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1. 发明授权

US06413357B1 Polishing apparatus 失效
标题翻译：抛光设备
公开(公告)号：US06413357B1
公开(公告)日：2002-07-02
申请号：US09666855
申请日：2000-09-21
申请人： Tetsuji Togawa , Seiji Katsuoka , Norio Kimura , Toyomi Nishi
发明人： Tetsuji Togawa , Seiji Katsuoka , Norio Kimura , Toyomi Nishi
IPC分类号： C23F102
CPC分类号： B24B53/017 , B24B55/045
摘要： A polishing apparatus is used for polishing a workpiece such as a semiconductor wafer to a flat mirror finish by a combination of chemical polishing and mechanical polishing. The polishing apparatus includes a turntable with a polishing cloth mounted on an upper surface thereof, a top ring for supporting the workpiece to be polished and pressing the workpiece against the polishing cloth, and a dressing tool for dressing the polishing cloth on the turntable. The polishing apparatus further includes a cover which covers an upper surface of the turntable for preventing liquid on the turntable from being scattered, and inserting holes formed in an upper wall of the cover for inserting the top ring and the dressing tool therethrough.
摘要翻译：抛光装置用于通过化学抛光和机械抛光的组合将诸如半导体晶片的工件抛光到平整镜面。抛光装置包括：具有安装在其上表面上的抛光布的转台，用于支撑待抛光工件的顶环，并将工件压靠在抛光布上;以及修整工具，用于将抛光布修整在转台上。抛光装置还包括覆盖转盘上表面以防止转台上的液体散落的盖，以及形成在盖的上壁中的插孔，用于插入顶环和修整工具。

2. 发明授权

US06139677A Polishing apparatus 失效
标题翻译：抛光设备
公开(公告)号：US06139677A
公开(公告)日：2000-10-31
申请号：US787916
申请日：1997-01-23
申请人： Tetsuji Togawa , Seiji Katsuoka , Norio Kimura , Toyomi Nishi
发明人： Tetsuji Togawa , Seiji Katsuoka , Norio Kimura , Toyomi Nishi
IPC分类号： B24B53/007 , B24B53/017 , B24B55/04 , C23F1/02
CPC分类号： B24B53/017 , B24B55/045
摘要： A polishing apparatus 70 is used for polishing a workpiece such as a semiconductor wafer to a flat mirror finish by a combination of chemical polishing and mechanical polishing. The polishing apparatus includes a turntable 73 with a polishing 74 cloth mounted on an upper surface thereof, a top ring 75 for supporting the workpiece to be polished and pressing the workpiece against the polishing cloth, and a dressing tool 79 for dressing the polishing cloth on the turntable. The polishing apparatus further includes a cover 10 which covers an upper surface of the turntable for preventing liquid on the turntable from being scattered, and inserting holes 17 and 21 formed in an upper wall of the cover for inserting the top ring and the dressing tool therethrough.
摘要翻译：抛光装置70用于通过化学抛光和机械抛光的组合将诸如半导体晶片的工件抛光到平面镜面。抛光装置包括：转台73，其上表面安装有抛光74布;顶环75，用于支撑待抛光的工件并将工件压靠在抛光布上;以及修整工具79，用于将抛光布修整在转盘。抛光装置还包括覆盖转台上表面以防止转台上的液体散落的盖10，以及形成在盖的上壁中的插入孔17和21，用于将顶环和修整工具穿过其中。

3. 发明授权

US5931723A Polishing apparatus 失效
标题翻译：抛光设备
公开(公告)号：US5931723A
公开(公告)日：1999-08-03
申请号：US864905
申请日：1997-05-29
申请人： Seiji Katsuoka , Toyomi Nishi , Tetsuji Togawa
发明人： Seiji Katsuoka , Toyomi Nishi , Tetsuji Togawa
IPC分类号： H01L21/302 , B08B15/02 , B24B55/12 , H01L21/02 , H01L21/304 , H01L21/3065 , B24B1/00
CPC分类号： B24B37/105 , B08B15/02 , B24B55/12
摘要： A polishing apparatus is used for polishing a workpiece such as a semiconductor wafer to a flat mirror finish. The polishing apparatus has an exhaust device for exhausting air in the polishing apparatus. The polishing apparatus includes a housing, a polishing section housed in the housing for polishing a workpiece, a cleaning section housed in the housing for cleaning the workpiece which has been polished, and a base comprising a plurality of structural members for supporting at least one device in at least one of the cleaning section and the polishing section. At least one of the structural members has a fluid passage therein and intake openings to serve as an exhaust duct. The polishing apparatus further comprises a main exhaust duct communicating with the exhaust duct and extending to an exterior of the housing for exhausting air introduced in the exhaust duct.
摘要翻译：抛光装置用于将诸如半导体晶片的工件抛光到平面镜面。抛光装置具有用于在抛光装置中排出空气的排气装置。抛光装置包括壳体，容纳在用于抛光工件的壳体中的抛光部分，容纳在壳体中用于清洁已经被抛光的工件的清洁部分，以及包括多个结构部件的基部，用于支撑至少一个装置在清洁部分和抛光部分中的至少一个中。结构构件中的至少一个具有其中的流体通道和用作排气管的进气口。抛光装置还包括与排气管道连通并延伸到壳体的外部的主排气管道，用于排出引入排气管道中的空气。

4. 发明授权

US5860847A Polishing apparatus 失效
标题翻译：抛光设备
公开(公告)号：US5860847A
公开(公告)日：1999-01-19
申请号：US708948
申请日：1996-09-06
申请人： Kunihiko Sakurai , Tetsuji Togawa , Toyomi Nishi , Seiji Katsuoka , Hiromi Yajima , Masako Kodera
发明人： Kunihiko Sakurai , Tetsuji Togawa , Toyomi Nishi , Seiji Katsuoka , Hiromi Yajima , Masako Kodera
IPC分类号： B24B37/013 , B24B37/04 , B24B49/04 , B24B49/16 , H01L21/66 , B24B49/00
CPC分类号： B24B37/013 , B24B37/04 , B24B49/04 , B24B49/16 , H01L22/26
摘要： A polishing apparatus has a turntable with an abrasive cloth mounted on an upper surface thereof and a top ring disposed above the turntable for supporting a workpiece to be polished against the abrasive cloth under predetermined pressure. The turntable is rotatable by a first motor through a timing pulley connected to the first motor, and the top ring is rotatable by a second motor through a timing pulley connected to the second motor. A torque detector incorporated in the timing pulley connected to at least one of the first motor and the second motor detects an output torque produced by the at least one of the first motor and the second motor.
摘要翻译：抛光装置具有安装在其上表面上的研磨布的转台和设置在转盘上方的顶环，用于在预定压力下将待抛光的工件支撑在磨料上。转盘可以通过连接到第一马达的定时皮带由第一马达旋转，并且顶环可以通过连接到第二马达的定时皮带的第二马达转动。并入到与第一电动机和第二电动机中的至少一个连接的正时轮中的转矩检测器检测由第一电动机和第二电动机中的至少一个产生的输出转矩。

5. 发明授权

US5839947A Polishing apparatus 失效
标题翻译：抛光设备
公开(公告)号：US5839947A
公开(公告)日：1998-11-24
申请号：US795511
申请日：1997-02-05
申请人： Norio Kimura , Kunihiko Sakurai , Tetsuji Togawa , Seiji Katsuoka , Toyomi Nishi
发明人： Norio Kimura , Kunihiko Sakurai , Tetsuji Togawa , Seiji Katsuoka , Toyomi Nishi
IPC分类号： B24B53/007 , B24B53/017 , B24B5/00 , B24B29/00
CPC分类号： B24B53/017
摘要： A polishing apparatus is used for polishing a workpiece such as a semiconductor wafer to a flat mirror finish. The polishing apparatus includes a turntable having a polishing surface thereon, a top ring, for holding a workpiece to be polished and pressing the workpiece against the polishing surface, which is movable between a polishing position inside of the turntable and a standby position outside of the turntable, and a first device for keeping at least a lower surface of the top ring wet while the top ring is in the standby position. The polishing apparatus further includes a dressing tool for dressing the polishing surface on the turntable, and a second device for keeping at least a lower surface of the dressing tool wet while the dressing tool is in a standby position.
摘要翻译：抛光装置用于将诸如半导体晶片的工件抛光到平面镜面。抛光装置包括其上具有抛光表面的转台，用于保持要抛光的工件的顶环，并将工件压靠在抛光表面上，该抛光表面可在转盘内部的抛光位置和位于转盘外部的待机位置之间移动转盘和用于在顶环处于待机位置时保持顶环的至少下表面湿润的第一装置。抛光装置还包括用于修整转台上的抛光表面的修整工具，以及用于在修整工具处于待机位置时保持敷料工具的至少下表面湿润的第二装置。

6. 发明授权

US5643067A Dressing apparatus and method 失效
标题翻译：敷料装置和方法
公开(公告)号：US5643067A
公开(公告)日：1997-07-01
申请号：US571598
申请日：1995-12-13
申请人： Seiji Katsuoka , Kunihiko Sakurai , Tetsuji Togawa
发明人： Seiji Katsuoka , Kunihiko Sakurai , Tetsuji Togawa
IPC分类号： B24B53/00 , B24B53/007 , B24B53/017 , B24B21/18 , B24B33/00 , B24B47/26 , B24B55/00
CPC分类号： B24B53/017 , B24B53/00
摘要： A dressing apparatus is used to resurface a polishing surface of a polish cloth used to polish semiconductor wafers. A dressing brush which spins on its own axis is also coupled to a drive shaft of a main drive of the dressing apparatus through a planetary gear mechanism so that the brush will rotate or orbit about the drive shaft. Therefore, the dressing brush traces a complex path and its dressing action is spread over a wide surface area of the polishing cloth to produce thorough resurfacing of the polishing surface. The service life of the cloth is significantly increased and contributes to improving the overall efficiency of preparing high quality polished semiconductor wafers. For economy, the dressing apparatus can be mounted easily on a conventional polishing apparatus having a dressing facility.
摘要翻译：修整装置用于重新表面抛光用于抛光半导体晶片的抛光布的抛光表面。在其自身的轴线上旋转的修整刷也通过行星齿轮机构联接到修整设备的主驱动器的驱动轴，使得电刷将围绕驱动轴旋转或轨道。因此，修整刷跟踪复杂的路径，并且其修整作用分布在抛光布的宽表面区域上，以产生抛光表面的彻底表面。布的使用寿命显着增加，有助于提高制备高质量抛光半导体晶片的整体效率。为了经济，敷料装置可以容易地安装在具有修整设备的常规抛光装置上。

7. 发明授权

US06312312B1 Polishing apparatus 有权
标题翻译：抛光设备
公开(公告)号：US06312312B1
公开(公告)日：2001-11-06
申请号：US09175561
申请日：1998-10-20
申请人： Tetsuji Togawa , Nobuyuki Takada , Seiji Katsuoka , Hiroyuki Osawa
发明人： Tetsuji Togawa , Nobuyuki Takada , Seiji Katsuoka , Hiroyuki Osawa
IPC分类号： B24B722
CPC分类号： B24B37/345 , B23Q7/06 , B24B37/04
摘要： A polishing apparatus is used for polishing a workpiece such as a semiconductor wafer to a flat mirror finish. The polishing apparatus includes a turntable having a polishing surface, a top ring for supporting the workpiece to be polished and pressing the workpiece against the polishing surface, and a transferring device for transferring the workpiece between the top ring and the transferring device. The transferring device includes a stage having a support surface for supporting the workpiece, an actuating unit for moving the stage in a vertical direction, and a guide member disposed radially outwardly of the stage and having a guide surface of an inverted conical shape. The centering of the workpiece is conducted by bringing a periphery of the workpiece into contact with the guide surface, and then the workpiece is transferred from the transferring device to the top ring by raising the stage.
摘要翻译：抛光装置用于将诸如半导体晶片的工件抛光到平面镜面。抛光装置包括具有研磨面的转台，用于支撑待研磨的工件的顶环，将工件压靠在研磨面上，以及用于在顶环和转印装置之间传递工件的转印装置。转印装置包括具有用于支撑工件的支撑表面的台，用于沿垂直方向移动台的致动单元和设置在该台的径向外侧并具有倒圆锥形形状的引导表面的引导构件。通过使工件的周边与引导面接触来进行工件的定心，然后通过升高工作台将工件从传送装置传送到顶环。

8. 发明授权

US5647792A Polishing apparatus 失效
标题翻译：抛光设备
公开(公告)号：US5647792A
公开(公告)日：1997-07-15
申请号：US580341
申请日：1995-12-28
申请人： Seiji Katsuoka , Kunihiko Sakurai , Tetsuji Togawa
发明人： Seiji Katsuoka , Kunihiko Sakurai , Tetsuji Togawa
IPC分类号： B24B37/12 , B24B5/00
CPC分类号： B24B45/006 , B24B37/11
摘要： A polishing apparatus has a cloth cartridge detachably mounted on a turntable, an abrasive liquid nozzle for supplying an abrasive liquid onto an abrasive cloth of the cloth cartridge, and a top ring for holding a workpiece against the abrasive cloth. The turntable and the top ring are rotatable relatively to each other while the abrasive liquid is being supplied onto the abrasive cloth from the abrasive liquid nozzle and the workpiece is being held against the abrasive cloth. A cartridge tightener which is angularly movably mounted on the turntable has a tapered surface for engaging an engageable surface of the cloth cartridge in response to angular movement of the cartridge tightener. The tapered surface is included to a plane substantially perpendicular to an axis about which the turntable is rotatable. The cartridge tightener also has a resilient member acting between the tapered surface and the turntable and elastically deformable for applying resilient forces between the tapered surface and the engageable surface in response to angular movement of the cartridge tightener.
摘要翻译：抛光装置具有可拆卸地安装在转台上的布料盒，用于将研磨液体供应到布料筒的研磨布上的研磨液喷嘴和用于将工件保持在研磨布上的顶环。当研磨液从研磨液喷嘴供给到研磨布上并且工件被保持抵靠研磨布时，转盘和顶环可相对旋转。可旋转地安装在转台上的盒式收紧器具有锥形表面，用于响应于盒式收紧器的角度运动而啮合布料盒的可接合表面。锥形表面被包括在基本上垂直于转盘可旋转的轴线的平面内。盒式收紧器还具有作用在锥形表面和转盘之间的弹性构件，并且可弹性变形，以响应于盒式收紧器的角度运动而在锥形表面和可接合表面之间施加弹性力。

9. 发明授权

US06354918B1 Apparatus and method for polishing workpiece 有权
标题翻译：抛光工件的设备和方法
公开(公告)号：US06354918B1
公开(公告)日：2002-03-12
申请号：US09335778
申请日：1999-06-18
申请人： Tetsuji Togawa , Nobuyuki Takada , Seiji Katsuoka , Kenichi Shigeta
发明人： Tetsuji Togawa , Nobuyuki Takada , Seiji Katsuoka , Kenichi Shigeta
IPC分类号： B24B100
CPC分类号： B24B53/017
摘要： A polishing apparatus has a turntable with a polishing surface, a top ring for pressing a workpiece against the polishing surface under a given pressure to polish the workpiece, and a dresser for dressing the polishing surface. The polishing surface has an outer circumferential edge portion cut off or the dresser has a predetermined outside diameter, such that the polishing surface has an outer circumferential edge positioned in alignment with or radially inwardly of an outer circumferential edge of the dresser in the radial direction of the turntable when the polishing surface is dressed by the dresser.
摘要翻译：抛光装置具有带有抛光面的转台，用于在给定压力下将工件压靠在抛光表面上以抛光工件的顶环和用于修整抛光表面的修整器。抛光表面具有切割的外周缘部分或修整器具有预定的外径，使得抛光表面具有位于修整器的外周边缘的径向方向上与外周边缘对准或径向向内的外圆周边缘抛光表面由梳妆台穿着时的转盘。

10. 发明授权

US07976362B2 Substrate polishing apparatus and method 有权
标题翻译：基材抛光装置及方法
公开(公告)号：US07976362B2
公开(公告)日：2011-07-12
申请号：US12534465
申请日：2009-08-03
申请人： Seiji Katsuoka , Masahiko Sekimoto , Junji Kunisawa , Mitsuru Miyazaki , Teruyuki Watanabe , Kenichi Kobayashi , Masayuki Kumekawa , Toshio Yokoyama
发明人： Seiji Katsuoka , Masahiko Sekimoto , Junji Kunisawa , Mitsuru Miyazaki , Teruyuki Watanabe , Kenichi Kobayashi , Masayuki Kumekawa , Toshio Yokoyama
IPC分类号： B24B29/00
CPC分类号： B24B37/04 , B24B55/02 , Y10S451/914
摘要： A substrate polishing apparatus includes a substrate holding mechanism having a head for holding a substrate to be polished, and a polishing mechanism including a polishing table with a polishing pad mounted thereon. The substrate held by the head is pressed against the polishing pad on the polishing table to polish the substrate by relative movement of the substrate and the polishing pad. The substrate polishing apparatus also includes a substrate transfer mechanism for delivering the substrate to be polished to the head and receiving the polished substrate. The substrate transfer mechanism includes a substrate to-be-polished receiver for receiving the substrate to be polished, and a polished substrate receiver for receiving the substrate which has been polished.
摘要翻译：一种基板研磨装置，具备：具有保持被研磨基板的头部的基板保持机构，以及具备安装有研磨垫的研磨台的研磨机构。由头部保持的基板被压靠在抛光台上的抛光垫上，以通过基板和抛光垫的相对运动来抛光基板。基板抛光装置还包括用于将要抛光的基板输送到头部并且接收经抛光的基板的基板传送机构。基板转印机构包括用于接收待抛光的基板的待抛光基板和用于接收被抛光的基板的抛光的基板接收器。

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