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1. 发明申请

US20060145331A1 Printed circuit board including embedded chips and method of fabricating the same using plating 失效
标题翻译：包括嵌入式芯片的印刷电路板及其制造方法
公开(公告)号：US20060145331A1
公开(公告)日：2006-07-06
申请号：US11179864
申请日：2005-07-11
申请人： Suk Cho , Chang Ryu , Doo Lee
发明人： Suk Cho , Chang Ryu , Doo Lee
IPC分类号： H01L21/4763 , H01L23/12
CPC分类号： H05K1/185 , H01L21/4857 , H01L23/5389 , H01L24/19 , H01L24/82 , H01L2224/04105 , H01L2224/73267 , H01L2224/92244 , H01L2924/01005 , H01L2924/01006 , H01L2924/01015 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/01078 , H01L2924/01082 , H01L2924/014 , H01L2924/14 , H01L2924/19041 , H01L2924/19042 , H01L2924/19043 , H01L2924/30105 , H01L2924/30107 , H01L2924/3025 , H05K3/4623 , H05K3/4652 , H05K2201/09509 , H05K2201/10636 , H05K2201/10674 , Y02P70/611
摘要： A method of fabricating a printed circuit board (PCB) including embedded chips, composed of forming a hollow portion for chip insertion through a substrate, inserting the chip into the hollow portion, fixing the chip to the substrate by use of a plating process to form a central layer having an embedded chip, and then laminating a non-cured resin layer and a circuit layer having a circuit pattern on the central layer. Also, a PCB including embedded chips fabricated using the above method is provided.
摘要翻译：一种制造包括嵌入式芯片的印刷电路板（PCB）的方法，所述印刷电路板（PCB）由形成用于通过基板进行芯片插入的中空部分，将所述芯片插入所述中空部分中，通过电镀工艺将所述芯片固定到所述基板具有嵌入式芯片的中心层，然后在中心层上层叠未固化树脂层和具有电路图案的电路层。此外，提供了包括使用上述方法制造的嵌入式芯片的PCB。

2. 发明申请

US20080106879A1 PRINTED CIRCUIT BOARD INCLUDING EMBEDDED CHIPS AND METHOD OF FABRICATING THE SAME 审中-公开
标题翻译：印刷电路板，包括嵌入式电路板及其制造方法
公开(公告)号：US20080106879A1
公开(公告)日：2008-05-08
申请号：US11931771
申请日：2007-10-31
申请人： Chang Ryu , Doo Lee , Jin Ahn , Myung Kang , Suk Cho
发明人： Chang Ryu , Doo Lee , Jin Ahn , Myung Kang , Suk Cho
IPC分类号： H05K7/00
CPC分类号： H01L23/5389 , H01L25/0655 , H01L25/16 , H01L2224/82039 , H01L2924/01078 , H01L2924/01087 , H05K1/186 , H05K3/4069 , H05K3/4602 , H05K3/4614 , H05K3/4652 , H05K2201/09563 , H05K2201/10674 , H05K2203/0191
摘要： A printed circuit board having embedded chips, composed of a central layer having an embedded chip, an insulating layer formed on one surface or both surfaces of the central layer and having a via hole filled with conductive ink, and a circuit layer formed on the insulating layer and having a via hole and a circuit pattern electrically connected to the chip of the central layer through the via hole of the insulating layer. In addition, a method of fabricating a printed circuit board including embedded chips is provided.
摘要翻译：一种具有嵌入式芯片的印刷电路板，由具有嵌入式芯片的中心层，形成在中心层的一个表面或两个表面上的绝缘层，并且具有填充有导电油墨的通孔，以及形成在绝缘体上的电路层并且具有通孔和通过绝缘层的通孔与中心层的芯片电连接的电路图案。此外，提供了一种制造包括嵌入式芯片的印刷电路板的方法。

3. 发明申请

US20060157832A1 Printed circuit board including embedded chips and method of fabricating the same 失效
公开(公告)号：US20060157832A1
公开(公告)日：2006-07-20
申请号：US11137345
申请日：2005-05-24
申请人： Chang Ryu , Doo Lee , Jin Ahn , Myung Kang , Suk Cho
发明人： Chang Ryu , Doo Lee , Jin Ahn , Myung Kang , Suk Cho
IPC分类号： H01L23/02
CPC分类号： H01L23/5389 , H01L25/0655 , H01L25/16 , H01L2224/82039 , H01L2924/01078 , H01L2924/01087 , H05K1/186 , H05K3/4069 , H05K3/4602 , H05K3/4614 , H05K3/4652 , H05K2201/09563 , H05K2201/10674 , H05K2203/0191
摘要： A printed circuit board having embedded chips, composed of a central layer having an embedded chip, an insulating layer formed on one surface or both surfaces of the central layer and having a via hole filled with conductive ink, and a circuit layer formed on the insulating layer and having a via hole and a circuit pattern electrically connected to the chip of the central layer through the via hole of the insulating layer. In addition, a method of fabricating a printed circuit board including embedded chips is provided.

4. 发明申请

US20060191711A1 Embedded chip printed circuit board and method of manufacturing the same 审中-公开
标题翻译：嵌入式芯片印刷电路板及其制造方法
公开(公告)号：US20060191711A1
公开(公告)日：2006-08-31
申请号：US11351938
申请日：2006-02-10
申请人： Suk Cho , Chang Ryu , Jin Ahn
发明人： Suk Cho , Chang Ryu , Jin Ahn
IPC分类号： H05K1/18 , H05K3/30 , H01L23/12
CPC分类号： H01L23/5389 , H01L24/24 , H01L24/82 , H01L2224/12105 , H01L2224/24227 , H01L2224/32225 , H01L2224/73267 , H01L2224/82047 , H01L2224/92244 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01015 , H01L2924/01019 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/01078 , H01L2924/14 , H01L2924/15153 , H01L2924/15165 , H01L2924/19041 , H01L2924/19042 , H01L2924/19043 , H01L2924/30105 , H01L2924/30107 , H05K1/185 , H05K3/4602 , H05K3/4652 , Y10T29/4913 , Y10T29/49165 , H01L2924/00
摘要： The present invention relates to an embedded chip printed circuit board in which a space required for embedding a chip is formed to a desired depth depending on various thicknesses of chips to be embedded, and thus, the circuit line for the electrical connection between the embedded chip and the circuit pattern layer can be formed to be relatively short, thereby maximizing space efficiency and decreasing inductance at high frequencies. In addition, a method of manufacturing such an embedded printed circuit board is also provided.
摘要翻译：嵌入式芯片印刷电路板技术领域本发明涉及一种嵌入式芯片印刷电路板，其中嵌入芯片所需的空间根据要嵌入的芯片的各种厚度形成为期望的深度，因此，嵌入式芯片之间的电连接的电路线并且电路图案层可以形成为相对较短，从而最大化空间效率并降低高频下的电感。此外，还提供了一种制造这种嵌入式印刷电路板的方法。

5. 发明申请

US20060060960A1 Printed circuit board having chip package mounted theron and method of fabricating same 失效
标题翻译：具有安装芯片封装的印刷电路板及其制造方法
公开(公告)号：US20060060960A1
公开(公告)日：2006-03-23
申请号：US11128852
申请日：2005-05-13
申请人： Suk Cho , Chang Ryu , Jin Jeong , Jin Ahn
发明人： Suk Cho , Chang Ryu , Jin Jeong , Jin Ahn
IPC分类号： H01L21/48
CPC分类号： H05K1/183 , H01L2224/16225 , H05K3/062 , H05K3/064 , H05K3/244 , H05K3/28 , H05K3/4652 , H05K3/4697 , H05K2201/10734 , H05K2203/1394 , Y10T29/4913 , Y10T29/49155
摘要： Disclosed is a printed circuit board (PCB) and a method of fabricating the same. A contact portion is formed on an internal layer of the multi-layered PCB. A groove is formed so as to expose the contact portion of the internal layer. A chip package is mounted on the PCB while being flip-chip bonded to the exposed contact portion of the internal layer.
摘要翻译：公开了一种印刷电路板（PCB）及其制造方法。接触部分形成在多层PCB的内层上。形成凹槽以暴露内层的接触部分。芯片封装安装在PCB上，同时倒装芯片结合到内层的暴露的接触部分。

6. 发明申请

US20060196691A1 Printed circuit board with embedded capacitors therein and manufacturing process thereof 失效
公开(公告)号：US20060196691A1
公开(公告)日：2006-09-07
申请号：US11365219
申请日：2006-02-28
申请人： Jin Ahn , Cheol Hwang , Sung Kim , Chang Ryu , Suk Cho , Ho Jeon
发明人： Jin Ahn , Cheol Hwang , Sung Kim , Chang Ryu , Suk Cho , Ho Jeon
IPC分类号： H05K1/03 , H05K1/16 , H05K3/06
CPC分类号： H05K1/162 , H01L2924/0002 , H05K1/095 , H05K3/108 , H05K3/244 , H05K3/4652 , H05K2201/0175 , H05K2201/0179 , H05K2201/09509 , H05K2201/09881 , Y10S438/957 , Y10T29/43 , Y10T29/435 , Y10T29/4913 , Y10T29/49155 , H01L2924/00
摘要： A printed circuit board having embedded capacitors includes a double-sided copper-clad laminate including first circuit layers formed in the outer layers thereof, the first circuit layers including bottom electrodes and circuit patterns; dielectric layers formed by depositing alumina films on the first circuit layers by atomic layer deposition; second circuit layers formed on the dielectric layers and including top electrodes and circuit patterns; one-sided copper-clad laminates formed on the second circuit layers; blind via-holes and through-holes formed in predetermined portions of the one-sided copper-clad laminates; and plating layers formed in the blind via-holes and the through-holes. The manufacturing method of the printed circuit board is also disclosed.

7. 发明申请

US20060226750A1 Refrigerator having home bar 审中-公开
标题翻译：冰箱有家庭酒吧
公开(公告)号：US20060226750A1
公开(公告)日：2006-10-12
申请号：US11398764
申请日：2006-04-06
申请人： Jeong Lee , Sang Kim , Suk Cho
发明人： Jeong Lee , Sang Kim , Suk Cho
IPC分类号： A47B96/04
CPC分类号： F25D23/12 , F25D23/02 , F25D2323/023
摘要： A refrigerator having a home bar, whose assembly efficiency and aesthetic external appearance are improved, is disclosed. The home bar includes a home bar frame tightly mounted at the inside of an opening, which is formed at a door of the refrigerator door such that the opening communicates with the inside of the refrigerator, a home bar door mounted to the home bar frame such that the home bar door can be hingedly rotated for opening and closing the opening, a coupling-and-releasing unit for coupling the home bar door to the home bar frame and releasing the home bar door from the home bar frame, and at least one hinge member having a rotary shaft movable in the inward and outward directions of the home bar door or the home bar frame such that the rotary shaft can be inserted into or separated from a hinge hole formed at the home bar frame or the home bar door.
摘要翻译：公开了具有家俱酒吧的组装效率和外观美观的冰箱。家庭酒吧包括紧密安装在开口内侧的家用酒吧框架，其形成在冰箱门的门处，使得开口与冰箱的内部连通，安装到家庭酒吧框架的家庭酒吧门家庭酒吧门可以铰接地旋转以打开和关闭开口;联接和释放单元，用于将家庭酒吧门连接到家庭酒吧框架并将家庭酒吧门从家庭酒吧框架中释放出来;以及至少一个铰链构件具有可在家庭酒吧门或家庭酒吧框架的向内和向外方向上移动的旋转轴，使得旋转轴可以插入到形成在家庭酒吧框架或家庭酒吧门上的铰链孔中或与其隔离。

8. 发明申请

US20080110667A1 PRINTED CIRCUIT BOARD WITH EMBEDDED CAPACITORS THEREIN AND MANUFACTURING PROCESS THEREOF 失效
标题翻译：具有嵌入式电容器的印刷电路板及其制造工艺
公开(公告)号：US20080110667A1
公开(公告)日：2008-05-15
申请号：US12016919
申请日：2008-01-18
申请人： Jin Ahn , Cheol Hwang , Sung Kim , Chang Ryn , Suk Cho , Ho Jeon
发明人： Jin Ahn , Cheol Hwang , Sung Kim , Chang Ryn , Suk Cho , Ho Jeon
IPC分类号： H05K1/09 , H05K1/16
CPC分类号： H05K1/162 , H01L2924/0002 , H05K1/095 , H05K3/108 , H05K3/244 , H05K3/4652 , H05K2201/0175 , H05K2201/0179 , H05K2201/09509 , H05K2201/09881 , Y10S438/957 , Y10T29/43 , Y10T29/435 , Y10T29/4913 , Y10T29/49155 , H01L2924/00
摘要： A printed circuit board having embedded capacitors includes a double-sided copper-clad laminate including first circuit layers formed in the outer layers thereof, the first circuit layers including bottom electrodes and circuit patterns; dielectric layers formed by depositing alumina films on the first circuit layers by atomic layer deposition; second circuit layers formed on the dielectric layers and including top electrodes and circuit patterns; one-sided copper-clad laminates formed on the second circuit layers; blind via-holes and through-holes formed in predetermined portions of the one-sided copper-clad laminates; and plating layers formed in the blind via-holes and the through-holes. The manufacturing method of the printed circuit board is also disclosed.
摘要翻译：具有嵌入式电容器的印刷电路板包括：包含形成在其外层中的第一电路层的双面覆铜层压板，所述第一电路层包括底部电极和电路图案; 通过原子层沉积在第一电路层上沉积氧化铝膜而形成的介电层; 形成在电介质层上并包括顶电极和电路图案的第二电路层; 形成在第二电路层上的单面覆铜层压板; 盲孔通孔和形成在单面覆铜层压板的预定部分中的通孔; 以及形成在盲通孔和通孔中的镀层。还公开了印刷电路板的制造方法。

9. 发明申请

US20070135452A1 Nitrogen-containing fused heterocyclic compounds 失效
标题翻译：含氮稠合杂环化合物
公开(公告)号：US20070135452A1
公开(公告)日：2007-06-14
申请号：US10577334
申请日：2004-10-27
申请人： Albert Gyorkos , Christopher Corrette , Suk Cho , Timothy Turner , Scott Pratt , Kazuyoshi Aso , Masakuni Kori , Michiyo Gyoten
发明人： Albert Gyorkos , Christopher Corrette , Suk Cho , Timothy Turner , Scott Pratt , Kazuyoshi Aso , Masakuni Kori , Michiyo Gyoten
IPC分类号： A61K31/519 , C07D471/02 , A61K31/4745 , C07D487/04
CPC分类号： C07D235/30 , C07D471/04
摘要： There is provided a CRF receptor antagonist comprising a compound of the formula (I): wherein, ring A is a 5-membered ring represented by the formula (A′): wherein X is a carbon and X1 is an oxygen, a sulfur or —NR5—, or formula (A″): wherein X is a nitrogen and R6 is an optionally substituted hydrocarbyl, R1 is an amino substituted by two optionally substituted hydrocarbyl groups, R2 is an phenyl, Y1 is CR3a or a nitrogen, y2 is CR3b or a nitrogen and Y3 is CR3c or a nitrogen, provided that one or less of Y1, Y2, and Y3 is nitrogen, W is a bond, —(CH2)n-, and Z is a bond, —NR4—, etc.; or a salt thereof or a prodrug thereof.
摘要翻译：提供了包含式（I）化合物的CRF受体拮抗剂：其中环A是由式（A'）表示的5元环：其中X是碳，X 1 O >是氧，硫或-NR 5 - 或式（A“）：其中X是氮，R 6是任选取代的烃基，R 1是由两个任选取代的烃基取代的氨基，R 2是苯基，Y 1是H 3 S >或氮，Y 2是CR 3或氮和Y 3是C 3或N 3或N 3 条件是Y 1，Y 2和Y 3中的一个或多个为氮，W为键， - （CH _{2）n - ，Z为键，-NR 4 - 等; 或其盐或其前药。}

10. 发明申请

US20060198079A1 Embedded multilayer chip capacitor and printed circuit board having the same 有权
标题翻译：嵌入式多层片式电容器和具有相同功能的印刷电路板
公开(公告)号：US20060198079A1
公开(公告)日：2006-09-07
申请号：US11319722
申请日：2005-12-29
申请人： Chang Shim , Jin An , Suk Cho , Sung Kang
发明人： Chang Shim , Jin An , Suk Cho , Sung Kang
IPC分类号： H01G4/228
CPC分类号： H01G2/06 , H01G4/232 , H01G4/30 , H01L2924/0002 , H05K1/0231 , H05K1/185 , H05K2201/10643 , H01L2924/00
摘要： The invention provides an embedded multilayer chip capacitor, and a printed circuit board having the same. The embedded multilayer chip capacitor comprises a capacitor body having a plurality of dielectric layers stacked one on another; a plurality of first and second internal electrodes formed inside the capacitor body, separated by the dielectric layers; and first and second vias extended vertically inside the capacitor body. The first via is connected to the first internal electrodes and the second via is connected to the second internal electrodes. The first via is led to a bottom of the capacitor body and the second via is led to a top of the capacitor body.
摘要翻译：本发明提供一种嵌入式多层片状电容器及具有该电容器的印刷电路板。嵌入式多层片状电容器包括：具有彼此层叠的多个电介质层的电容器本体; 多个第一和第二内部电极，形成在电容器本体内部，被电介质层分隔开; 并且第一和第二通孔在电容器体内垂直延伸。第一通孔连接到第一内部电极，第二通孔连接到第二内部电极。第一通孔被引导到电容器主体的底部，第二通孔被引导到电容器主体的顶部。

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