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1. 发明授权

US5525890A Battery unit and battery energy billing method 失效
标题翻译：电池单元和电池能量计费方式
公开(公告)号：US5525890A
公开(公告)日：1996-06-11
申请号：US101768
申请日：1993-08-04
申请人： Satoshi Iwatsu , Kazunori Ozawa , Masana Ugaji , Yoshio Nishi , Yasuhito Eguchi
发明人： Satoshi Iwatsu , Kazunori Ozawa , Masana Ugaji , Yoshio Nishi , Yasuhito Eguchi
IPC分类号： G01R31/36 , H01M10/48 , H01M10/44
CPC分类号： G01R31/3648 , G01R31/3658 , Y10S320/21
摘要： A battery unit of a cartridge type for use as a power supply for electric motorcars, broadcasting apparatus and the like comprises a battery, a monitoring unit for monitoring the condition of the battery and storing information about the battery, a display for displaying data obtained by the monitoring unit, an I/O unit for sending out data representing the condition of the battery monitored by the monitoring unit to an external device, and a battery identification output unit for sending out a battery identification signal representing the type of the battery. The monitoring unit comprises a voltage measuring unit for measuring the supply voltage of the battery, a current measuring unit for measuring the current supplied from the battery, a temperature sensor for sensing the temperature of the battery, and a clock for indicating passage of time. The monitoring unit determines the quantity of residual electrical energy remaining in the battery when replacing the battery with a fully charged battery.
摘要翻译：作为用于电动马达，广播装置等的电源的盒式电池单元包括电池，用于监视电池的状况并存储关于电池的信息的监视单元，用于显示由监视单元，用于将表示由监视单元监视的电池的状态的数据发送到外部设备的I / O单元，以及用于发送表示电池类型的电池识别信号的电池识别输出单元。监视单元包括用于测量电池的电源电压的电压测量单元，用于测量从电池供应的电流的电流测量单元，用于感测电池的温度的温度传感器和用于指示时间流逝的时钟。当用完全充电的电池更换电池时，监控单元确定电池中剩余电能的数量。

2. 发明申请

US20150094829A1 SEQUENCE PROGRAM CREATION DEVICE 有权
标题翻译：序列创建设备
公开(公告)号：US20150094829A1
公开(公告)日：2015-04-02
申请号：US14385233
申请日：2012-03-19
申请人： Satoshi Iwatsu
发明人： Satoshi Iwatsu
IPC分类号： G05B19/05
CPC分类号： G06K9/80 , G05B19/056 , G05B2219/13004 , G05B2219/13052 , Y02P90/265
摘要： A sequence program creation device includes a search-key-circuit specification unit specifying a search key circuit; a search-area specification unit specifying a search area for searching for a circuit similar to the search key circuit; a search-index specification unit specifying an index in a process of calculating a similarity to the search key circuit; a similarity calculation unit calculating a similarity to the search key circuit, based on the index, for each circuit included in the search area; a search-target-part determination unit determining whether the similarity is equal to or more than a predetermined threshold for each circuit for which the similarity calculation unit has calculated the similarity; and a search-result display-screen display unit displaying on a search-result display screen a circuit whose similarity is determined to be equal to or more than the predetermined threshold by the search-target-part determination unit.
摘要翻译：序列程序创建装置包括指定搜索关键电路的搜索键电路指定单元; 搜索区域指定单元，其指定用于搜索类似于搜索关键电路的电路的搜索区域; 搜索索引指定单元，其在计算与搜索关键电路的相似度的处理中指定索引; 相似度计算单元，基于所述索引，针对包括在所述搜索区域中的每个电路计算与所述搜索关键电路的相似度; 搜索目标部分确定单元，确定相似度计算单元已计算出相似度的每个电路的相似度是否等于或大于预定阈值; 以及搜索结果显示画面显示单元，其在搜索结果显示画面上显示由搜索对象部分确定单元确定其相似度等于或大于预定阈值的电路。

3. 发明授权

US07005743B2 Semiconductor device using bumps, method for fabricating same, and method for forming bumps 有权
标题翻译：使用凸块的半导体装置及其制造方法以及用于形成凸块的方法
公开(公告)号：US07005743B2
公开(公告)日：2006-02-28
申请号：US10949640
申请日：2004-09-24
申请人： Satoshi Iwatsu , Noriyuki Honda
发明人： Satoshi Iwatsu , Noriyuki Honda
IPC分类号： H01L23/48 , H01L23/52 , H01L29/40
CPC分类号： H01L24/81 , H01L21/563 , H01L23/49816 , H01L23/49838 , H01L24/11 , H01L24/13 , H01L27/14601 , H01L2224/1134 , H01L2224/13099 , H01L2224/13144 , H01L2224/16 , H01L2224/45144 , H01L2224/73203 , H01L2224/81801 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01029 , H01L2924/01033 , H01L2924/01067 , H01L2924/01075 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01087 , H01L2924/10253 , H01L2924/14 , H01L2924/3511 , H01L2924/00
摘要： A semiconductor device able to maintain a bonding state between a bump and an electrode and having high reliability even under thermal stress, wherein a sealing resin is interposed to bond the electrodes and bumps between a wiring board formed with a plurality of electrodes and an IC chip formed with a plurality of bumps, the bumps being formed under the condition that the following formula is satisfied. 100
摘要翻译：一种半导体器件，其能够保持突起和电极之间的接合状态，即使在热应力下也具有高的可靠性，其中插入有密封树脂以将形成有多个电极的布线基板与IC芯片形成有多个凸块，在满足以下公式的条件下形成凸块

4. 发明申请

US20050037602A1 Semiconductor device using bumps, method for fabricating same, and method for forming bumps 有权
标题翻译：使用凸块的半导体装置及其制造方法以及用于形成凸块的方法
公开(公告)号：US20050037602A1
公开(公告)日：2005-02-17
申请号：US10949502
申请日：2004-09-24
申请人： Satoshi Iwatsu , Noriyuki Honda
发明人： Satoshi Iwatsu , Noriyuki Honda
IPC分类号： H01L21/44 , H01L21/56 , H01L21/60 , H01L23/00 , H01L23/48 , H01L23/485 , H01L23/498 , H01L23/52 , H01L27/146 , H01L31/00 , H01L31/109
CPC分类号： H01L24/81 , H01L21/563 , H01L23/49816 , H01L23/49838 , H01L24/11 , H01L24/13 , H01L27/14601 , H01L2224/1134 , H01L2224/13099 , H01L2224/13144 , H01L2224/16 , H01L2224/45144 , H01L2224/73203 , H01L2224/81801 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01029 , H01L2924/01033 , H01L2924/01067 , H01L2924/01075 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01087 , H01L2924/10253 , H01L2924/14 , H01L2924/3511 , H01L2924/00
摘要： A semiconductor device able to maintain a bonding state between a bump and an electrode and having high reliability even under thermal stress, wherein a sealing resin is interposed to bond the electrodes and bumps between a wiring board formed with a plurality of electrodes and an IC chip formed with a plurality of bumps, the bumps being formed under the condition that the following formula is satisfied. 100
摘要翻译：一种半导体器件，其能够保持突起和电极之间的接合状态，即使在热应力下也具有高的可靠性，其中插入有密封树脂以将形成有多个电极的布线基板与IC芯片形成有多个凸块，在满足以下公式的条件下形成凸块。 100 <（（PHIAxF）/ H）<125其中PhiA表示与电极接合的凸块的顶部直径，H是从IC芯片突出并与电极接合的凸起的高度，F是线性热膨胀系数密封树脂。

5. 发明授权

US06425516B1 Semiconductor device and method of production of the same 失效
标题翻译：半导体器件及其制造方法
公开(公告)号：US06425516B1
公开(公告)日：2002-07-30
申请号：US09558863
申请日：2000-04-27
申请人： Satoshi Iwatsu , Toshiaki Iwafuchi , Takashi Saito
发明人： Satoshi Iwatsu , Toshiaki Iwafuchi , Takashi Saito
IPC分类号： B23K3102
CPC分类号： H01L24/12 , B23K3/0623 , B23K2101/40 , H01L23/3114 , H01L24/11 , H01L24/16 , H01L24/81 , H01L24/94 , H01L2224/05001 , H01L2224/05022 , H01L2224/05548 , H01L2224/11332 , H01L2224/11334 , H01L2224/1308 , H01L2224/13082 , H01L2224/131 , H01L2224/13144 , H01L2224/13147 , H01L2224/16 , H01L2224/274 , H01L2224/81801 , H01L2924/00013 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01015 , H01L2924/01029 , H01L2924/01033 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/14 , H01L2924/3511 , H01L2924/00014 , H01L2224/13099 , H01L2224/05644 , H01L2224/05647 , H01L2224/05124
摘要： A semiconductor device comprising a semiconductor substrate on which metal bumps having narrowed base portions are bonded and coated on its top surface with a resin covering the base portions of the metal bumps, improving reliability of the bump bonds. Also, a method of production of a semiconductor device including steps of forming metal bumps in a wafer state, coating a resin for protecting a wiring surface of a semiconductor chip in the wafer state and cutting the semiconductor chip from the wafer, wherein the metal bumps have narrowed base portions and are bonded to the wiring surface of the semiconductor chip and the resin is coated covering the base portions of the metal bumps.
摘要翻译：一种半导体器件，包括半导体衬底，其上具有变窄的基部的金属凸块在其顶表面上用覆盖金属凸块的基部的树脂粘合并涂覆，从而提高凸起接合的可靠性。此外，制造半导体器件的方法包括以下步骤：在晶片状态下形成金属凸块，涂覆用于保护晶片状态的半导体芯片的布线表面的树脂并从晶片切割半导体芯片，其中金属凸块具有变窄的基部并且结合到半导体芯片的布线表面，并且涂覆树脂覆盖金属凸块的基部。

6. 发明授权

US07015131B2 Semiconductor device using bumps, method for fabricating same, and method for forming bumps 有权
标题翻译：使用凸块的半导体装置及其制造方法以及用于形成凸块的方法
公开(公告)号：US07015131B2
公开(公告)日：2006-03-21
申请号：US10949502
申请日：2004-09-24
申请人： Satoshi Iwatsu , Noriyuki Honda
发明人： Satoshi Iwatsu , Noriyuki Honda
IPC分类号： H01L21/44
CPC分类号： H01L24/81 , H01L21/563 , H01L23/49816 , H01L23/49838 , H01L24/11 , H01L24/13 , H01L27/14601 , H01L2224/1134 , H01L2224/13099 , H01L2224/13144 , H01L2224/16 , H01L2224/45144 , H01L2224/73203 , H01L2224/81801 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01029 , H01L2924/01033 , H01L2924/01067 , H01L2924/01075 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01087 , H01L2924/10253 , H01L2924/14 , H01L2924/3511 , H01L2924/00
摘要： A semiconductor device able to maintain a bonding state between a bump and an electrode and having high reliability even under thermal stress, wherein a sealing resin is interposed to bond the electrodes and bumps between a wiring board formed with a plurality of electrodes and an IC chip formed with a plurality of bumps, the bumps being formed under the condition that the following formula is satisfied. 100
摘要翻译：一种半导体器件，其能够保持突起和电极之间的接合状态，即使在热应力下也具有高的可靠性，其中插入有密封树脂以将形成有多个电极的布线基板与IC芯片形成有多个凸块，在满足以下公式的条件下形成凸块。 <？in-line-formula description =“In-line Formulas”end =“lead”？> 100 <（（PhiAxF）/ H）<125 <？in-line-formula description =“In-line Formulas”end = “tail”→>其中PhiA表示与电极键合的凸起的顶部直径，H是从IC芯片突出并与电极接合的凸起的高度，F表示密封树脂的线性热膨胀系数。

7. 发明申请

US20050045912A1 Semiconductor device using bumps, method for fabricating same, and method for forming bumps 有权
公开(公告)号：US20050045912A1
公开(公告)日：2005-03-03
申请号：US10949640
申请日：2004-09-24
申请人： Satoshi Iwatsu , Noriyuki Honda
发明人： Satoshi Iwatsu , Noriyuki Honda
IPC分类号： H01L21/44 , H01L21/56 , H01L21/60 , H01L23/00 , H01L23/48 , H01L23/485 , H01L23/498 , H01L23/52 , H01L27/146 , H01L31/00 , H01L31/109
CPC分类号： H01L24/81 , H01L21/563 , H01L23/49816 , H01L23/49838 , H01L24/11 , H01L24/13 , H01L27/14601 , H01L2224/1134 , H01L2224/13099 , H01L2224/13144 , H01L2224/16 , H01L2224/45144 , H01L2224/73203 , H01L2224/81801 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01029 , H01L2924/01033 , H01L2924/01067 , H01L2924/01075 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01087 , H01L2924/10253 , H01L2924/14 , H01L2924/3511 , H01L2924/00
摘要： A semiconductor device able to maintain a bonding state between a bump and an electrode and having high reliability even under thermal stress, wherein a sealing resin is interposed to bond the electrodes and bumps between a wiring board formed with a plurality of electrodes and an IC chip formed with a plurality of bumps, the bumps being formed under the condition that the following formula is satisfied. 100

8. 发明授权

US06812569B2 Semiconductor device using bumps, method for fabricating same, and method for forming bumps 有权
标题翻译：使用凸块的半导体装置及其制造方法以及用于形成凸块的方法
公开(公告)号：US06812569B2
公开(公告)日：2004-11-02
申请号：US10245697
申请日：2002-09-16
申请人： Satoshi Iwatsu , Noriyuki Honda
发明人： Satoshi Iwatsu , Noriyuki Honda
IPC分类号： H01L2348
CPC分类号： H01L24/81 , H01L21/563 , H01L23/49816 , H01L23/49838 , H01L24/11 , H01L24/13 , H01L27/14601 , H01L2224/1134 , H01L2224/13099 , H01L2224/13144 , H01L2224/16 , H01L2224/45144 , H01L2224/73203 , H01L2224/81801 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01029 , H01L2924/01033 , H01L2924/01067 , H01L2924/01075 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01087 , H01L2924/10253 , H01L2924/14 , H01L2924/3511 , H01L2924/00
摘要： A semiconductor device able to maintain a bonding state between a bump and an electrode and having high reliability even under thermal stress, wherein a sealing resin is interposed to bond the electrodes and bumps between a wiring board formed with a plurality of electrodes and an IC chip formed with a plurality of bumps, the bumps being formed under the condition that the following formula is satisfied. 100
摘要翻译：一种半导体器件，其能够保持突起和电极之间的接合状态，即使在热应力下也具有高的可靠性，其中插入有密封树脂以将形成有多个电极的布线基板与IC芯片形成有多个凸点，在满足以下公式的条件下形成凸块。其中，PhiA表示与电极接合的凸块的顶部直径，H是从IC芯片凸出的凸起的高度，电极，F为密封树脂的线性热膨胀系数。

9. 发明授权

US06614111B2 Semiconductor device using bumps, method for fabricating same, and method for forming bumps 有权
标题翻译：使用凸块的半导体装置及其制造方法以及用于形成凸块的方法
公开(公告)号：US06614111B2
公开(公告)日：2003-09-02
申请号：US09844874
申请日：2001-04-27
申请人： Satoshi Iwatsu , Noriyuki Honda
发明人： Satoshi Iwatsu , Noriyuki Honda
IPC分类号： H01L2348
CPC分类号： H01L24/81 , H01L21/563 , H01L23/49816 , H01L23/49838 , H01L24/11 , H01L24/13 , H01L27/14601 , H01L2224/1134 , H01L2224/13099 , H01L2224/13144 , H01L2224/16 , H01L2224/45144 , H01L2224/73203 , H01L2224/81801 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01029 , H01L2924/01033 , H01L2924/01067 , H01L2924/01075 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01087 , H01L2924/10253 , H01L2924/14 , H01L2924/3511 , H01L2924/00
摘要： A semiconductor device able to maintain a bonding state between a bump and an electrode and having high reliability even under thermal stress, wherein a sealing resin is interposed to bond the electrodes and bumps between a wiring board formed with a plurality of electrodes and an IC chip formed with a plurality of bumps, the bumps being formed under the condition that the following formula is satisfied. 100
摘要翻译：一种半导体器件，其能够保持突起和电极之间的接合状态，即使在热应力下也具有高的可靠性，其中插入有密封树脂以将形成有多个电极的布线基板与IC芯片形成有多个凸点，在满足以下公式的条件下形成凸块。其中，PHIA表示与电极接合的凸块的顶部直径，H是从IC芯片凸出并与电极，F为密封树脂的线性热膨胀系数。

10. 发明授权

US09747529B2 Sequence program creation device 有权
公开(公告)号：US09747529B2
公开(公告)日：2017-08-29
申请号：US14385233
申请日：2012-03-19
申请人： Satoshi Iwatsu
发明人： Satoshi Iwatsu
IPC分类号： G05B19/42 , G06K9/80 , G05B19/05
CPC分类号： G06K9/80 , G05B19/056 , G05B2219/13004 , G05B2219/13052 , Y02P90/265
摘要： A sequence program creation device includes a search-key-circuit specification unit specifying a search key circuit; a search-area specification unit specifying a search area for searching for a circuit similar to the search key circuit; a search-index specification unit specifying an index in a process of calculating a similarity to the search key circuit; a similarity calculation unit calculating a similarity to the search key circuit, based on the index, for each circuit included in the search area; a search-target-part determination unit determining whether the similarity is equal to or more than a predetermined threshold for each circuit for which the similarity calculation unit has calculated the similarity; and a search-result display-screen display unit displaying on a search-result display screen a circuit whose similarity is determined to be equal to or more than the predetermined threshold by the search-target-part determination unit.

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