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1. 发明授权

US08673050B2 Conductive material, conductive paste, circuit board, and semiconductor device 有权
标题翻译：导电材料，导电膏，电路板和半导体器件
公开(公告)号：US08673050B2
公开(公告)日：2014-03-18
申请号：US12850950
申请日：2010-08-05
申请人： Seiki Sakuyama , Taiji Sakai
发明人： Seiki Sakuyama , Taiji Sakai
IPC分类号： B22F1/02 , H01B1/02 , H01B1/22
CPC分类号： H05K1/115 , H01B1/026 , H01B1/22 , H01L2224/16225 , H01L2924/00011 , H01L2924/00014 , H05K3/462 , H05K2201/0218 , H05K2201/0272 , H05K2201/10378 , H05K2203/0425 , H01L2224/0401
摘要： A conductive material includes a first metal part whose main ingredient is a first metal; a second metal part formed on the first metal part and whose main ingredient is a second metal, the second metal having a melting point lower than a melting point of the first metal, which second metal can form a metallic compound with the first metal; and a third metal part whose main ingredient is a third metal, which third metal can make a eutectic reaction with the second metal.
摘要翻译：导电材料包括主要成分是第一金属的第一金属部分; 第二金属部分形成在第一金属部分上，其主要成分是第二金属，第二金属的熔点低于第一金属的熔点，第二金属可以与第一金属形成金属化合物; 和主要成分为第三金属的第三金属部分，该第三金属可以与第二金属发生共晶反应。

2. 发明申请

US20110031002A1 PRINTED WIRING BOARD HAVING METAL LAYERS PRODUCING EUTECTIC REACTION 有权
标题翻译：具有生产防腐反应的金属层的印刷线路板
公开(公告)号：US20110031002A1
公开(公告)日：2011-02-10
申请号：US12908404
申请日：2010-10-20
申请人： Taiji Sakai , Seiki Sakuyama
发明人： Taiji Sakai , Seiki Sakuyama
IPC分类号： H05K1/09 , H05K3/30
CPC分类号： H05K1/0298 , H01L23/49822 , H01L23/49866 , H01L24/16 , H01L24/81 , H01L2224/13099 , H01L2224/81097 , H01L2224/81815 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01019 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/01049 , H01L2924/0105 , H01L2924/01055 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01322 , H01L2924/01327 , H01L2924/014 , H01L2924/30105 , H05K3/3436 , H05K3/3473 , H05K13/0465 , H05K2201/10674 , H05K2203/072 , Y10T29/49117 , Y10T29/49124 , Y10T29/49128 , Y10T29/49139 , Y10T29/49149 , Y10T29/49155
摘要： A printed wiring board includes a Cu wiring pattern formed on a substrate. A first metal layer is formed on the Cu wiring pattern. A second metal layer is formed on the first metal layer. The first metal layer has a less reactivity with Cu than the second metal layer. The first metal layer and the second metal layer together cause an eutectic reaction.
摘要翻译：印刷电路板包括形成在基板上的Cu布线图案。在Cu布线图案上形成第一金属层。在第一金属层上形成第二金属层。第一金属层与Cu的反应性比第二金属层低。第一金属层和第二金属层一起引起共晶反应。

3. 发明申请

US20100315796A1 CONDUCTIVE MATERIAL, CONDUCTIVE PASTE, CIRCUIT BOARD, AND SEMICONDUCTOR DEVICE 有权
标题翻译：导电材料，导电胶，电路板和半导体器件
公开(公告)号：US20100315796A1
公开(公告)日：2010-12-16
申请号：US12850950
申请日：2010-08-05
申请人： Seiki Sakuyama , Taiji Sakai
发明人： Seiki Sakuyama , Taiji Sakai
IPC分类号： H05K1/18 , H05K1/11 , H01B1/22
CPC分类号： H05K1/115 , H01B1/026 , H01B1/22 , H01L2224/16225 , H01L2924/00011 , H01L2924/00014 , H05K3/462 , H05K2201/0218 , H05K2201/0272 , H05K2201/10378 , H05K2203/0425 , H01L2224/0401
摘要： A conductive material includes a first metal part whose main ingredient is a first metal; a second metal part formed on the first metal part and whose main ingredient is a second metal, the second metal having a melting point lower than a melting point of the first metal, which second metal can form a metallic compound with the first metal; and a third metal part whose main ingredient is a third metal, which third metal can make a eutectic reaction with the second metal.
摘要翻译：导电材料包括主要成分是第一金属的第一金属部分; 第二金属部分形成在第一金属部分上，其主要成分是第二金属，第二金属的熔点低于第一金属的熔点，第二金属可以与第一金属形成金属化合物; 和主要成分为第三金属的第三金属部分，该第三金属可以与第二金属发生共晶反应。

4. 发明授权

US08713792B2 Method of manufacturing a printed wiring board 有权
标题翻译：制造印刷电路板的方法
公开(公告)号：US08713792B2
公开(公告)日：2014-05-06
申请号：US12908404
申请日：2010-10-20
申请人： Taiji Sakai , Seiki Sakuyama
发明人： Taiji Sakai , Seiki Sakuyama
IPC分类号： H01R9/00 , H05K3/00
CPC分类号： H05K1/0298 , H01L23/49822 , H01L23/49866 , H01L24/16 , H01L24/81 , H01L2224/13099 , H01L2224/81097 , H01L2224/81815 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01019 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/01049 , H01L2924/0105 , H01L2924/01055 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01322 , H01L2924/01327 , H01L2924/014 , H01L2924/30105 , H05K3/3436 , H05K3/3473 , H05K13/0465 , H05K2201/10674 , H05K2203/072 , Y10T29/49117 , Y10T29/49124 , Y10T29/49128 , Y10T29/49139 , Y10T29/49149 , Y10T29/49155
摘要： A printed wiring board includes a Cu wiring pattern formed on a substrate. A first metal layer is formed on the Cu wiring pattern. A second metal layer is formed on the first metal layer. The first metal layer has a less reactivity with Cu than the second metal layer. The first metal layer and the second metal layer together cause an eutectic reaction.
摘要翻译：印刷电路板包括形成在基板上的Cu布线图案。在Cu布线图案上形成第一金属层。在第一金属层上形成第二金属层。第一金属层与Cu的反应性比第二金属层低。第一金属层和第二金属层一起引起共晶反应。

5. 发明授权

US07879713B2 Mounting method of semiconductor element using outside connection projection electyrode and manufacturing method of semiconductor device using outside connection projection electrode 有权
标题翻译：使用外部连接投影电极的半导体元件的安装方法和使用外部连接投影电极的半导体器件的制造方法
公开(公告)号：US07879713B2
公开(公告)日：2011-02-01
申请号：US11653954
申请日：2007-01-17
申请人： Joji Fujimori , Seiki Sakuyama , Toshiya Akamatsu
发明人： Joji Fujimori , Seiki Sakuyama , Toshiya Akamatsu
IPC分类号： H01L21/44
CPC分类号： H01L24/05 , H01L21/563 , H01L23/3128 , H01L23/3171 , H01L23/49816 , H01L23/5222 , H01L23/5329 , H01L24/03 , H01L24/13 , H01L24/16 , H01L24/81 , H01L2224/0401 , H01L2224/05073 , H01L2224/05568 , H01L2224/05624 , H01L2224/13023 , H01L2224/131 , H01L2224/13111 , H01L2224/16 , H01L2224/73203 , H01L2224/73204 , H01L2224/81011 , H01L2224/81204 , H01L2224/81211 , H01L2224/81801 , H01L2924/00013 , H01L2924/0002 , H01L2924/01004 , H01L2924/01006 , H01L2924/01013 , H01L2924/01014 , H01L2924/01019 , H01L2924/01022 , H01L2924/01023 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/0105 , H01L2924/01078 , H01L2924/01082 , H01L2924/014 , H01L2924/12044 , H01L2924/15311 , H01L2924/19041 , H01L2924/19043 , H01L2924/30105 , H01L2924/00014 , H01L2224/13099 , H01L2224/29099 , H01L2224/05552
摘要： A mounting method of a semiconductor element whereby the semiconductor element is mounted on a wiring board via an outside connection projection electrode not containing lead (Pb), the mounting method includes a step of applying a reflow heating process for connecting the outside connection projection electrode of the semiconductor element and the wiring board and then cooling the connected semiconductor element and wiring board at a cooling rate equal to and lower than 0.5° C./s.
摘要翻译：一种半导体元件的安装方法，其中半导体元件经由不包含引线（Pb）的外部连接投影电极安装在布线板上，该安装方法包括以下步骤：将回流加热工艺连接到外部连接突起电极半导体元件和布线板，然后以等于或等于0.5℃的冷却速率冷却连接的半导体元件和布线板。

6. 发明申请

US20070218312A1 Whiskerless plated structure and plating method 有权
标题翻译：无晶圆镀层结构和电镀方法
公开(公告)号：US20070218312A1
公开(公告)日：2007-09-20
申请号：US11473014
申请日：2006-06-23
申请人： Seiki Sakuyama , Kozo Shimizu
发明人： Seiki Sakuyama , Kozo Shimizu
IPC分类号： B32B15/01
CPC分类号： C22C13/00 , B32B15/015 , C22C9/02 , C22C13/02 , C23C18/1601 , C23C18/1651 , C23C18/1692 , C23C18/18 , C23C18/1848 , C23C18/48 , C23C18/52 , H01L2924/0002 , Y10T428/12715 , H01L2924/00
摘要： A plated structure is disclosed that includes a base formed of a copper-based material containing copper as a major component, a plating film formed of a tin-based material containing tin as a major component and provided over the base, and a tin-copper compound barrier film located at the boundary between the base and the plating film. The density of the tin-copper compound barrier film is greater than that of copper.
摘要翻译：公开了一种电镀结构，其包括由以铜为主要成分的铜基材料形成的基底，由锡作为主要成分并且设置在基底上的锡基材料形成的镀膜，以及锡 - 铜复合阻挡膜位于基底与镀膜之间的边界处。锡 - 铜化合物阻挡膜的密度大于铜的密度。

7. 发明授权

US06670264B2 Method of making electrode-to-electrode bond structure and electrode-to-electrode bond structure made thereby 有权
公开(公告)号：US06670264B2
公开(公告)日：2003-12-30
申请号：US10124268
申请日：2002-04-18
申请人： Seiki Sakuyama , Nobuhiro Imaizumi , Tomohisa Yagi
发明人： Seiki Sakuyama , Nobuhiro Imaizumi , Tomohisa Yagi
IPC分类号： H01L2144
CPC分类号： H05K3/321 , H01L21/563 , H01L24/11 , H01L24/29 , H01L24/32 , H01L2224/05568 , H01L2224/05573 , H01L2224/1147 , H01L2224/1148 , H01L2224/13099 , H01L2224/16225 , H01L2224/29011 , H01L2224/29111 , H01L2224/2919 , H01L2224/32225 , H01L2224/73103 , H01L2224/73104 , H01L2224/73203 , H01L2224/73204 , H01L2224/83191 , H01L2224/83192 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01015 , H01L2924/01016 , H01L2924/01019 , H01L2924/01022 , H01L2924/01023 , H01L2924/01027 , H01L2924/01029 , H01L2924/0103 , H01L2924/01033 , H01L2924/01046 , H01L2924/01047 , H01L2924/0105 , H01L2924/01051 , H01L2924/01075 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01084 , H01L2924/0132 , H01L2924/014 , H01L2924/12042 , H01L2924/15787 , H05K3/3436 , H05K3/3473 , H05K3/3484 , H05K2201/0209 , H05K2201/10977 , H05K2203/043 , H05K2203/054 , H05K2203/0568 , H01L2924/00 , H01L2924/01083 , H01L2224/13111 , H01L2924/00014 , H01L2924/3512 , H01L2924/00012
摘要： A process of making an electrode-to-electrode bond structure includes a step of forming a resin coating on a first bonding object having a first electrode portion in a manner such that the resin coating covers the first electrode portion. Then, an opening is formed in the resin coating to expose the first electrode portion. Then, the opening is filled with a metal paste containing a metal and a resin component. Then, the first bonding object is placed on a second bonding object having a second electrode portion in a manner such that the metal paste filled in the opening faces the second electrode portion while the resin coating contacts the second bonding object. Finally, heat-treatment is performed to cause the first electrode portion and the second electrode portion to be electrically connected with each other via the metal while causing the resin coating to harden.

8. 发明授权

US06518163B2 Method for forming bumps, semiconductor device, and solder paste 有权
标题翻译：用于形成凸块，半导体器件和焊膏的方法
公开(公告)号：US06518163B2
公开(公告)日：2003-02-11
申请号：US09746336
申请日：2000-12-26
申请人： Seiki Sakuyama , Yasuo Yamagishi , Masataka Mizukoshi
发明人： Seiki Sakuyama , Yasuo Yamagishi , Masataka Mizukoshi
IPC分类号： H01L2144
CPC分类号： H05K3/3484 , H01L21/4853 , H01L21/6835 , H01L23/49883 , H01L24/11 , H01L24/13 , H01L24/16 , H01L2224/05568 , H01L2224/05573 , H01L2224/11003 , H01L2224/1147 , H01L2224/13099 , H01L2224/141 , H01L2224/16145 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01015 , H01L2924/01029 , H01L2924/0103 , H01L2924/01033 , H01L2924/01047 , H01L2924/01049 , H01L2924/01051 , H01L2924/01056 , H01L2924/01061 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/1532 , H05K3/3436 , H05K3/3452 , H05K2201/0266 , H05K2201/10477 , H05K2201/10674 , H05K2201/10734 , H05K2203/043 , H05K2203/0568 , H05K2203/0574 , H05K2203/0577 , H05K2203/0769
摘要： The present invention relates to a bump formation method, comprising the steps of providing a mask, in which a plurality of openings have been formed corresponding to a plurality of electrode pads, to a substrate provided with this plurality of electrode pads, filling the openings with a solder paste, and heat treating the solder paste. The solder paste contains a solder powder. This solder powder is one that contains no more than 10 wt % particles whose diameter is greater than the thickness of the mask and no more than 1.5 times this thickness. Preferably, this solder powder is one that contains no more than 10 wt % particles whose diameter is greater than 40% of the diameter of the openings, or one that contains no more than 30 wt % particles whose diameter is 40 to 100% the thickness of the mask.
摘要翻译：凸点形成方法技术领域本发明涉及一种凸块形成方法，包括以下步骤：将具有多个电极焊盘的多个开口形成的掩模提供给设置有该多个电极焊盘的基板，焊膏，并对焊膏进行热处理。焊膏含有焊料粉末。该焊料粉末是含有不超过10重量％的直径大于掩模厚度且不大于该厚度的1.5倍的颗粒。优选地，该焊料粉末是含有不超过10重量％的直径大于开口直径的40％的颗粒，或者包含不超过30重量％的直径为40至100重量％的颗粒的焊料粉末的面具。

9. 发明授权

US06275750B1 Apparatus for setting heating condition in heating furnace and thermal analyzer for object to be heated in heating furnace 失效
标题翻译：用于加热炉中加热条件的设置和加热炉中被加热物体的热分析仪
公开(公告)号：US06275750B1
公开(公告)日：2001-08-14
申请号：US09116472
申请日：1998-07-16
申请人： Hiroki Uchida , Seiki Sakuyama
发明人： Hiroki Uchida , Seiki Sakuyama
IPC分类号： G05D2330
CPC分类号： G05D23/30 , G05D23/1934 , H05K3/3494
摘要： The present invention relates to a method and apparatus for setting heating conditions in a heating furnace wherein a temperature distribution of an object to be heated is measured required minimum times and thermal analysis for the object is performed, thereby optimally heating the object. When the object to be heated is heated by means of a plurality of heating sources in the heating furnace, heating conditions are set to the heating sources respectively, the object is heated, a temperature of the heated object is then detected at a plurality of detection points, a relationship between a variation in the heating conditions in one of the heating sources and a variation in a detected temperature at each of the detection points of the heated object is computed for each heating source, heating conditions in the heating source for causing the detection point of the heated object to have a target temperature are calculated based on the computed relationship, and the heating sources are controlled on the calculated heating conditions.
摘要翻译：本发明涉及一种用于设定加热炉中加热条件的方法和装置，其中测量被加热物体的温度分布需要最小时间，并且对物体进行热分析，从而最佳地加热物体。当通过加热炉中的多个加热源对被加热物进行加热时，分别对加热源设定加热条件，加热物体，然后在多次检测中检测被加热物体的温度对于每个加热源，计算加热源中的一个中的加热条件的变化与加热对象的每个检测点的检测温度的变化之间的关系，加热源中的加热条件基于计算的关系计算加热对象的具有目标温度的检测点，并且根据计算的加热条件控制加热源。

10. 发明授权

US5770835A Process and apparatus and panel heater for soldering electronic components to printed circuit board 失效
标题翻译：用于将电子元件焊接到印刷电路板的工艺和设备以及面板加热器
公开(公告)号：US5770835A
公开(公告)日：1998-06-23
申请号：US779523
申请日：1997-01-07
申请人： Seiki Sakuyama , Hiroki Uchida , Isao Watanabe
发明人： Seiki Sakuyama , Hiroki Uchida , Isao Watanabe
IPC分类号： B23K1/005 , B23K1/08 , B23K35/02 , B23K35/36 , H05B3/28 , H05K3/34 , F27B9/06 , F27D11/02 , H05B3/20
CPC分类号： B23K1/0053 , B23K1/08 , B23K35/025 , B23K35/3612 , H05B3/28 , H05B3/283 , H05B3/286 , H05K3/3494 , B23K2201/42 , Y10T29/49083
摘要： In accordance with the present invention, there is provided a soldering process comprising the steps of: providing in a furnace first and second heaters each adapted to emit infrared energy; setting a printed circuit boad, which has a solder paste and an electronic component thereon, in the furnace; heating the printed circuit boad with the first heater; and heating the electronic component with the second heater; wherein the first and second heaters have different radiation spectra such that infrared energy irradiated by the first heater is more absorbed by the printed circuit board and less absorbed by the electronic component than that irradiated by the second heater. The present invention also provides a soldering apparatus for use in such soldering process.
摘要翻译：根据本发明，提供了一种焊接方法，其包括以下步骤：在炉中设置每个适于发射红外能量的第一和第二加热器; 在炉中设置印刷电路板，其上具有焊膏和电子部件; 用第一个加热器加热印刷电路; 以及用所述第二加热器加热所述电子部件; 其中所述第一加热器和所述第二加热器具有不同的辐射光谱，使得由所述第一加热器照射的红外能量被所述印刷电路板吸收，并且比由所述第二加热器照射的红外能量被电子部件吸收的吸收少。本发明还提供一种用于这种焊接工艺的焊接装置。

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