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    • 2. 发明授权
    • Semiconductor device and a method for manufacturing the same
    • 半导体装置及其制造方法
    • US08766329B2
    • 2014-07-01
    • US13523262
    • 2012-06-14
    • Yuta EndoYuki ImotoYuko TakabayashiYasumasa Yamane
    • Yuta EndoYuki ImotoYuko TakabayashiYasumasa Yamane
    • H01L27/085
    • H01L29/7869H01L29/045H01L29/4908H01L29/66969H01L29/78603
    • A transistor in which an electron state at an interface between an oxide semiconductor film and an underlayer film in contact with the oxide semiconductor film is favorable is provided. A value obtained by dividing a difference between nearest neighbor interatomic distance of the underlayer film within the interface and a lattice constant of the semiconductor film by the nearest neighbor interatomic distance of the underlayer film within the interface is less than or equal to 0.15. For example, an oxide semiconductor film is deposited over an underlayer film which contains stabilized zirconia which has a cubic crystal structure and has the (111) plane orientation, whereby the oxide semiconductor film including a crystal region having a high degree of crystallization can be provided directly on the underlayer film.
    • 提供了其中与氧化物半导体膜接触的氧化物半导体膜和下层膜之间的界面处的电子态是有利的晶体管。 通过将界面内的下层膜的最近邻原子间距离与半导体膜的晶格常数之间的差除以界面内的下层膜的最近相邻原子间距离而得到的值小于或等于0.15。 例如,氧化物半导体膜沉积在含有稳定的具有立方晶体结构并具有(111)面取向的氧化锆的下层膜上,由此可以提供包括具有高结晶度的晶体区域的氧化物半导体膜 直接在下层膜上。