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1. 发明授权

US5252519A Multilayered ceramic substrate and method of manufacturing the same 失效
标题翻译：多层陶瓷基板及其制造方法
公开(公告)号：US5252519A
公开(公告)日：1993-10-12
申请号：US785750
申请日：1991-10-31
申请人： Seiichi Nakatani , Tsutomu Nishimura , Satoru Yuhaku , Yasuhiko Hakotani
发明人： Seiichi Nakatani , Tsutomu Nishimura , Satoru Yuhaku , Yasuhiko Hakotani
IPC分类号： H01B1/22 , H01L23/498 , H05K1/09 , H05K3/46 , H01L21/60
CPC分类号： H05K1/092 , H01L23/49822 , H01L23/49883 , H01L2224/16225 , H01L2224/45144 , H01L2924/01046 , H01L2924/01078 , H01L2924/01079 , H01L2924/09701 , Y10T29/4913
摘要： A multilayered glass-ceramic substrate using copper as wiring material is fabricated by a step of forming wiring patterns with Au paste for connection of semiconductor chip prepared by adding at least one of Ni powder, Pt powder and Pd powder to Au powder, and copper oxide paste mainly composed of CuO powder, on a green sheet, and burning out the organic pattern by heat treatment in air, a step of reducing the copper oxide electrode by heat treatment in a reducing atmosphere containing hydrogen, and a step of sintering the substrate material, copper oxide electrode and gold electrode by heat treatment in nitrogen. Since the Au wiring pattern is formed on the top layer of the multilayered substrate in this constitution, wire bonding of high reliability is realized. Besides, by making use of the excellent solderability of Au, it may be also applied in flip-chip mounting of semiconductor. In addition, in this Au paste composition, the melting point of Au may be raised, and alloying or fusing is avoided if sintered at 900.degree. C. together with Cu electrode.
摘要翻译：使用铜作为布线材料的多层玻璃陶瓷基板通过以下步骤制造：用Au糊形成用于连接通过将Ni粉末，Pt粉末和Pd粉末中的至少一种添加到Au粉末中而制备的半导体芯片的布线图案和氧化铜主要由CuO粉末组成的糊料，在生片上通过在空气中热处理而烧制有机图案，通过在含氢还原气氛中进行热处理来还原氧化铜电极的工序，以及烧结基板材料的工序，氧化铜电极和金电极通过在氮气中热处理。在这种结构中，由于在多层基板的顶层上形成Au布线图形，所以实现了高可靠性的引线接合。此外，通过利用Au的优异的可焊性，也可以应用于半导体的倒装芯片安装。此外，在该Au糊剂组合物中，Au的熔点可以提高，如果在900℃下与Cu电极一起烧结，则避免合金化或熔融。

2. 发明授权

US5014158A Laminated ceramic capacitor 失效
标题翻译：层压陶瓷电容器
公开(公告)号：US5014158A
公开(公告)日：1991-05-07
申请号：US507568
申请日：1990-04-11
申请人： Tsutomu Nishimura , Seiichi Nakatani , Satoru Yuhaku , Yasuhiko Hakotani , Tatsuro Kikuchi
发明人： Tsutomu Nishimura , Seiichi Nakatani , Satoru Yuhaku , Yasuhiko Hakotani , Tatsuro Kikuchi
IPC分类号： C04B35/49 , H01G4/12
CPC分类号： C04B35/49 , H01G4/1245 , Y10T29/435
摘要： A laminated ceramic capacitor comprises a plurality of inner electrode layers for developing a capacitance, dielectric layers sandwiched with the inner electrode layers, and a pair of outer electrodes coupled to their associated inner electrode layers for output of the capacitance. The inner electrode layers are made of Ni. The dielectric layers are made of a dielectric ceramic composition having a structural formula of:{Bam(Til-xZrx)O2+m}1-.alpha.-.beta.-{MnO2}.alpha.-{X}.beta.where X is at least one of Yb2O3, Dy2O3, and ThO2 and m, x, .alpha., and .beta. are expressed as:0.98.ltoreq.m.ltoreq.1.020.ltoreq.x.ltoreq.0.20.005.ltoreq..alpha..ltoreq.0.050.001.ltoreq..beta..ltoreq.0.02so that the laminated ceramic capacitor can be minimized in the size, increased in the capacitance, and reduced in the cost of production.
摘要翻译：层叠陶瓷电容器包括用于显影电容的多个内部电极层，夹在内部电极层的电介质层和耦合到其相关联的内部电极层的一对外部电极，用于输出电容。内部电极层由Ni制成。电介质层由结构式为：{Bam（Til-xZrx）O 2 + m} 1-α-β - {MnO 2}α - {X}β的电介质陶瓷组合物制成，其中X是Yb 2 O 3中的至少一种，Dy 2 O 3和ThO 2，m，x，α和β表示为：0.98

3. 发明授权

US5004715A Dielectric ceramic composition and a multilayer ceramic capacitor and a method of manufacturing a multilayer ceramic capacitor 失效
标题翻译：介电陶瓷组合物和多层陶瓷电容器以及制造多层陶瓷电容器的方法
公开(公告)号：US5004715A
公开(公告)日：1991-04-02
申请号：US483462
申请日：1990-02-22
申请人： Yasuhiko Hakotani , Seiichi Nakatani , Satoru Yuuhaku , Tsutomu Nishimura , Toru Ishida
发明人： Yasuhiko Hakotani , Seiichi Nakatani , Satoru Yuuhaku , Tsutomu Nishimura , Toru Ishida
IPC分类号： C04B35/00 , C04B35/497 , C04B35/499 , H01B3/12 , H01G4/008 , H01G4/12
CPC分类号： H01G4/0085 , C04B35/497 , C04B35/499 , H01G4/1254
摘要： A low temperature sintering dielectric ceramic composition, which exhibits high dielectric constant, low dielectric loss, high electrical resistivity, high mechanical strength and narrow grain size distribution, is disclosed. The ceramic composition is a binary system comprising lead magnesium niobate (Pb(Mg.sub.1/3 Nb.sub.2/3)O.sub.3) and copper oxide, or a ternary system comprising lead magnesium niobate (Pb(Mg.sub.1/3 Nb.sub.2/3)O.sub.3), lead titanate (PbTiO.sub.3) and copper oxide. A multilayer ceramic capacitor comprising internal copper electrodes and ceramic dielectric layers consisting of the dielectric ceramic composition is also disclosed. A method of readily manufacturing the multilayer ceramic capacitor with copper internal electrodes is also disclosed.This fabrication method comprises a stop of forming a multilayer laminate by the green tape multilayer laminating method using dielectric ceramic tapes and a conductor paste containing CuO as its main component; a step of heat-treatment for decomposing and removing organic binder in air (binder removing process); a step of reducing CuO in the internal electrode layers to copper by heat-treatment in a mixed gas atmosphere of nitrogen and hydrogen (reduction process); and a step of sintering the multilayer laminate in a nitrogen atmosphere (sintering process).
摘要翻译：公开了一种具有高介电常数，低介电损耗，高电阻率，高机械强度和窄晶粒尺寸分布的低温烧结介电陶瓷组合物。陶瓷组合物是包含铌酸铅镁（Pb（Mg1 / 3Nb2 / 3）O3）和氧化铜的二元体系，或包含铌酸铅镁（Pb（Mg1 / 3Nb2 / 3）O3），钛酸铅（PbTiO3））和氧化铜。还公开了一种包括内部铜电极和由介电陶瓷组合物组成的陶瓷电介质层的多层陶瓷电容器。还公开了一种容易地制造具有铜内部电极的多层陶瓷电容器的方法。该制造方法包括通过使用电介质陶瓷带和含有CuO作为其主要成分的导体糊的生胶带多层层压法来形成多层层压体; 在空气中分解除去有机粘合剂的热处理步骤（粘合剂除去工艺）; 通过在氮气和氢气的混合气体气氛中通过热处理将内部电极层中的CuO还原成铜的步骤（还原过程）; 以及在氮气氛中烧结多层层叠体的工序（烧结工序）。

4. 发明授权

US4906405A Conductor composition and method of manufacturing a multilayered ceramic body using the composition 失效
标题翻译：导体组合物和使用该组合物制造多层陶瓷体的方法
公开(公告)号：US4906405A
公开(公告)日：1990-03-06
申请号：US194967
申请日：1988-05-17
申请人： Seiichi Nakatani , Tsutomu Nishimura , Satoru Yuhaku , Minehiro Itagaki
发明人： Seiichi Nakatani , Tsutomu Nishimura , Satoru Yuhaku , Minehiro Itagaki
IPC分类号： H01B1/08 , H05K1/03 , H05K1/09 , H05K3/46
CPC分类号： H05K3/4611 , C03C3/072 , C03C8/14 , H01B1/08 , H05K1/092 , H05K3/4629 , H05K1/0306
摘要： Disclosed are a CuO conductor paste which is effective for making a multilayered ceramic body, the conductor material of which is made of copper, and a method of manufacturing a multilayered ceramic body using the conductor paste. The conductor paste is made of CuO as the main component with an addition of at least one of PbO-based glass, or any of Bi.sub.2 O.sub.3 -based glass, CuO-based glass and CuAl.sub.2 O.sub.4 as the additive. The multilayered ceramic body is manufactured by a method comprising a forming process for making a multilayered body from the conductor paste and dielectric material, a binder removing process by heat treating the multilayered body, thus obtained, in air, a reduction process for reducing CuO to copper in a mixed gas atmosphere of hydrogen and nitrogen, and a sintering process for sintering the multilayered body thus reduced in a nitrogen gas atmosphere.
摘要翻译：公开了一种CuO导体糊，其制造多层陶瓷体，其导体材料由铜制成，以及使用该导体膏制造多层陶瓷体的方法。导体糊以CuO为主要成分，添加PbO系玻璃，Bi2O3系玻璃，CuO系玻璃，CuAl 2 O 4等中的至少一种作为添加剂。多层陶瓷体通过包括从导体糊和电介质材料制造多层体的成形方法的方法制造，通过在空气中热处理由此获得的多层体的粘合剂去除工艺，将CuO还原为在氢气和氮气的混合气体气氛中的铜，以及在氮气气氛中烧结多层体的烧结方法。

5. 发明授权

US4695403A Thick film conductor composition 失效
标题翻译：厚膜导体组成
公开(公告)号：US4695403A
公开(公告)日：1987-09-22
申请号：US875083
申请日：1986-06-17
申请人： Tsutomu Nishimura , Seiichi Nakatani , Satoru Yuhaku , Toru Ishida
发明人： Tsutomu Nishimura , Seiichi Nakatani , Satoru Yuhaku , Toru Ishida
IPC分类号： C04B41/51 , C04B41/88 , H01B1/16 , H01L23/498 , H05K1/09 , H01B1/00
CPC分类号： C04B41/88 , C04B41/5127 , H01B1/16 , H01L23/49883 , H01L2924/0002 , H01L2924/09701 , H05K1/092
摘要： A thick film conductor composition for a ceramic wiring substrate comprises an inorganic ingredient mainly composed of a copper oxide powder added with a metal capable of forming a homogeneous solid solution with copper, and an organic vehicle. The inorganic ingredient may be further added with a manganese oxide or a heat resistant insulating material such as ceramics and/or glass.
摘要翻译：用于陶瓷布线基板的厚膜导体组合物包括主要由添加有能够形成具有铜的均匀固溶体的金属的氧化铜粉末和有机载体的无机成分。无机成分还可以添加氧化锰或耐热绝缘材料如陶瓷和/或玻璃。

6. 发明授权

US5004640A Multilayered ceramic substrates and method for manufacturing the same 失效
标题翻译：多层陶瓷基板及其制造方法
公开(公告)号：US5004640A
公开(公告)日：1991-04-02
申请号：US321702
申请日：1989-03-10
申请人： Seiichi Nakatani , Satoru Yuhaku , Tsutomu Nishimura , Yukio Terada , Yasuyuki Baba
发明人： Seiichi Nakatani , Satoru Yuhaku , Tsutomu Nishimura , Yukio Terada , Yasuyuki Baba
IPC分类号： H05K3/46 , B32B18/00 , C04B35/18 , C04B35/634 , C04B35/636 , H01L21/48 , H01L23/15 , H05K1/03
CPC分类号： C04B35/63416 , B32B18/00 , C04B35/18 , C04B35/634 , C04B35/6342 , C04B35/63424 , C04B35/6365 , H01L21/4857 , H01L23/15 , H05K1/0306 , C04B2237/34 , H01L2924/0002 , H01L2924/09701 , H05K3/4629 , Y10S428/901 , Y10T428/24802 , Y10T428/24917 , Y10T428/24926
摘要： Multilayered ceramic substrates having Cu electrode patterns in or on ceramic-glass insulating layers which consist essentially of Al.sub.2 O.sub.3, SiO.sub.2, B.sub.2 O.sub.3, Na.sub.2 O, K.sub.2 O, CaO, MgO and PbO. The methods for manufacturing the substrate comprises thermally treating a laminate of alternately superimposing ceramic-glass insulating layers and CuO-based electrode layers of desired patterns in air or in a molecular oxygen-containing atmosphere to eliminate organic binders from the laminates by burning out, reducing the CuO into metallic Cu at low temperatures in an atmosphere containing hydrogen, and firing the thus reduced laminate in an inert gas such as nitrogen. The firing is effected at 850.degree. to 950.degree. C. The multilayered ceramic substrate may also be obtained by forming ceramic-glass insulating layers and CuO-based electrode layers alternately on a sintered ceramic support, followed by the thermal treatment, reduction and firing set forth above.

7. 发明授权

US4812422A Dielectric paste and method of manufacturing the paste 失效
标题翻译：电介质糊及其制造方法
公开(公告)号：US4812422A
公开(公告)日：1989-03-14
申请号：US869904
申请日：1986-06-03
申请人： Satoru Yuhaku , Seiichi Nakatani , Tsutomu Nishimura , Toru Ishida
发明人： Satoru Yuhaku , Seiichi Nakatani , Tsutomu Nishimura , Toru Ishida
IPC分类号： H01L21/31 , C03C3/091 , H01B3/02 , H01B3/10 , H05K1/03 , C03C8/16 , C03C8/14
CPC分类号： H05K1/0306 , C03C3/091 , H01B3/10 , H05K3/4629
摘要： Disclosed is a dielectric paste for a ceramic multilayer wiring substrate, of which feature, among others, lies in the composition of inorganic components comprised of ceramics made of Al.sub.2 O.sub.3, SiO.sub.2, CaO and MgO, and a borosilicate glass. This can be prepared by mixing a part of the glass with the ceramic, calcining the mixture at a high temperature, and then adding the remaining glass to mix with the calcined product. The insulation layer is densely formed, and a dielectric paste excelling in electric insulating property can be obtained by mixing this composition with an organic liquid.
摘要翻译：公开了一种用于陶瓷多层布线基板的电介质浆料，其特征在于其中包括由Al 2 O 3，SiO 2，CaO和MgO制成的陶瓷和硼硅酸盐玻璃组成的无机组分的组成。这可以通过将玻璃的一部分与陶瓷混合，在高温下煅烧混合物，然后加入剩余的玻璃与煅烧产物混合来制备。绝缘层密集地形成，并且通过将该组合物与有机液体混合，可以获得优异的电绝缘性能的电介质糊料。

8. 发明授权

US4795512A Method of manufacturing a multilayer ceramic body 失效
标题翻译：制造多层陶瓷体的方法
公开(公告)号：US4795512A
公开(公告)日：1989-01-03
申请号：US18579
申请日：1987-02-25
申请人： Seiichi Nakatani , Tsutomu Nishimura , Satoru Yuhaku , Toru Ishida
发明人： Seiichi Nakatani , Tsutomu Nishimura , Satoru Yuhaku , Toru Ishida
IPC分类号： B32B18/00 , C04B35/622 , C04B35/64 , H05K1/03 , H05K1/09 , H05K3/46 , H01B1/06
CPC分类号： H05K3/4629 , B32B18/00 , C04B35/622 , C04B35/64 , H05K3/4611 , C04B2235/6567 , C04B2235/658 , C04B2237/343 , C04B2237/525 , C04B2237/62 , C04B2237/68 , C04B2237/704 , C04B2237/76 , H05K1/0306 , H05K1/092
摘要： A method of manufacturing a multilayer ceramic using Cu as the conductor material is disclosed. This method comprises a step of forming a multilayer laminate by the green tape multilayer laminating method or by the thick film printing method on ceramic substrate with an insulating material with a mixture of ceramic and glass containing lead oxide as its main component and a conductor paste with CuO as its main component; a step of heat-treatment for decomposing and removing organic binder in air (binder removing process); a step of causing reduction at temperatures where copper oxide is reduced, but lead oxide is not, in a mixed gas atmosphere of nitrogen and hydrogen (reduction process); and a step of firing in a nitrogen atmosphere, thereby effecting sintering of the insulating material composed of ceramic and glass containing lead oxide and metallization of copper electrodes (firing process). For the uppermost layer electrodes, metal copper paste is employed, and a pattern printing process is conducted subsequent to the aforementioned reduction process, so that the sintering of the insulating material and the metallization of the uppermost layer are simultaneously performed; in this way, highly reliable uppermost layer Cu electrodes are obtainable.
摘要翻译：公开了使用Cu作为导体材料的多层陶瓷的制造方法。该方法包括通过生胶带多层层压法或通过厚膜印刷方法在陶瓷基板上形成多层层压体的步骤，其中绝缘材料与陶瓷和玻璃的混合物以含氧化铅为主要成分的混合物和具有 CuO为主要成分; 在空气中分解除去有机粘合剂的热处理步骤（粘合剂除去工艺）; 在氮和氢的混合气体气氛中还原氧化铜还原的氧化还原反应的步骤（还原过程）; 以及在氮气气氛中烧成的步骤，从而实现由含有氧化铅的陶瓷和玻璃构成的绝缘材料和铜电极的金属化（烧成工序）的烧结。对于最上层电极，使用金属铜膏，并且在上述还原处理之后进行图案印刷工艺，使得绝缘材料的烧结和最上层的金属化同时进行; 以这种方式，可以获得高可靠性的最上层Cu电极。

9. 发明授权

US4906404A Copper conductor composition 失效
标题翻译：铜导体组成
公开(公告)号：US4906404A
公开(公告)日：1990-03-06
申请号：US267592
申请日：1988-11-07
申请人： Masatoshi Suehiro , Masashi Echigo , Masami Sakuraba , Yutaka Mitsune , Seiichi Nakatani , Tsutomu Nishimura
发明人： Masatoshi Suehiro , Masashi Echigo , Masami Sakuraba , Yutaka Mitsune , Seiichi Nakatani , Tsutomu Nishimura
IPC分类号： H01B1/22 , H01L23/498 , H05K1/09
CPC分类号： H05K1/092 , H01B1/22 , H01L23/49883 , H01L2924/0002
摘要： A copper conductor composition having an improved solderability as well as a good adhesion, which comprises a copper powder, an inorganic binder and a boride or silicide of a metal such as W, Mo, Ti, Ta, Nb or Cr. The solderability is kept on a good level even if the composition is subjected to a firing operation repeatedly.
摘要翻译：具有改善的可焊性以及良好粘合性的铜导体组合物，其包含铜粉末，无机粘合剂和诸如W，Mo，Ti，Ta，Nb或Cr的金属的硼化物或硅化物。即使组合物重复进行烧制操作，可焊性也保持在良好的水平。

10. 发明授权

US4865772A Copper thick film conductor composition 失效
标题翻译：铜厚膜导体组成
公开(公告)号：US4865772A
公开(公告)日：1989-09-12
申请号：US271543
申请日：1988-11-15
申请人： Masatoshi Suehiro , Masashi Echigo , Yutaka Mitsune , Masami Sakuraba , Seiichi Nakatani , Tsutomu Nishimura
发明人： Masatoshi Suehiro , Masashi Echigo , Yutaka Mitsune , Masami Sakuraba , Seiichi Nakatani , Tsutomu Nishimura
IPC分类号： C04B41/88 , C23C24/08 , H01B1/16 , H05K1/09
CPC分类号： H05K1/092 , H01B1/16
摘要： A copper-containing thick film conductor composition comprising 55 to 95% by weight of an inorganic powder and 45 to 5% by weight of an organic medium, said inorganic powder comprising 100 parts by weight of a copper powder, 0.05 to 3 parts by weight of a zinc oxide powder, 1 to 7 parts by weight of a lead borate glass powder, 0.2 to 5 parts by weight of a borosilicate glass powder and 0 to 10 parts by weight of a copper snboxide powder having an average particle size of not more than 1.0 .mu.m. The composition of the present invention is excellent in solderability and adhesive strength to the substrate.
摘要翻译：一种含有55〜95重量％的无机粉末和45〜5重量％的有机介质的含铜厚膜导体组合物，所述无机粉末含有100重量份的铜粉，0.05〜3重量份的氧化锌粉末，1〜7重量份的硼酸铅玻璃粉末，0.2〜5重量份的硼硅酸盐玻璃粉末和0〜10重量份的平均粒径不大于的锡粉末粉末超过1.0亩。本发明的组合物对于基材的可焊性和粘合强度优异。

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