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    • 5. 发明申请
    • METHOD OF MANUFACTURING INTEGRATED CIRCUITS USING PRE-MADE AND PRE-QUALIFIED EXPOSURE MASKS FOR SELECTED BLOCKS OF CIRCUITRY
    • 使用预先制作的集成电路的方法和用于选择的电路块的预先准许的接触掩模
    • US20070245290A1
    • 2007-10-18
    • US11279666
    • 2006-04-13
    • Serafino BuetiKenneth GoodnowGregory MannJason Norman
    • Serafino BuetiKenneth GoodnowGregory MannJason Norman
    • G06F17/50G03F1/00
    • G03F1/84
    • Disclosed are embodiments of a manufacturing method that establishes a library of pre-made and pre-qualified masks for patterning different blocks of circuitry that meet established performance and timing requirements. The embodiments of the method use stepped exposures of multiple masks, including at least one mask selected from this library, to pattern a chip design onto a silicon wafer, where the chip design is made up of two or more interconnected blocks of circuitry. Consequently, for a given integrated circuit design, pre-made/pre-qualified mask(s) can be selected from the library to pattern one, some or all blocks of circuitry for the design. Optionally, additional masks can be specially made and qualified to pattern other block(s) of circuitry (e.g., application specific logic) within the design. The blocks of circuitry patterned in this manner can be electrically connected via generic or customized interfaces in order to complete the chip design.
    • 公开了一种制造方法的实施例,其建立用于图案化满足已确定的性能和时序要求的不同电路块的预制和预先限定的掩模库。 该方法的实施例使用多个掩模的步进曝光,包括从该库选择的至少一个掩模,以将芯片设计图案化到硅晶片上,其中芯片设计由两个或更多个互连的电路块组成。 因此,对于给定的集成电路设计,可以从库中选择预制/预先限定的掩模,以对设计的一个,一些或所有电路块进行图案化。 可选地,附加掩模可以被特别地制造并且被限定以在设计中对其他电路块(例如,应用专用逻辑)进行图案化。 以这种方式图案化的电路块可通过通用或定制界面电连接,以完成芯片设计。
    • 8. 发明申请
    • DESIGN STRUCTURE FOR CHIP IDENTIFICATION SYSTEM
    • 芯片识别系统设计结构
    • US20090094566A1
    • 2009-04-09
    • US12105883
    • 2008-04-18
    • Serafino BuetiAdam J. CourchesneKenneth J. GoodnowTodd E. LeonardPeter A. SandonPeter A. TwomblyCharles S. Woodruff
    • Serafino BuetiAdam J. CourchesneKenneth J. GoodnowTodd E. LeonardPeter A. SandonPeter A. TwomblyCharles S. Woodruff
    • G06F17/50
    • G06K19/067
    • Disclosed is a design structure for an on-chip identification circuitry. In one embodiment, pairs of conductors (e.g., metal pads, vias, lines) are formed within one or more metallization layers. The distance between the conductors in each pair is predetermined so that, given known across chip line variations, there is a random chance (i.e., an approximately 50/50 chance) of a short. In another embodiment different masks form first conductors (e.g., metal lines separated by varying distances and having different widths) and second conductors (e.g., metal vias separated by varying distances and having equal widths). The first and second conductors alternate across the chip. Due to the different separation distances and widths of the first conductors, the different separation distances of the second conductors and, random mask alignment variations, each first conductor can short to up to two second conductors. In each embodiment the resulting pattern of shorts and opens, can be used as an on-chip identifier or private key.
    • 公开了用于片上识别电路的设计结构。 在一个实施例中,在一个或多个金属化层内形成导体对(例如,金属焊盘,通孔,线)。 每对中的导体之间的距离是预先确定的,因此,在已知的跨越芯片线的变化中,存在短路的随机机会(即,大约50/50的几率)。 在另一个实施例中,不同的掩模形成第一导体(例如,由变化的距离分隔并具有不同宽度的金属线)和第二导体(例如,通过变化的距离分开并具有相等宽度的金属通孔)。 第一和第二导体在芯片之间交替。 由于第一导体的分离距离和宽度不同,第二导体的不同间隔距离和随机掩模对准变化,每个第一导体可以短至多达两个第二导体。 在每个实施例中,所得到的短路和开路模式可用作片上标识符或私钥。