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    • 7. 发明申请
    • PHOTOELECTRIC CONVERSION DEVICE
    • 光电转换器件
    • US20120319157A1
    • 2012-12-20
    • US13488480
    • 2012-06-05
    • Mitsuhiro IchuoToshiya EndoSho Kato
    • Mitsuhiro IchuoToshiya EndoSho Kato
    • H01L33/36H01L31/0224
    • H01L31/022425H01L31/02363H01L31/0288Y02E10/547
    • To provide a heterojunction photoelectric conversion device including passivation layers for reducing surface defects of a silicon substrate. The photoelectric conversion device includes a first silicon semiconductor layer which is in contact with one surface of a single crystal silicon substrate; a second silicon semiconductor layer which is in contact with the first silicon semiconductor layer; a third silicon semiconductor layer which is in contact with the other surface of the single crystal silicon substrate; and a fourth silicon semiconductor layer which is in contact with the third silicon semiconductor layer. Further, the fluorine concentration in the first silicon semiconductor layer and the third silicon semiconductor layer is lower than or equal to 1×1017 atoms/cm3.
    • 提供一种异质结光电转换装置,其包括用于减少硅衬底的表面缺陷的钝化层。 光电转换装置包括与单晶硅衬底的一个表面接触的第一硅半导体层; 与第一硅半导体层接触的第二硅半导体层; 与所述单晶硅衬底的另一表面接触的第三硅半导体层; 以及与第三硅半导体层接触的第四硅半导体层。 此外,第一硅半导体层和第三硅半导体层中的氟浓度低于或等于1×10 17原子/ cm 3。
    • 9. 发明申请
    • SEMICONDUCTOR DEVICE
    • 半导体器件
    • US20120001168A1
    • 2012-01-05
    • US13164806
    • 2011-06-21
    • Mitsuhiro ICHIJOToshiya ENDOKunihiko SUZUKIYasuhiko TAKEMURA
    • Mitsuhiro ICHIJOToshiya ENDOKunihiko SUZUKIYasuhiko TAKEMURA
    • H01L29/786
    • H01L29/7869
    • In a transistor including an oxide semiconductor, hydrogen in the oxide semiconductor leads to degradation of electric characteristics of the transistor. Thus, an object is to provide a semiconductor device having good electrical characteristics. An insulating layer in contact with an oxide semiconductor layer where a channel region is formed is formed by a plasma CVD method using a silicon halide. The insulating layer thus formed has a hydrogen concentration less than 6×1020 atoms/cm3 and a halogen concentration greater than or equal to 1×1020 atoms/cm3; accordingly, hydrogen diffusion into the oxide semiconductor layer can be prevented and hydrogen in the oxide semiconductor layer is inactivated or released from the oxide semiconductor layer by the halogen, whereby a semiconductor device having good electrical characteristics can be provided.
    • 在包括氧化物半导体的晶体管中,氧化物半导体中的氢导致晶体管的电特性的劣化。 因此,目的在于提供具有良好的电气特性的半导体器件。 通过使用卤化硅的等离子体CVD法形成与形成沟道区的氧化物半导体层接触的绝缘层。 如此形成的绝缘层的氢浓度小于6×1020原子/ cm3,卤素浓度大于或等于1×1020原子/ cm3; 因此,可以防止氢扩散到氧化物半导体层中,并且氧化物半导体层中的氢被卤素氧化半导体层失活或释放,从而可以提供具有良好电特性的半导体器件。