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1. 发明授权

US08319254B2 Micro-electromechanical system devices 有权
标题翻译：微机电系统设备
公开(公告)号：US08319254B2
公开(公告)日：2012-11-27
申请号：US13027209
申请日：2011-02-14
申请人： Scott G. Adams , Andrew J. Minnick , Charles W. Blackmer , Mollie K. Devoe
发明人： Scott G. Adams , Andrew J. Minnick , Charles W. Blackmer , Mollie K. Devoe
IPC分类号： H01L29/74
CPC分类号： B81B3/0008 , B81B2201/0235 , B81B2207/07 , G01P15/0802 , H01H59/0009 , H01L29/747 , H01L29/87
摘要： A micro-electromechanical system (MEMS) device includes a substrate, a first beam, a second beam, and a third beam. The first beam includes first and second portions separated by an isolation joint. The first and second portions each comprise a semiconductor and a first dielectric layer. An electrically conductive trace is mechanically coupled to the first beam and electrically coupled to the second portion's semiconductor but not the first portion's semiconductor. The second beam includes a second dielectric layer. The profile of each of the first second, and third beams has been formed by a dry etch. A cavity separates a surface of the substrate from the first, second, and third beams. The cavity has been formed by a dry etch. A side wall of each of the first, second, and third beams has substantially no dielectric layer disposed thereon, and the dielectric layer has been removed by a vapor-phase etch.
摘要翻译：微机电系统（MEMS）装置包括基板，第一光束，第二光束和第三光束。第一梁包括由隔离接头隔开的第一和第二部分。第一和第二部分各自包括半导体和第一介电层。导电迹线机械耦合到第一光束并且电耦合到第二部分的半导体，但不耦合到第一部分的半导体。第二光束包括第二电介质层。通过干蚀刻形成第一和第三光束中的每一个的轮廓。空腔将基板的表面与第一，第二和第三梁分离。通过干蚀刻形成空腔。第一，第二和第三光束中的每一个的侧壁基本上没有设置在其上的电介质层，并且通过气相蚀刻去除介电层。

2. 发明授权

US08853803B2 Micro-electromechanical system devices 有权
标题翻译：微机电系统设备
公开(公告)号：US08853803B2
公开(公告)日：2014-10-07
申请号：US13571844
申请日：2012-08-10
申请人： Scott G. Adams , Andrew J. Minnick , Charles W. Blackmer , Mollie K. Devoe
发明人： Scott G. Adams , Andrew J. Minnick , Charles W. Blackmer , Mollie K. Devoe
IPC分类号： H01L29/84 , B81B3/00 , G01P15/08 , H01L29/87 , H01H59/00 , H01L29/747
CPC分类号： B81B3/0008 , B81B2201/0235 , B81B2207/07 , G01P15/0802 , H01H59/0009 , H01L29/747 , H01L29/87
摘要： A micro-electromechanical system (MEMS) device can include a substrate and a first beam suspended relative to a substrate surface. The first beam can include a first portion and a second portion that are separated by an isolation joint made of an insulative material. The first and second portions can each include a first semiconductor and a first dielectric layer. The MEMS device can also include a second beam suspended relative to the substrate surface. The second beam can include a second semiconductor and a second dielectric layer to promote curvature of the second beam. The MEMS device can also include a third beam suspended relative to the substrate surface. The third beam consists essentially of a first material. The second beam is configured to move relative to the third beam in response to an acceleration along an axis perpendicular to the surface of the substrate.
摘要翻译：微机电系统（MEMS）装置可以包括衬底和相对于衬底表面悬挂的第一光束。第一梁可以包括由绝缘材料制成的隔离接头分开的第一部分和第二部分。第一和第二部分可以各自包括第一半导体和第一介电层。 MEMS器件还可以包括相对于衬底表面悬挂的第二光束。第二光束可以包括第二半导体和第二电介质层，以促进第二光束的曲率。 MEMS器件还可以包括相对于衬底表面悬挂的第三光束。第三根梁主要由第一种材料构成。响应于垂直于衬底表面的轴的加速度，第二光束被配置为相对于第三光束移动。

3. 发明申请

US20120205753A1 MICRO-ELECTROMECHANICAL SYSTEM DEVICES AND METHODS OF MAKING MICRO-ELECTROMECHANICAL SYSTEM DEVICES 有权
标题翻译：微机电系统装置及微电子系统装置的制作方法
公开(公告)号：US20120205753A1
公开(公告)日：2012-08-16
申请号：US13027209
申请日：2011-02-14
申请人： Scott G. ADAMS , Andrew J. Minnick , Charles W. Blackmer , Kenneth D. Brennan , Mollie K. Devoe
发明人： Scott G. ADAMS , Andrew J. Minnick , Charles W. Blackmer , Kenneth D. Brennan , Mollie K. Devoe
IPC分类号： H01L29/84 , H01L21/306
CPC分类号： B81B3/0008 , B81B2201/0235 , B81B2207/07 , G01P15/0802 , H01H59/0009 , H01L29/747 , H01L29/87
摘要： A micro-electromechanical system (MEMS) device includes a substrate, a first beam, a second beam, and a third beam. The first beam includes first and second portions separated by an isolation joint. The first and second portions each comprise a semiconductor and a first dielectric layer. An electrically conductive trace is mechanically coupled to the first beam and electrically coupled to the second portion's semiconductor but not the first portion's semiconductor. The second beam includes a second dielectric layer. The profile of each of the first, second, and third beams has been formed by a dry etch. A cavity separates a surface of the substrate from the first, second, and third beams. The cavity has been formed by a dry etch. A side wall of each of the first, second, and third beams has substantially no dielectric layer disposed thereon, and the dielectric layer has been removed by a vapor-phase etch.
摘要翻译：微机电系统（MEMS）装置包括基板，第一光束，第二光束和第三光束。第一梁包括由隔离接头隔开的第一和第二部分。第一和第二部分各自包括半导体和第一介电层。导电迹线机械耦合到第一光束并且电耦合到第二部分的半导体，但不耦合到第一部分的半导体。第二光束包括第二电介质层。通过干式蚀刻形成第一，第二和第三光束中的每一个的轮廓。空腔将基板的表面与第一，第二和第三梁分离。通过干蚀刻形成空腔。第一，第二和第三光束中的每一个的侧壁基本上没有设置在其上的电介质层，并且通过气相蚀刻去除介电层。

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