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1. 发明授权

US07005743B2 Semiconductor device using bumps, method for fabricating same, and method for forming bumps 有权
标题翻译：使用凸块的半导体装置及其制造方法以及用于形成凸块的方法
公开(公告)号：US07005743B2
公开(公告)日：2006-02-28
申请号：US10949640
申请日：2004-09-24
申请人： Satoshi Iwatsu , Noriyuki Honda
发明人： Satoshi Iwatsu , Noriyuki Honda
IPC分类号： H01L23/48 , H01L23/52 , H01L29/40
CPC分类号： H01L24/81 , H01L21/563 , H01L23/49816 , H01L23/49838 , H01L24/11 , H01L24/13 , H01L27/14601 , H01L2224/1134 , H01L2224/13099 , H01L2224/13144 , H01L2224/16 , H01L2224/45144 , H01L2224/73203 , H01L2224/81801 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01029 , H01L2924/01033 , H01L2924/01067 , H01L2924/01075 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01087 , H01L2924/10253 , H01L2924/14 , H01L2924/3511 , H01L2924/00
摘要： A semiconductor device able to maintain a bonding state between a bump and an electrode and having high reliability even under thermal stress, wherein a sealing resin is interposed to bond the electrodes and bumps between a wiring board formed with a plurality of electrodes and an IC chip formed with a plurality of bumps, the bumps being formed under the condition that the following formula is satisfied. 100
摘要翻译：一种半导体器件，其能够保持突起和电极之间的接合状态，即使在热应力下也具有高的可靠性，其中插入有密封树脂以将形成有多个电极的布线基板与IC芯片形成有多个凸块，在满足以下公式的条件下形成凸块

2. 发明申请

US20050037602A1 Semiconductor device using bumps, method for fabricating same, and method for forming bumps 有权
标题翻译：使用凸块的半导体装置及其制造方法以及用于形成凸块的方法
公开(公告)号：US20050037602A1
公开(公告)日：2005-02-17
申请号：US10949502
申请日：2004-09-24
申请人： Satoshi Iwatsu , Noriyuki Honda
发明人： Satoshi Iwatsu , Noriyuki Honda
IPC分类号： H01L21/44 , H01L21/56 , H01L21/60 , H01L23/00 , H01L23/48 , H01L23/485 , H01L23/498 , H01L23/52 , H01L27/146 , H01L31/00 , H01L31/109
CPC分类号： H01L24/81 , H01L21/563 , H01L23/49816 , H01L23/49838 , H01L24/11 , H01L24/13 , H01L27/14601 , H01L2224/1134 , H01L2224/13099 , H01L2224/13144 , H01L2224/16 , H01L2224/45144 , H01L2224/73203 , H01L2224/81801 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01029 , H01L2924/01033 , H01L2924/01067 , H01L2924/01075 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01087 , H01L2924/10253 , H01L2924/14 , H01L2924/3511 , H01L2924/00
摘要： A semiconductor device able to maintain a bonding state between a bump and an electrode and having high reliability even under thermal stress, wherein a sealing resin is interposed to bond the electrodes and bumps between a wiring board formed with a plurality of electrodes and an IC chip formed with a plurality of bumps, the bumps being formed under the condition that the following formula is satisfied. 100
摘要翻译：一种半导体器件，其能够保持突起和电极之间的接合状态，即使在热应力下也具有高的可靠性，其中插入有密封树脂以将形成有多个电极的布线基板与IC芯片形成有多个凸块，在满足以下公式的条件下形成凸块。 100 <（（PHIAxF）/ H）<125其中PhiA表示与电极接合的凸块的顶部直径，H是从IC芯片突出并与电极接合的凸起的高度，F是线性热膨胀系数密封树脂。

3. 发明授权

US07015131B2 Semiconductor device using bumps, method for fabricating same, and method for forming bumps 有权
标题翻译：使用凸块的半导体装置及其制造方法以及用于形成凸块的方法
公开(公告)号：US07015131B2
公开(公告)日：2006-03-21
申请号：US10949502
申请日：2004-09-24
申请人： Satoshi Iwatsu , Noriyuki Honda
发明人： Satoshi Iwatsu , Noriyuki Honda
IPC分类号： H01L21/44
CPC分类号： H01L24/81 , H01L21/563 , H01L23/49816 , H01L23/49838 , H01L24/11 , H01L24/13 , H01L27/14601 , H01L2224/1134 , H01L2224/13099 , H01L2224/13144 , H01L2224/16 , H01L2224/45144 , H01L2224/73203 , H01L2224/81801 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01029 , H01L2924/01033 , H01L2924/01067 , H01L2924/01075 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01087 , H01L2924/10253 , H01L2924/14 , H01L2924/3511 , H01L2924/00
摘要： A semiconductor device able to maintain a bonding state between a bump and an electrode and having high reliability even under thermal stress, wherein a sealing resin is interposed to bond the electrodes and bumps between a wiring board formed with a plurality of electrodes and an IC chip formed with a plurality of bumps, the bumps being formed under the condition that the following formula is satisfied. 100
摘要翻译：一种半导体器件，其能够保持突起和电极之间的接合状态，即使在热应力下也具有高的可靠性，其中插入有密封树脂以将形成有多个电极的布线基板与IC芯片形成有多个凸块，在满足以下公式的条件下形成凸块。 <？in-line-formula description =“In-line Formulas”end =“lead”？> 100 <（（PhiAxF）/ H）<125 <？in-line-formula description =“In-line Formulas”end = “tail”→>其中PhiA表示与电极键合的凸起的顶部直径，H是从IC芯片突出并与电极接合的凸起的高度，F表示密封树脂的线性热膨胀系数。

4. 发明申请

US20050045912A1 Semiconductor device using bumps, method for fabricating same, and method for forming bumps 有权
公开(公告)号：US20050045912A1
公开(公告)日：2005-03-03
申请号：US10949640
申请日：2004-09-24
申请人： Satoshi Iwatsu , Noriyuki Honda
发明人： Satoshi Iwatsu , Noriyuki Honda
IPC分类号： H01L21/44 , H01L21/56 , H01L21/60 , H01L23/00 , H01L23/48 , H01L23/485 , H01L23/498 , H01L23/52 , H01L27/146 , H01L31/00 , H01L31/109
CPC分类号： H01L24/81 , H01L21/563 , H01L23/49816 , H01L23/49838 , H01L24/11 , H01L24/13 , H01L27/14601 , H01L2224/1134 , H01L2224/13099 , H01L2224/13144 , H01L2224/16 , H01L2224/45144 , H01L2224/73203 , H01L2224/81801 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01029 , H01L2924/01033 , H01L2924/01067 , H01L2924/01075 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01087 , H01L2924/10253 , H01L2924/14 , H01L2924/3511 , H01L2924/00
摘要： A semiconductor device able to maintain a bonding state between a bump and an electrode and having high reliability even under thermal stress, wherein a sealing resin is interposed to bond the electrodes and bumps between a wiring board formed with a plurality of electrodes and an IC chip formed with a plurality of bumps, the bumps being formed under the condition that the following formula is satisfied. 100

5. 发明授权

US06812569B2 Semiconductor device using bumps, method for fabricating same, and method for forming bumps 有权
标题翻译：使用凸块的半导体装置及其制造方法以及用于形成凸块的方法
公开(公告)号：US06812569B2
公开(公告)日：2004-11-02
申请号：US10245697
申请日：2002-09-16
申请人： Satoshi Iwatsu , Noriyuki Honda
发明人： Satoshi Iwatsu , Noriyuki Honda
IPC分类号： H01L2348
CPC分类号： H01L24/81 , H01L21/563 , H01L23/49816 , H01L23/49838 , H01L24/11 , H01L24/13 , H01L27/14601 , H01L2224/1134 , H01L2224/13099 , H01L2224/13144 , H01L2224/16 , H01L2224/45144 , H01L2224/73203 , H01L2224/81801 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01029 , H01L2924/01033 , H01L2924/01067 , H01L2924/01075 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01087 , H01L2924/10253 , H01L2924/14 , H01L2924/3511 , H01L2924/00
摘要： A semiconductor device able to maintain a bonding state between a bump and an electrode and having high reliability even under thermal stress, wherein a sealing resin is interposed to bond the electrodes and bumps between a wiring board formed with a plurality of electrodes and an IC chip formed with a plurality of bumps, the bumps being formed under the condition that the following formula is satisfied. 100
摘要翻译：一种半导体器件，其能够保持突起和电极之间的接合状态，即使在热应力下也具有高的可靠性，其中插入有密封树脂以将形成有多个电极的布线基板与IC芯片形成有多个凸点，在满足以下公式的条件下形成凸块。其中，PhiA表示与电极接合的凸块的顶部直径，H是从IC芯片凸出的凸起的高度，电极，F为密封树脂的线性热膨胀系数。

6. 发明授权

US06614111B2 Semiconductor device using bumps, method for fabricating same, and method for forming bumps 有权
标题翻译：使用凸块的半导体装置及其制造方法以及用于形成凸块的方法
公开(公告)号：US06614111B2
公开(公告)日：2003-09-02
申请号：US09844874
申请日：2001-04-27
申请人： Satoshi Iwatsu , Noriyuki Honda
发明人： Satoshi Iwatsu , Noriyuki Honda
IPC分类号： H01L2348
CPC分类号： H01L24/81 , H01L21/563 , H01L23/49816 , H01L23/49838 , H01L24/11 , H01L24/13 , H01L27/14601 , H01L2224/1134 , H01L2224/13099 , H01L2224/13144 , H01L2224/16 , H01L2224/45144 , H01L2224/73203 , H01L2224/81801 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01029 , H01L2924/01033 , H01L2924/01067 , H01L2924/01075 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01087 , H01L2924/10253 , H01L2924/14 , H01L2924/3511 , H01L2924/00
摘要： A semiconductor device able to maintain a bonding state between a bump and an electrode and having high reliability even under thermal stress, wherein a sealing resin is interposed to bond the electrodes and bumps between a wiring board formed with a plurality of electrodes and an IC chip formed with a plurality of bumps, the bumps being formed under the condition that the following formula is satisfied. 100
摘要翻译：一种半导体器件，其能够保持突起和电极之间的接合状态，即使在热应力下也具有高的可靠性，其中插入有密封树脂以将形成有多个电极的布线基板与IC芯片形成有多个凸点，在满足以下公式的条件下形成凸块。其中，PHIA表示与电极接合的凸块的顶部直径，H是从IC芯片凸出并与电极，F为密封树脂的线性热膨胀系数。

7. 发明授权

US08195697B2 Database creation method, database device and design data evaluation method 有权
标题翻译：数据库创建方法，数据库设备和设计数据评估方法
公开(公告)号：US08195697B2
公开(公告)日：2012-06-05
申请号：US12354594
申请日：2009-01-15
申请人： Shimon Maeda , Noriyuki Honda
发明人： Shimon Maeda , Noriyuki Honda
IPC分类号： G06F7/00
CPC分类号： G06F17/5045
摘要： A database creation method relating to semiconductor ICs, the database registering function block cells constituting a design data of semiconductor IC and evaluation values corresponding to the function block cells such that the function block cells are associated with the evaluation values, for each of the semiconductor ICs, the creation method includes judging whether or not that function block cells constituting a design data of desired semiconductor IC include an unregistered function block cell which is not registered in the database, calculating an unregistered evaluation value corresponding to the unregistered function block cell when the function block cells constituting the design data of the desired semiconductor IC are judged to include the unregistered function block cell, and updating the database by registering the unregistered function block cell and the unregistered evaluation value such that the unregistered function block cell is associated with the unregistered evaluation value.
摘要翻译：关于半导体IC的数据库创建方法，构成半导体IC的设计数据的数据库登记功能块单元和与功能块单元相对应的评估值，使得功能块单元与评估值相关联，用于每个半导体IC 所述创建方法包括判断构成所需半导体IC的设计数据的功能块单元是否包括未登记在数据库中的未注册功能块单元，计算与未注册功能块单元相对应的未注册评估值，判断构成期望的半导体IC的设计数据的块单元包括未注册的功能块单元，并且通过注册未注册的功能块单元和未注册的评估值来更新数据库，使得未注册的功能块单元与未注册的评估相关联价值。

8. 发明申请

US20090187590A1 DATABASE CREATION METHOD, DATABASE DEVICE AND DESIGN DATA EVALUATION METHOD 有权
标题翻译：数据库创建方法，数据库设备和设计数据评估方法
公开(公告)号：US20090187590A1
公开(公告)日：2009-07-23
申请号：US12354594
申请日：2009-01-15
申请人： Shimon MAEDA , Noriyuki Honda
发明人： Shimon MAEDA , Noriyuki Honda
IPC分类号： G06F7/00 , G11C8/00 , G06F12/00
CPC分类号： G06F17/5045
摘要： A database creation method relating to semiconductor ICs, the database registering function block cells constituting a design data of semiconductor IC and evaluation values corresponding to the function block cells such that the function block cells are associated with the evaluation values, for each of the semiconductor ICs, the creation method includes judging whether or not that function block cells constituting a design data of desired semiconductor IC include an unregistered function block cell which is not registered in the database, calculating an unregistered evaluation value corresponding to the unregistered function block cell when the function block cells constituting the design data of the desired semiconductor IC are judged to include the unregistered function block cell, and updating the database by registering the unregistered function block cell and the unregistered evaluation value such that the unregistered function block cell is associated with the unregistered evaluation value.
摘要翻译：关于半导体IC的数据库创建方法，构成半导体IC的设计数据的数据库登记功能块单元和与功能块单元相对应的评估值，使得功能块单元与评估值相关联，用于每个半导体IC 所述创建方法包括判断构成所需半导体IC的设计数据的功能块单元是否包括未登记在数据库中的未注册功能块单元，计算与未注册功能块单元相对应的未注册评估值，判断构成期望的半导体IC的设计数据的块单元包括未注册的功能块单元，并且通过注册未注册的功能块单元和未注册的评估值来更新数据库，使得未注册的功能块单元与未注册的评估相关联价值。

9. 发明申请

US20080264520A1 Method of holding a veneer sheet 有权
标题翻译：保持贴面板的方法
公开(公告)号：US20080264520A1
公开(公告)日：2008-10-30
申请号：US11790287
申请日：2007-04-24
申请人： Yukio Abe , Makoto Isobe , Issaku Okamura , Hiroshige Oda , Akihito Hamaguchi , Noriyuki Honda
发明人： Yukio Abe , Makoto Isobe , Issaku Okamura , Hiroshige Oda , Akihito Hamaguchi , Noriyuki Honda
IPC分类号： B27H1/00
CPC分类号： B27L5/00 , B27L5/002
摘要： The present invention is directed to a method of holding a veneer sheet which has been dried to a moisture content lower than the fiber saturation point and also heated to a temperature higher than an ambient temperature of an environment where the veneer sheet is held. The veneer sheet is bent in such way that at least a part of the veneer sheet in the longitudinal section thereof along the grain direction is curved and the same veneer sheet in any transverse section thereof perpendicular to the grain direction is substantially straight. The veneer sheet held bent is held for a predetermined period of time.
摘要翻译：本发明涉及一种保持已干燥至水分含量低于纤维饱和点的薄板的方法，并将其加热至高于保持薄板的环境的环境温度的温度。薄板片弯曲成使得其沿着晶粒方向的纵截面中的薄板片的至少一部分是弯曲的，并且与其垂直于晶粒方向的任何横截面中的相同的单板片材基本上是直的。保持弯曲的贴面片保持预定的时间。

10. 发明申请

US20060218986A1 Method and device for machining flange part of wheel arch 有权
公开(公告)号：US20060218986A1
公开(公告)日：2006-10-05
申请号：US10568660
申请日：2004-08-18
申请人： Noriyuki Honda , Tsutomu Yokota , Yoshihiro Kageyama , Keishi Okunaka , Tadashi Tobita , Satoru Matsuo , Akira Kodama
发明人： Noriyuki Honda , Tsutomu Yokota , Yoshihiro Kageyama , Keishi Okunaka , Tadashi Tobita , Satoru Matsuo , Akira Kodama
IPC分类号： B21J13/00
CPC分类号： B21D39/02 , Y10T29/53791
摘要： A device for machining the flange part of a wheel arch, wherein a machining mechanism includes, as general-purpose drive parts, first to third cylinders, and the work bending mold for bending the flange part of the wheel arch, work receiving mold, and work guide of the machining mechanism are replaceable with those of the other types. When a dedicated mold is replaced according to the shape of a work, the entire part of the machining mechanism must not be replaced, but merely the work bending mold, work receiving mold and work guide may be replaced with those of the other types.

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