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    • 3. 发明授权
    • Level-shifter circuit for integrated circuits
    • 用于集成电路的电平移位电路
    • US5157281A
    • 1992-10-20
    • US728928
    • 1991-07-12
    • Giovanni SantinSebastiano D'ArrigoMichael C. Smayling
    • Giovanni SantinSebastiano D'ArrigoMichael C. Smayling
    • G11C17/00G11C16/06H01L27/092H01L27/10H01L27/105
    • H01L27/0928H01L27/105
    • A level-shifter circuit includes a deep N-tank to insulate the N-channel portions of transistors from the substrate. The circuit is formed on a P-type substrate coupled to reference voltage Vss. A first field-effect transistor has first and second N+ doped regions formed in a third isolating P- doped region. The third doped region is formed in a fourth isolating N- doped region, which is formed in the substrate. A second transistor has first and second N+ doped regions formed in the same isolation regions as those of the first transistor. A third field-effect transistor has first and second P+ doped regions formed in an isolating N- region that is formed in the substrate. A fourth field-effect transistor has first and second N+ doped regions formed in the same isolation N- region as that of the third transistor. The gate of the first transistor is coupled to a first input. The first doped region of the first transistor is coupled to the output and the second doped region of the first transistor is coupled to the negative voltage Vn. The third doped region is coupled to the negative voltage Vn and the fourth doped region is coupled to the supply voltage Vdd. The second transistor is connected in feedback configuration to the first transistor. The gate of the third transistor is coupled to the second input. The first doped region of the third transistor is coupled to the output and the second doped region of the third transistor is coupled to the voltage Vp, which is more positive than the supply voltage Vdd. The fifth doped region of the third transistor is also coupled to the voltage Vp. The fourth transistor is connected in feedback configuration to the third transistor.
    • 5. 发明授权
    • Process for making a lateral bipolar transistor in a standard CSAG
process
    • 在标准CSAG工艺中制造横向双极晶体管的工艺
    • US4669177A
    • 1987-06-02
    • US791968
    • 1985-10-28
    • Sebastiano D'ArrigoMichael C. Smayling
    • Sebastiano D'ArrigoMichael C. Smayling
    • H01L29/73H01L21/033H01L21/331H01L21/8249H01L23/532H01L27/06H01L29/735H01L21/20
    • H01L21/033H01L21/8249H01L23/53271H01L29/735H01L2924/0002Y10S148/096
    • A method of forming a lateral bipolar transistor in a semiconductor substrate of a second conductivity type by an MOS or CMOS process which includes growing a thin insulating layer over the substrate and diffusing a tank region of a first type of conductivity into the semiconductor substrate of a polarity opposite to that of the second conductivity type. A strip of polysilicon is deposited around a region between the emitter area and collector area on a face of the substrate over said oxide. Next an emitter region having the form of a band enclosing an undiffused central region within the polysilicon strip and a collector region located outside of the strip are diffused into the tank. The polysilicon prevents diffusion of implanted impurity into the tank region over which is superimposed the polysilicon. An electrically conducting layer is formed over the emitter and a portion of the polysilicon.By using a strip of polysilicon to limit diffusion of the emitter and collector regions and by forming the emitter contact over both the emitter and polysilicon it is possible to achieve a smaller emitter geometry than is otherwise possible.
    • 一种通过MOS或CMOS工艺在第二导电类型的半导体衬底中形成横向双极晶体管的方法,其包括在衬底上生长薄绝缘层并将第一类导电性的区域扩散到半导体衬底中 极性与第二导电类型的极性相反。 围绕在所述氧化物上的衬底的表面上的发射极区域和集电极区域之间的区域周围沉积多晶硅条。 接下来,具有包围多晶硅条带内的未扩散中心区域的带的形式的发射极区域和位于条带外部的收集器区域扩散到槽中。 多晶硅防止注入的杂质扩散到叠加多晶硅的槽区中。 在发射极和多晶硅的一部分上形成导电层。 通过使用多晶硅条来限制发射极和集电极区域的扩散,并且通过在发射极和多晶硅两者上形成发射极接触,可以实现比其它可能的更小的发射极几何形状。
    • 10. 发明授权
    • Methods for controlling microloading variation in semiconductor wafer layout and fabrication
    • 用于控制半导体晶片布局和制造中的微加载变化的方法
    • US09122832B2
    • 2015-09-01
    • US12512932
    • 2009-07-30
    • Brian ReedMichael C. SmaylingScott T. Becker
    • Brian ReedMichael C. SmaylingScott T. Becker
    • G06F17/50
    • G06F17/5081G06F2217/12Y02P90/265
    • Problematic open areas are identified in a semiconductor wafer layout. The problematic open areas have a size variation relative to one or more neighboring open areas of the layout sufficient to cause adverse microloading variation. In one embodiment, the adverse microloading variation is controlled by shifting a number of layout features to interdict the problematic open areas. In another embodiment, the adverse microloading variation is controlled by defining and placing a number of dummy layout features to shield actual layout features that neighbor the problematic open areas. In another embodiment, the adverse microloading variation is controlled by utilizing sacrificial layout features which are actually fabricated on the wafer temporarily to eliminate microloading variation, and which are subsequently removed from the wafer to leave behind the desired permanent structures.
    • 在半导体晶片布局中识别有问题的开放区域。 有问题的开放区域相对于布局的一个或多个相邻开放区域具有尺寸变化,足以导致不利的微加载变化。 在一个实施例中,通过移动多个布局特征来阻止有问题的开放区域来控制不利的微加载变化。 在另一个实施例中,通过限定和放置多个虚拟布局特征来屏蔽相邻有问题的开放区域的实际布局特征来控制不利的微加载变化。 在另一个实施例中,通过利用实际上在晶片上制造的牺牲布局特征来暂时控制不利的微加载变化,以消除微载荷变化,并且随后从晶片中移除留下期望的永久结构。