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    • 7. 发明申请
    • METHOD FOR MANUFACTURING SOI SUBSTRATE
    • 制造SOI衬底的方法
    • US20090098739A1
    • 2009-04-16
    • US12244414
    • 2008-10-02
    • Hideto OHNUMATakashi SHINGUTetsuya KAKEHATAKazutaka KURIKIShunpei YAMAZAKI
    • Hideto OHNUMATakashi SHINGUTetsuya KAKEHATAKazutaka KURIKIShunpei YAMAZAKI
    • H01L21/31
    • H01L27/1266H01L21/2007H01L21/76254H01L27/1214H01L29/66772
    • An object of the present invention is to provide a method for manufacturing an SOI substrate provided with a semiconductor layer which can be used practically even where a substrate having a low upper temperature limit such as a glass substrate is used. The manufacturing method compromises the steps of preparing a semiconductor substrate provided with a bonding layer formed on a surface thereof and a separation layer formed at a predetermined depth from the surface thereof, bonding the bonding layer to the base substrate having a distortion point of 700° C. or lower so that the semiconductor substrate and the base substrate face each other, and separating a part of the semiconductor substrate at the separation layer by heat treatment in order to form a single-crystal semiconductor layer over the base substrate. In the manufacturing method, a substrate which shrinks isotropically at least by the heat treatment is used as the base substrate.
    • 本发明的目的是提供一种制造具有半导体层的SOI衬底的方法,即使在使用诸如玻璃衬底的上限温度低的衬底的情况下也可以使用。 制造方法损害了制备其表面上形成有接合层的半导体衬底和从其表面形成在预定深度的分离层的步骤,将接合层粘合到具有700°的变形点的基底 C.或更低,使得半导体衬底和基底基板彼此面对,并且通过热处理在分离层处分离半导体衬底的一部分,以在基底衬底上形成单晶半导体层。 在制造方法中,使用至少通过热处理各向同性收缩的基板作为基底。
    • 10. 发明申请
    • MANUFACTURING METHOD OF SINGLE CRYSTAL SEMICONDUCTOR FILM AND MANUFACTURING METHOD OF ELECTRODE
    • 单晶半导体膜的制造方法及电极的制造方法
    • US20110269301A1
    • 2011-11-03
    • US13092249
    • 2011-04-22
    • Sho KATOKazutaka KURIKI
    • Sho KATOKazutaka KURIKI
    • H01L21/20
    • H01L21/76251
    • To provide a method of obtaining a single crystal semiconductor film by a method that is simple and low-cost. A single crystal semiconductor film 11 having compression stress is formed over a surface of a single crystal semiconductor substrate 10 by a vapor phase epitaxial growth method, a film having tensile stress (for example, a thermo-setting resin film 12) is formed over a surface of the single crystal semiconductor film 11, and the single crystal semiconductor substrate 10 and the single crystal semiconductor film 11 are separated from each other by a separation step in which force is applied to the single crystal semiconductor film 11, thereby obtaining a single crystal semiconductor film. Note that as the thermo-setting resin film 12, an epoxy resin film can be used, for example.
    • 提供通过简单且低成本的方法获得单晶半导体膜的方法。 通过气相外延生长法在单晶半导体衬底10的表面上形成具有压应力的单晶半导体膜11,在其上形成具有拉伸应力的膜(例如,热固性树脂膜12) 通过对单晶半导体膜11施加力的分离工序将单晶半导体膜11的表面,单晶半导体基板10和单晶半导体膜11分离,得到单晶 半导体膜。 另外,作为热固性树脂膜12,例如可以使用环氧树脂膜。