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1. 发明授权

US4865772A Copper thick film conductor composition 失效
标题翻译：铜厚膜导体组成
公开(公告)号：US4865772A
公开(公告)日：1989-09-12
申请号：US271543
申请日：1988-11-15
申请人： Masatoshi Suehiro , Masashi Echigo , Yutaka Mitsune , Masami Sakuraba , Seiichi Nakatani , Tsutomu Nishimura
发明人： Masatoshi Suehiro , Masashi Echigo , Yutaka Mitsune , Masami Sakuraba , Seiichi Nakatani , Tsutomu Nishimura
IPC分类号： C04B41/88 , C23C24/08 , H01B1/16 , H05K1/09
CPC分类号： H05K1/092 , H01B1/16
摘要： A copper-containing thick film conductor composition comprising 55 to 95% by weight of an inorganic powder and 45 to 5% by weight of an organic medium, said inorganic powder comprising 100 parts by weight of a copper powder, 0.05 to 3 parts by weight of a zinc oxide powder, 1 to 7 parts by weight of a lead borate glass powder, 0.2 to 5 parts by weight of a borosilicate glass powder and 0 to 10 parts by weight of a copper snboxide powder having an average particle size of not more than 1.0 .mu.m. The composition of the present invention is excellent in solderability and adhesive strength to the substrate.
摘要翻译：一种含有55〜95重量％的无机粉末和45〜5重量％的有机介质的含铜厚膜导体组合物，所述无机粉末含有100重量份的铜粉，0.05〜3重量份的氧化锌粉末，1〜7重量份的硼酸铅玻璃粉末，0.2〜5重量份的硼硅酸盐玻璃粉末和0〜10重量份的平均粒径不大于的锡粉末粉末超过1.0亩。本发明的组合物对于基材的可焊性和粘合强度优异。

2. 发明授权

US4906404A Copper conductor composition 失效
标题翻译：铜导体组成
公开(公告)号：US4906404A
公开(公告)日：1990-03-06
申请号：US267592
申请日：1988-11-07
申请人： Masatoshi Suehiro , Masashi Echigo , Masami Sakuraba , Yutaka Mitsune , Seiichi Nakatani , Tsutomu Nishimura
发明人： Masatoshi Suehiro , Masashi Echigo , Masami Sakuraba , Yutaka Mitsune , Seiichi Nakatani , Tsutomu Nishimura
IPC分类号： H01B1/22 , H01L23/498 , H05K1/09
CPC分类号： H05K1/092 , H01B1/22 , H01L23/49883 , H01L2924/0002
摘要： A copper conductor composition having an improved solderability as well as a good adhesion, which comprises a copper powder, an inorganic binder and a boride or silicide of a metal such as W, Mo, Ti, Ta, Nb or Cr. The solderability is kept on a good level even if the composition is subjected to a firing operation repeatedly.
摘要翻译：具有改善的可焊性以及良好粘合性的铜导体组合物，其包含铜粉末，无机粘合剂和诸如W，Mo，Ti，Ta，Nb或Cr的金属的硼化物或硅化物。即使组合物重复进行烧制操作，可焊性也保持在良好的水平。

3. 发明授权

US5977490A Conductive paste compound for via hole filling, printed circuit board which uses the conductive paste, and method of manufacturing the same 失效
标题翻译：用于通孔填充的导电浆料化合物，使用导电浆料的印刷电路板及其制造方法
公开(公告)号：US5977490A
公开(公告)日：1999-11-02
申请号：US780329
申请日：1997-01-08
申请人： Kouji Kawakita , Seiichi Nakatani , Tatsuo Ogawa , Masatoshi Suehiro , Kouichi Iwaisako , Hideo Akiyama
发明人： Kouji Kawakita , Seiichi Nakatani , Tatsuo Ogawa , Masatoshi Suehiro , Kouichi Iwaisako , Hideo Akiyama
IPC分类号： H01B1/22 , H05K1/09 , H05K3/40 , H05K3/46 , H05K1/11 , C08K3/08
CPC分类号： H05K1/095 , H01B1/22 , H05K3/4069 , H01L2224/2929 , H01L2224/29311 , H01L2224/29316 , H01L2224/29339 , H01L2224/29344 , H01L2224/29347 , H01L2224/29355 , H01L2224/29364 , H01L2224/29399 , H01L2924/01079 , H05K2201/0355 , H05K2201/10378 , H05K2203/1461 , H05K3/4614 , H05K3/462 , H05K3/4623 , H05K3/4652 , Y10S428/901 , Y10T428/24917 , Y10T428/25
摘要： A conductive paste compound for via hole filling includes a conductive filler at 80 to 92 weight percent with an average particle size of from 0.5 to 20 .mu.m and specific surface of from 0.1 to 1.5 m.sup.2 /g, a liquid epoxy resin at 4.5 to 20 weight percent containing 2 or more epoxy groups with room temperature viscosity of 15 Pa.sec or less, and a hardener at 0.5 to 5 weight percent, wherein the viscosity is 2,000 Pa.sec or less and the volatile amount is 2.0 weight percent or less. A filling paste and a printed circuit board with use thereof are provided which can conduct an inner-via-hole connection between electrode layers without using a through-hole plating technique.The conductive paste comprises a metallic particle such as copper, an epoxy resin, a hardener, and if necessary, a dispersant. The paste having low viscosity and low volatility under high shear is used to fill holes disposed in a laminated substrate. Then, this substrate is heated and pressurized together with copper foil on both sides to attain a printed circuit board where both sides are electrically inner-via-hole connected.
摘要翻译：用于通孔填充的导电糊剂化合物包括平均粒度为0.5至20μm，比表面积为0.1至1.5m 2 / g的80至92重量％的导电填料，4.5至20的液体环氧树脂含有2个以上环氧树脂的室温粘度为15Pa·sec以下的固化剂和0.5〜5重量％的固化剂，其中粘度为2,000Pa·s以下，挥发量为2.0重量％以下。提供了一种填充膏和使用它们的印刷电路板，其可以在不使用通孔电镀技术的情况下进行电极层之间的内部通孔连接。导电糊料包括金属颗粒如铜，环氧树脂，硬化剂，如果需要，可以使用分散剂。使用在高剪切下具有低粘度和低挥发性的糊料来填充设置在层压基板中的孔。然后，将该基板与铜箔一起加热和加压两侧，以获得印刷电路板，其中两侧电连通内部通孔。

4. 发明授权

US5914358A Conductive paste compound for via hole filling, printed circuit board which uses the conductive paste, and method of manufacturing the same 失效
标题翻译：用于通孔填充的导电浆料化合物，使用导电浆料的印刷电路板及其制造方法
公开(公告)号：US5914358A
公开(公告)日：1999-06-22
申请号：US649189
申请日：1996-05-17
申请人： Kouji Kawakita , Seiichi Nakatani , Tatsuo Ogawa , Masatoshi Suehiro , Kouichi Iwaisako , Hideo Akiyama
发明人： Kouji Kawakita , Seiichi Nakatani , Tatsuo Ogawa , Masatoshi Suehiro , Kouichi Iwaisako , Hideo Akiyama
IPC分类号： H01B1/22 , H05K1/09 , H05K3/40 , H05K3/46 , C08K3/08 , C08L63/00
CPC分类号： H05K1/095 , H01B1/22 , H05K3/4069 , H01L2224/2929 , H01L2224/29311 , H01L2224/29316 , H01L2224/29339 , H01L2224/29344 , H01L2224/29347 , H01L2224/29355 , H01L2224/29364 , H01L2224/29399 , H01L2924/01079 , H05K2201/0355 , H05K2201/10378 , H05K2203/1461 , H05K3/4614 , H05K3/462 , H05K3/4623 , H05K3/4652 , Y10S428/901 , Y10T428/24917 , Y10T428/25
摘要： A conductive paste compound for via hole filling includes a conductive filler at 80 to 92 weight percent with an average particle size of from 0.5 to 20 .mu.m and specific surface of from 0.1 to 1.5 m.sup.2 /g, a liquid epoxy resin at 4.5 to 20 weight percent containing 2 or more epoxy groups with room temperature viscosity of 15 Pa.multidot.sec or less, and a hardener at 0.5 to 5 weight percent, wherein the viscosity is 2,000 Pa.multidot.sec or less and the volatile amount is 2.0 weight percent or less. A filling paste and a printed circuit board with use thereof are provided which can conduct an inner-via-hole connection between electrode layers without using a through-hole plating technique.The conductive paste comprises a metallic particle such as copper, an epoxy resin, a hardener, and if necessary, a dispersant. The paste having low viscosity and low volatility under high shear is used to fill holes disposed in a laminated substrate. Then, this substrate is heated and pressurized together with copper foil on both sides to attain a printed circuit board where both sides are electrically inner-via-hole connected.
摘要翻译：用于通孔填充的导电糊剂化合物包括平均粒度为0.5至20μm，比表面积为0.1至1.5m 2 / g的80至92重量％的导电填料，4.5至20的液体环氧树脂含有2个以上环氧树脂的室温粘度为15Pa·s以下的固化剂和0.5〜5重量％的固化剂，其中粘度为2,000帕秒以下，挥发量为2.0重量％以下。提供了一种填充膏和使用它们的印刷电路板，其可以在不使用通孔电镀技术的情况下进行电极层之间的内部通孔连接。导电糊料包括金属颗粒如铜，环氧树脂，硬化剂，如果需要，可以使用分散剂。使用在高剪切下具有低粘度和低挥发性的糊料来填充设置在层压基板中的孔。然后，将该基板与铜箔一起加热和加压两侧，以获得印刷电路板，其中两侧电连通内部通孔。

5. 发明授权

US5652042A Conductive paste compound for via hole filling, printed circuit board which uses the conductive paste 失效
标题翻译：用于通孔填充的导电浆料化合物，使用导电浆料的印刷电路板
公开(公告)号：US5652042A
公开(公告)日：1997-07-29
申请号：US330733
申请日：1994-10-28
申请人： Kouji Kawakita , Seiichi Nakatani , Tatsuo Ogawa , Masatoshi Suehiro , Kouichi Iwaisako , Hideo Akiyama
发明人： Kouji Kawakita , Seiichi Nakatani , Tatsuo Ogawa , Masatoshi Suehiro , Kouichi Iwaisako , Hideo Akiyama
IPC分类号： H01B1/22 , H05K1/09 , H05K3/40 , H05K3/46 , B32B9/00
CPC分类号： H05K1/095 , H01B1/22 , H05K3/4069 , H01L2224/2929 , H01L2224/29311 , H01L2224/29316 , H01L2224/29339 , H01L2224/29344 , H01L2224/29347 , H01L2224/29355 , H01L2224/29364 , H01L2224/29399 , H01L2924/01079 , H05K2201/0355 , H05K2201/10378 , H05K2203/1461 , H05K3/4614 , H05K3/462 , H05K3/4623 , H05K3/4652 , Y10S428/901 , Y10T428/24917 , Y10T428/25
摘要： A conductive paste compound for via hole filling includes a conductive filler at 80 to 92 weight percent with an average particle size of from 0.5 to 20 .mu.m and specific surface of from 0.1 to 1.5 m.sup.2 /g, a liquid epoxy resin at 4.5 to 20 weight percent containing 2 or more epoxy groups with room temperature viscosity of 15 Pa.multidot.sec or less, and a hardener at 0.5 to 5 weight percent, wherein the viscosity is 2,000 Pa.multidot.sec or less and the volatile amount is 2.0 weight percent or less. A filling paste and a printed circuit board with use thereof are provided which can conduct an inner-via-hole connection between electrode layers without using a through-hole plating technique.The conductive paste comprises a metallic particle such as copper, an epoxy resin, a hardener, and if necessary, a dispersant. The paste having low viscosity and low volatility under high shear is used to fill holes disposed in a laminated substrate. Then, this substrate is heated and pressurized together with copper foil on both sides to attain a printed circuit board where both sides are electrically inner-via-hole connected.
摘要翻译：用于通孔填充的导电糊剂化合物包括平均粒度为0.5至20μm，比表面积为0.1至1.5m 2 / g的80至92重量％的导电填料，4.5至20的液体环氧树脂含有2个以上环氧树脂的室温粘度为15Pa·s以下的固化剂和0.5〜5重量％的固化剂，其中粘度为2,000帕秒以下，挥发量为2.0重量％以下。提供了一种填充膏和使用它们的印刷电路板，其可以在不使用通孔电镀技术的情况下进行电极层之间的内部通孔连接。导电糊料包括金属颗粒如铜，环氧树脂，硬化剂，如果需要，可以使用分散剂。使用在高剪切下具有低粘度和低挥发性的糊料来填充设置在层压基板中的孔。然后，将该基板与铜箔一起加热和加压两侧，以获得印刷电路板，其中两侧电连通内部通孔。

6. 发明授权

US5733467A Conductive paste compound for via hole filling, printed circuit board which uses the conductive paste, and method of manufacturing the same 失效
标题翻译：用于通孔填充的导电浆料化合物，使用导电浆料的印刷电路板及其制造方法
公开(公告)号：US5733467A
公开(公告)日：1998-03-31
申请号：US814026
申请日：1997-03-10
申请人： Kouji Kawakita , Seiichi Nakatani , Tatsuo Ogawa , Masatoshi Suehiro , Kouichi Iwaisako , Hideo Akiyama
发明人： Kouji Kawakita , Seiichi Nakatani , Tatsuo Ogawa , Masatoshi Suehiro , Kouichi Iwaisako , Hideo Akiyama
IPC分类号： H01B1/22 , H05K1/09 , H05K3/40 , H05K3/46 , B44C1/22 , C23F1/00
CPC分类号： H05K1/095 , H01B1/22 , H05K3/4069 , H01L2224/2929 , H01L2224/29311 , H01L2224/29316 , H01L2224/29339 , H01L2224/29344 , H01L2224/29347 , H01L2224/29355 , H01L2224/29364 , H01L2224/29399 , H01L2924/01079 , H05K2201/0355 , H05K2201/10378 , H05K2203/1461 , H05K3/4614 , H05K3/462 , H05K3/4623 , H05K3/4652 , Y10S428/901 , Y10T428/24917 , Y10T428/25
摘要： A conductive paste compound for via hole filling includes a conductive filler at 80 to 92 weight percent with an average particle size of from 0.5 to 20 .mu.m and specific surface of from 0.1 to 1.5 m.sup.2 / g, a liquid epoxy resin at 4.5 to 20 weight percent containing 2 or more epoxy groups with room temperature viscosity of 15 Pa.sec or less, and a hardener at 0.5 to 5 weight percent, wherein the viscosity is 2,000 Pa.sec or less and the volatile amount is 2.0 weight percent or less. A filling paste and a printed circuit board with use thereof are provided which can conduct an inner-via-hole connection between electrode layers without using a through-hole plating technique. The conductive paste comprises a metallic particle such as copper, an epoxy resin, a hardener, and if necessary, a dispersant. The paste having low viscosity and low volatility under high shear is used to fill holes disposed in a laminated substrate. Then, this substrate is heated and pressurized together with copper foil on both sides to attain a printed circuit board where both sides are electrically inner-via-hole connected.
摘要翻译：用于通孔填充的导电糊剂化合物包括平均粒度为0.5至20μm，比表面积为0.1至1.5m 2 / g的80至92重量％的导电填料，4.5至20的液体环氧树脂含有2个以上环氧树脂的室温粘度为15Pa·sec以下的固化剂和0.5〜5重量％的固化剂，其中粘度为2,000Pa·s以下，挥发量为2.0重量％以下。提供了一种填充膏和使用它们的印刷电路板，其可以在不使用通孔电镀技术的情况下进行电极层之间的内部通孔连接。导电糊料包括金属颗粒如铜，环氧树脂，硬化剂，如果需要，可以使用分散剂。使用在高剪切下具有低粘度和低挥发性的糊料来填充设置在层压基板中的孔。然后，将该基板与铜箔一起加热和加压两侧，以获得印刷电路板，其中两侧电连通内部通孔。

7. 发明授权

US4906405A Conductor composition and method of manufacturing a multilayered ceramic body using the composition 失效
标题翻译：导体组合物和使用该组合物制造多层陶瓷体的方法
公开(公告)号：US4906405A
公开(公告)日：1990-03-06
申请号：US194967
申请日：1988-05-17
申请人： Seiichi Nakatani , Tsutomu Nishimura , Satoru Yuhaku , Minehiro Itagaki
发明人： Seiichi Nakatani , Tsutomu Nishimura , Satoru Yuhaku , Minehiro Itagaki
IPC分类号： H01B1/08 , H05K1/03 , H05K1/09 , H05K3/46
CPC分类号： H05K3/4611 , C03C3/072 , C03C8/14 , H01B1/08 , H05K1/092 , H05K3/4629 , H05K1/0306
摘要： Disclosed are a CuO conductor paste which is effective for making a multilayered ceramic body, the conductor material of which is made of copper, and a method of manufacturing a multilayered ceramic body using the conductor paste. The conductor paste is made of CuO as the main component with an addition of at least one of PbO-based glass, or any of Bi.sub.2 O.sub.3 -based glass, CuO-based glass and CuAl.sub.2 O.sub.4 as the additive. The multilayered ceramic body is manufactured by a method comprising a forming process for making a multilayered body from the conductor paste and dielectric material, a binder removing process by heat treating the multilayered body, thus obtained, in air, a reduction process for reducing CuO to copper in a mixed gas atmosphere of hydrogen and nitrogen, and a sintering process for sintering the multilayered body thus reduced in a nitrogen gas atmosphere.
摘要翻译：公开了一种CuO导体糊，其制造多层陶瓷体，其导体材料由铜制成，以及使用该导体膏制造多层陶瓷体的方法。导体糊以CuO为主要成分，添加PbO系玻璃，Bi2O3系玻璃，CuO系玻璃，CuAl 2 O 4等中的至少一种作为添加剂。多层陶瓷体通过包括从导体糊和电介质材料制造多层体的成形方法的方法制造，通过在空气中热处理由此获得的多层体的粘合剂去除工艺，将CuO还原为在氢气和氮气的混合气体气氛中的铜，以及在氮气气氛中烧结多层体的烧结方法。

8. 发明授权

US4695403A Thick film conductor composition 失效
标题翻译：厚膜导体组成
公开(公告)号：US4695403A
公开(公告)日：1987-09-22
申请号：US875083
申请日：1986-06-17
申请人： Tsutomu Nishimura , Seiichi Nakatani , Satoru Yuhaku , Toru Ishida
发明人： Tsutomu Nishimura , Seiichi Nakatani , Satoru Yuhaku , Toru Ishida
IPC分类号： C04B41/51 , C04B41/88 , H01B1/16 , H01L23/498 , H05K1/09 , H01B1/00
CPC分类号： C04B41/88 , C04B41/5127 , H01B1/16 , H01L23/49883 , H01L2924/0002 , H01L2924/09701 , H05K1/092
摘要： A thick film conductor composition for a ceramic wiring substrate comprises an inorganic ingredient mainly composed of a copper oxide powder added with a metal capable of forming a homogeneous solid solution with copper, and an organic vehicle. The inorganic ingredient may be further added with a manganese oxide or a heat resistant insulating material such as ceramics and/or glass.
摘要翻译：用于陶瓷布线基板的厚膜导体组合物包括主要由添加有能够形成具有铜的均匀固溶体的金属的氧化铜粉末和有机载体的无机成分。无机成分还可以添加氧化锰或耐热绝缘材料如陶瓷和/或玻璃。

9. 发明授权

US5014158A Laminated ceramic capacitor 失效
标题翻译：层压陶瓷电容器
公开(公告)号：US5014158A
公开(公告)日：1991-05-07
申请号：US507568
申请日：1990-04-11
申请人： Tsutomu Nishimura , Seiichi Nakatani , Satoru Yuhaku , Yasuhiko Hakotani , Tatsuro Kikuchi
发明人： Tsutomu Nishimura , Seiichi Nakatani , Satoru Yuhaku , Yasuhiko Hakotani , Tatsuro Kikuchi
IPC分类号： C04B35/49 , H01G4/12
CPC分类号： C04B35/49 , H01G4/1245 , Y10T29/435
摘要： A laminated ceramic capacitor comprises a plurality of inner electrode layers for developing a capacitance, dielectric layers sandwiched with the inner electrode layers, and a pair of outer electrodes coupled to their associated inner electrode layers for output of the capacitance. The inner electrode layers are made of Ni. The dielectric layers are made of a dielectric ceramic composition having a structural formula of:{Bam(Til-xZrx)O2+m}1-.alpha.-.beta.-{MnO2}.alpha.-{X}.beta.where X is at least one of Yb2O3, Dy2O3, and ThO2 and m, x, .alpha., and .beta. are expressed as:0.98.ltoreq.m.ltoreq.1.020.ltoreq.x.ltoreq.0.20.005.ltoreq..alpha..ltoreq.0.050.001.ltoreq..beta..ltoreq.0.02so that the laminated ceramic capacitor can be minimized in the size, increased in the capacitance, and reduced in the cost of production.
摘要翻译：层叠陶瓷电容器包括用于显影电容的多个内部电极层，夹在内部电极层的电介质层和耦合到其相关联的内部电极层的一对外部电极，用于输出电容。内部电极层由Ni制成。电介质层由结构式为：{Bam（Til-xZrx）O 2 + m} 1-α-β - {MnO 2}α - {X}β的电介质陶瓷组合物制成，其中X是Yb 2 O 3中的至少一种，Dy 2 O 3和ThO 2，m，x，α和β表示为：0.98

10. 发明授权

US4795512A Method of manufacturing a multilayer ceramic body 失效
标题翻译：制造多层陶瓷体的方法
公开(公告)号：US4795512A
公开(公告)日：1989-01-03
申请号：US18579
申请日：1987-02-25
申请人： Seiichi Nakatani , Tsutomu Nishimura , Satoru Yuhaku , Toru Ishida
发明人： Seiichi Nakatani , Tsutomu Nishimura , Satoru Yuhaku , Toru Ishida
IPC分类号： B32B18/00 , C04B35/622 , C04B35/64 , H05K1/03 , H05K1/09 , H05K3/46 , H01B1/06
CPC分类号： H05K3/4629 , B32B18/00 , C04B35/622 , C04B35/64 , H05K3/4611 , C04B2235/6567 , C04B2235/658 , C04B2237/343 , C04B2237/525 , C04B2237/62 , C04B2237/68 , C04B2237/704 , C04B2237/76 , H05K1/0306 , H05K1/092
摘要： A method of manufacturing a multilayer ceramic using Cu as the conductor material is disclosed. This method comprises a step of forming a multilayer laminate by the green tape multilayer laminating method or by the thick film printing method on ceramic substrate with an insulating material with a mixture of ceramic and glass containing lead oxide as its main component and a conductor paste with CuO as its main component; a step of heat-treatment for decomposing and removing organic binder in air (binder removing process); a step of causing reduction at temperatures where copper oxide is reduced, but lead oxide is not, in a mixed gas atmosphere of nitrogen and hydrogen (reduction process); and a step of firing in a nitrogen atmosphere, thereby effecting sintering of the insulating material composed of ceramic and glass containing lead oxide and metallization of copper electrodes (firing process). For the uppermost layer electrodes, metal copper paste is employed, and a pattern printing process is conducted subsequent to the aforementioned reduction process, so that the sintering of the insulating material and the metallization of the uppermost layer are simultaneously performed; in this way, highly reliable uppermost layer Cu electrodes are obtainable.
摘要翻译：公开了使用Cu作为导体材料的多层陶瓷的制造方法。该方法包括通过生胶带多层层压法或通过厚膜印刷方法在陶瓷基板上形成多层层压体的步骤，其中绝缘材料与陶瓷和玻璃的混合物以含氧化铅为主要成分的混合物和具有 CuO为主要成分; 在空气中分解除去有机粘合剂的热处理步骤（粘合剂除去工艺）; 在氮和氢的混合气体气氛中还原氧化铜还原的氧化还原反应的步骤（还原过程）; 以及在氮气气氛中烧成的步骤，从而实现由含有氧化铅的陶瓷和玻璃构成的绝缘材料和铜电极的金属化（烧成工序）的烧结。对于最上层电极，使用金属铜膏，并且在上述还原处理之后进行图案印刷工艺，使得绝缘材料的烧结和最上层的金属化同时进行; 以这种方式，可以获得高可靠性的最上层Cu电极。

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