 , H01L2924/19041 , H01L2924/19042 , H01L2924/19043 , H01L2924/30105 , H01L2924/30107 , H01L2924/3512 , H05K1/185 , H05K1/186 , H05K3/321 , H05K3/4069 , H05K3/4602 , H05K3/4614 , H05K3/4652 , H05K2201/10522 , H05K2201/10636 , H05K2203/063 , H05K2203/1189 , Y02P70/611 , Y10T29/49128
摘要： A parallel chip embedded printed circuit board and manufacturing method thereof are disclosed. With a method of manufacturing a parallel chip embedded printed circuit board, comprising: (a) forming a parallel chip by connecting in parallel a plurality of unit chips having electrodes or electrically connected members formed on the upper and lower surfaces thereof, using at least one conductive member; (b) joining an electrode on one side of the parallel chip to a first board; and (c) joining an electrode on the other side of the parallel chip to a second board, chips may be embedded in a printed circuit board at a low cost, as a plurality of unit chips can be embedded at once, and a mechanical drill or router can be used instead of a laser drill in perforating the cavity or via holes.
摘要翻译：公开了一种并行芯片嵌入式印刷电路板及其制造方法。利用制造并联芯片嵌入式印刷电路板的方法，其特征在于包括：（a）通过使用至少一个电容器形成平行芯片来并联连接多个单元芯片，所述多个单元芯片具有形成在其上表面和下表面上的电极或电连接构件导电构件; （b）将平行芯片一侧的电极连接到第一板上; 和（c）将平行芯片的另一侧的电极连接到第二板，由于可以一次嵌入多个单元芯片，因此可以以低成本将芯片嵌入印刷电路板中，并且机械钻或者可以使用路由器代替激光钻孔来对空腔或通孔进行穿孔。

7. 发明申请

US20070126126A1 Solder bonding structure using bridge type pattern 审中-公开
标题翻译：焊接结构采用桥式图案
公开(公告)号：US20070126126A1
公开(公告)日：2007-06-07
申请号：US11634221
申请日：2006-12-06
申请人： Seung Kim , Je Yoo , Yong Lee , Yoo Wee , Seok Huh , Chang Ryu
发明人： Seung Kim , Je Yoo , Yong Lee , Yoo Wee , Seok Huh , Chang Ryu
IPC分类号： H01L23/48
CPC分类号： H01L23/49816 , H01L2224/13028 , H01L2924/0002 , H05K1/111 , H05K2201/09663 , H05K2201/10674 , Y02P70/611 , H01L2924/00
摘要： Disclosed is a solder bonding structure for flip chip connection. Particularly, this invention relates to a solder bonding structure, in which the shape of a connection pad on which solder is applied is changed to thus increase the size of the solder bond that is formed using a reflow process, resulting in highly reliable solder bonding. To this end, the solder bonding structure is composed of a connection pad (a bridge type pattern) composed of at least two pattern regions spaced apart from each other by a predetermined interval, a solder bond formed on the connection pad having such a shape, and a metal bump in contact with the solder bond. In such a solder bonding structure, the solder bond is formed to a sufficient size on a fine pattern having a smaller width, thus achieving reliable solder bonding between the semiconductor chip having the metal bump and the printed circuit board having the connection pad. Further, since the connection pad may be realized through a typical formation process thereof without the need for an additional process, the reliability of the solder bonding may be sufficiently assured without an increase in the working man-hours or in the number of processes.
摘要翻译：公开了一种用于倒装芯片连接的焊接结合结构。特别地，本发明涉及焊接接合结构，其中施加焊料的连接焊盘的形状改变，从而增加使用回流工艺形成的焊料接合的尺寸，导致高度可靠的焊接。为此，焊接接合结构由由至少两个彼此间隔开的图案区域构成的连接焊盘（桥式图案）构成，形成在具有这种形状的连接焊盘上的焊料接合，以及与焊料接合的金属凸块。在这种焊接结构中，焊接接合形成为具有较小宽度的精细图案的足够的尺寸，从而在具有金属凸块的半导体芯片和具有连接焊盘的印刷电路板之间实现可靠的焊接。此外，由于可以通过其典型的形成工艺实现连接焊盘，而不需要额外的工艺，可以充分确保焊接接合的可靠性，而不增加工作工时或工艺数量。

8. 发明申请

US20050137472A1 Electrode-connector protecting cap and electrode-connector including the same 失效
标题翻译：电极连接器保护盖和包括其的电极连接器
公开(公告)号：US20050137472A1
公开(公告)日：2005-06-23
申请号：US10784978
申请日：2004-02-25
申请人： Chang Ryu , Seung Kim , Yun Kim
发明人： Chang Ryu , Seung Kim , Yun Kim
IPC分类号： A61B5/0408 , A61B5/0432 , A61B5/04
CPC分类号： A61B5/6805 , A61B5/0408 , A61B5/04085 , A61B5/0432
摘要： Provided is an electrode-connector protecting cap for ambulatory physiological signal measurement comprising a hemisphere cap, a wing positioned at a periphery of the hemisphere cap and having a contact surface connected to the electrode-connector; and an opening for a wire to be passed through and formed in the hemisphere cap, and an electrode-connector including the same, whereby a connection between the electrode and the connector can be protected and the noise occurrence can be prevented.
摘要翻译：提供一种用于动态生理信号测量的电极连接器保护帽，包括半球形帽，位于半球形帽的周边的翼，并具有连接到电极连接器的接触表面; 以及用于使导线穿过并形成在半球形盖中的开口，以及包括该开口的电极连接器，由此能够保护电极和连接器之间的连接并且可以防止噪音的产生。

9. 发明申请

US20050283061A1 Physiological signal detection module, multi-channel connector module and physiological signal detection apparatus using the same 有权
标题翻译：生理信号检测模块，多通道连接器模块和使用该信号的生理信号检测装置
公开(公告)号：US20050283061A1
公开(公告)日：2005-12-22
申请号：US11027162
申请日：2004-12-29
申请人： Chang Ryu , Seung Kim , Youn Kim
发明人： Chang Ryu , Seung Kim , Youn Kim
IPC分类号： A61B5/0408 , A61B5/04 , A61B5/0404 , A61B5/0428
CPC分类号： A61B5/04286 , A61B5/0404 , A61B5/0428 , Y10S439/909
摘要： Provided is a physiological signal detection module which has a heating member and a multi-channel connector. The heating member maintains an electrode's contact with a user skin at a constant temperature, and the multi-channel connector module for electrical connection transmits the physiological signal to an external physiological signal detection apparatus. It is possible to prevent the skin from being directly contacted with the electrode in the cold state and have a less impact given by a change of the impedance due to a skin temperature based on the change of the season and external temperature, so that the stable physiological signal can be detected without distortion.
摘要翻译：提供了具有加热构件和多通道连接器的生理信号检测模块。加热构件在恒定温度下保持电极与使用者皮肤的接触，并且用于电连接的多通道连接器模块将生理信号传输到外部生理信号检测装置。可以防止皮肤在冷态中与电极直接接触，并且由于根据季节和外部温度的变化而由皮肤温度引起的阻抗变化的影响较小，使得稳定可以无畸变地检测生理信号。

10. 发明申请

US20070073131A1 Garment for measuring physiological signal 审中-公开
标题翻译：用于测量生理信号的服装
公开(公告)号：US20070073131A1
公开(公告)日：2007-03-29
申请号：US11523989
申请日：2006-09-20
申请人： Chang Ryu , Seung Kim , Seung Nam , Seung Shin , Hyun Lee , Kyung Hong
发明人： Chang Ryu , Seung Kim , Seung Nam , Seung Shin , Hyun Lee , Kyung Hong
IPC分类号： A61B5/04
CPC分类号： A61B5/0408 , A41D13/1281 , A61B5/6805
摘要： Provided is a garment for measuring a physiological signal. The garment includes: an inner layer made of an elastic mesh fabric; a physiological signal measuring electrode including a connector connected to an external line and an electrode having a protrusion and measuring a physiological signal, the protrusion of the electrode passing through a mesh of the inner layer and engaging with the connector to be attached to the inner layer; and a compressing cushion interposed between an outer layer and the inner layer and compressing the physiological signal measuring electrode to a human body. Accordingly, poor contact between the physiological signal measuring electrode and the human body can be prevented and noise generated when measuring the physiological signal can be reduced.
摘要翻译：提供了用于测量生理信号的服装。该服装包括：由弹性网状织物制成的内层; 生理信号测量电极，其包括连接到外线的连接器和具有突起并测量生理信号的电极，所述电极的突出部穿过内层的网状物并与要连接到内层的连接器接合 ; 以及插入在外层和内层之间并且将生理信号测量电极压缩到人体的压缩垫。因此，可以防止生理信号测量电极和人体之间的接触不良，并且可以减少测量生理信号时产生的噪音。

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