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1. 发明申请

US20140151863A1 SEMICONDUCTOR PACKAGES AND METHODS OF FABRICATING THE SAME 审中-公开
标题翻译：半导体封装及其制造方法
公开(公告)号：US20140151863A1
公开(公告)日：2014-06-05
申请号：US14064106
申请日：2013-10-25
申请人： Sang-Uk KIM , SANGWON KIM , TAESUNG PARK , EUNCHUL AHN , CHOONGBIN YIM , Seunghun HAN
发明人： Sang-Uk KIM , SANGWON KIM , TAESUNG PARK , EUNCHUL AHN , CHOONGBIN YIM , Seunghun HAN
IPC分类号： H01L23/495
CPC分类号： H01L24/81 , H01L21/563 , H01L23/3114 , H01L23/3128 , H01L23/49816 , H01L24/03 , H01L24/06 , H01L24/13 , H01L24/16 , H01L24/29 , H01L24/32 , H01L24/48 , H01L24/49 , H01L24/73 , H01L25/105 , H01L2224/0401 , H01L2224/10165 , H01L2224/13024 , H01L2224/13109 , H01L2224/13111 , H01L2224/13147 , H01L2224/1319 , H01L2224/13561 , H01L2224/136 , H01L2224/13609 , H01L2224/13611 , H01L2224/1601 , H01L2224/16225 , H01L2224/16227 , H01L2224/2919 , H01L2224/32145 , H01L2224/32225 , H01L2224/48091 , H01L2224/48227 , H01L2224/4911 , H01L2224/73265 , H01L2224/81011 , H01L2224/8114 , H01L2224/81193 , H01L2224/81815 , H01L2225/0651 , H01L2225/06568 , H01L2225/1023 , H01L2225/1058 , H01L2225/1088 , H01L2924/00014 , H01L2924/15311 , H01L2924/181 , H01L2924/18161 , H01L2924/381 , H01L2924/00012 , H01L2924/00 , H01L2924/014 , H01L2924/01049 , H01L2924/0105 , H01L2224/45099
摘要： A semiconductor package includes a wiring board, a semiconductor chip mounted on the wiring board, and a mounting connection terminal electrically connecting a bonding pad of the semiconductor chip to a first connection pad of the wiring board. The mounting connection terminal includes a core portion and a connecting shell solder portion substantially surrounding the core portion. The core portion of the mounting connection terminal is not in contact with the bonding pad of the semiconductor chip.
摘要翻译：半导体封装包括布线板，安装在布线板上的半导体芯片和将半导体芯片的焊盘电连接到布线板的第一连接焊盘的安装连接端子。安装连接端子包括基本上围绕芯部的芯部分和连接壳焊接部分。安装连接端子的芯部不与半导体芯片的焊盘接触。

2. 发明申请

US20150270242A1 SEMICONDUCTOR PACKAGES AND METHODS OF FABRICATING THE SAME 审中-公开
标题翻译：半导体封装及其制造方法
公开(公告)号：US20150270242A1
公开(公告)日：2015-09-24
申请号：US14729047
申请日：2015-06-02
申请人： Sang-Uk KIM , SANGWON KIM , TAESUNG PARK , EUNCHUL AHN , CHOONGBIN YIM , Seunghun HAN
发明人： Sang-Uk KIM , SANGWON KIM , TAESUNG PARK , EUNCHUL AHN , CHOONGBIN YIM , Seunghun HAN
IPC分类号： H01L23/00 , H01L21/56 , H01L23/31
CPC分类号： H01L24/81 , H01L21/563 , H01L23/3114 , H01L23/3128 , H01L23/49816 , H01L24/03 , H01L24/06 , H01L24/13 , H01L24/16 , H01L24/29 , H01L24/32 , H01L24/48 , H01L24/49 , H01L24/73 , H01L25/105 , H01L2224/0401 , H01L2224/10165 , H01L2224/13024 , H01L2224/13109 , H01L2224/13111 , H01L2224/13147 , H01L2224/1319 , H01L2224/13561 , H01L2224/136 , H01L2224/13609 , H01L2224/13611 , H01L2224/1601 , H01L2224/16225 , H01L2224/16227 , H01L2224/2919 , H01L2224/32145 , H01L2224/32225 , H01L2224/48091 , H01L2224/48227 , H01L2224/4911 , H01L2224/73265 , H01L2224/81011 , H01L2224/8114 , H01L2224/81193 , H01L2224/81815 , H01L2225/0651 , H01L2225/06568 , H01L2225/1023 , H01L2225/1058 , H01L2225/1088 , H01L2924/00014 , H01L2924/15311 , H01L2924/181 , H01L2924/18161 , H01L2924/381 , H01L2924/00012 , H01L2924/00 , H01L2924/014 , H01L2924/01049 , H01L2924/0105 , H01L2224/45099
摘要： A semiconductor package includes a wiring board, a semiconductor chip mounted on the wiring board, and a mounting connection terminal electrically connecting a bonding pad of the semiconductor chip to a first connection pad of the wiring board. The mounting connection terminal includes a core portion and a connecting shell solder portion substantially surrounding the core portion. The core portion of the mounting connection terminal is not in contact with the bonding pad of the semiconductor chip.
摘要翻译：半导体封装包括布线板，安装在布线板上的半导体芯片和将半导体芯片的焊盘电连接到布线板的第一连接焊盘的安装连接端子。安装连接端子包括基本上围绕芯部的芯部分和连接壳焊接部分。安装连接端子的芯部不与半导体芯片的焊盘接触。

3. 发明申请

US20140346667A1 SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME 审中-公开
标题翻译：半导体封装及其制造方法
公开(公告)号：US20140346667A1
公开(公告)日：2014-11-27
申请号：US14210344
申请日：2014-03-13
申请人： Seunghun HAN , Sang-Uk KIM , CHOONGBIN YIM
发明人： Seunghun HAN , Sang-Uk KIM , CHOONGBIN YIM
IPC分类号： H01L25/04 , H01L23/00
CPC分类号： H01L23/3128 , H01L23/49822 , H01L23/49827 , H01L23/49838 , H01L24/16 , H01L24/32 , H01L24/48 , H01L24/73 , H01L24/81 , H01L24/92 , H01L25/105 , H01L25/50 , H01L2224/16145 , H01L2224/16225 , H01L2224/32145 , H01L2224/32225 , H01L2224/48227 , H01L2224/73265 , H01L2224/81191 , H01L2224/81192 , H01L2224/92247 , H01L2225/1023 , H01L2225/1058 , H01L2225/1088 , H01L2924/00014 , H01L2924/12042 , H01L2924/1431 , H01L2924/1434 , H01L2924/15311 , H01L2924/15331 , H01L2924/181 , H01L2924/1815 , H01L2924/18161 , H01L2924/00012 , H01L2924/00 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： A semiconductor package comprising: a lower semiconductor package comprising a lower semiconductor chip mounted on a lower package substrate and a lower molding layer substantially covering the lower semiconductor chip and having through holes arranged in a first direction and a second direction. The first direction is different from the second direction; and for each of the through holes, first and second upper widths of the through hole in the first and second directions are less than a third upper width of the through hole in a third direction that is a diagonal direction with respect to the first and second directions.
摘要翻译：一种半导体封装，包括：下半导体封装，包括安装在下封装衬底上的下半导体芯片和基本上覆盖下半导体芯片的下模制层，并具有沿第一方向和第二方向布置的通孔。第一个方向不同于第二个方向; 并且对于每个通孔，通孔的第一和第二方向上的第一和第二上部宽度在相对于第一和第二通孔的第三方向上的通孔的第三上部宽度小于对角线方向方向。

4. 发明申请

US20160172337A1 SEMICONDUCTOR PACKAGE DEVICES INCLUDING INTERPOSER OPENINGS FOR HEAT TRANSFER MEMBER 审中-公开
标题翻译：半导体封装器件，其中包括用于传输器件的间隔开关
公开(公告)号：US20160172337A1
公开(公告)日：2016-06-16
申请号：US15051171
申请日：2016-02-23
申请人： Sang-Uk KIM
发明人： Sang-Uk KIM
IPC分类号： H01L25/065 , H01L23/367 , H01L23/498 , H01L23/31
CPC分类号： H01L25/0657 , H01L23/13 , H01L23/28 , H01L23/3121 , H01L23/3128 , H01L23/3675 , H01L23/42 , H01L23/49811 , H01L23/49827 , H01L23/49833 , H01L23/49838 , H01L23/5384 , H01L23/5385 , H01L25/10 , H01L2224/16225 , H01L2224/32145 , H01L2224/32225 , H01L2224/48091 , H01L2224/48227 , H01L2224/73253 , H01L2224/73265 , H01L2225/0651 , H01L2225/06548 , H01L2225/06555 , H01L2225/06568 , H01L2225/06572 , H01L2225/06589 , H01L2225/1023 , H01L2225/1058 , H01L2225/107 , H01L2225/1094 , H01L2924/15311 , H01L2924/15331 , H01L2924/18161 , H01L2924/00014 , H01L2924/00
摘要： A semiconductor package device includes a lower package, an interposer disposed on the lower package and including a ground layer and at least one opening, and an upper package on the interposer. The lower package includes a first package substrate, a first semiconductor chip on the first package substrate, and a first molding compound layer on the first package substrate. The upper package includes a second package substrate and at least one upper semiconductor chip on the second package substrate. A heat transfer member includes a first portion disposed between the interposer and the upper package, a second portion disposed in the at least one opening of the interposer, and a third portion disposed between the interposer and the lower package.
摘要翻译：半导体封装器件包括下封装，设置在下封装上并包括接地层和至少一个开口的插入件以及插入件上的上封装。下封装包括第一封装衬底，第一封装衬底上的第一半导体芯片和第一封装衬底上的第一模塑料层。上封装包括第二封装衬底和第二封装衬底上的至少一个上半导体芯片。传热构件包括设置在插入件和上部封装之间的第一部分，设置在插入件的至少一个开口中的第二部分和设置在插入件与下部封装之间的第三部分。

5. 发明申请

US20120026127A1 STYLUS PEN FOR CAPACITIVE TYPE TOUCH PANEL 有权
标题翻译：用于电容式触控面板的STYLUS笔
公开(公告)号：US20120026127A1
公开(公告)日：2012-02-02
申请号：US12979935
申请日：2010-12-28
申请人： Sang-Uk KIM
发明人： Sang-Uk KIM
IPC分类号： G06F3/045
CPC分类号： G06F3/044 , G06F3/03545
摘要： A stylus pen for a capacitive touch screen that allows delicate input. The stylus pen for the capacitive touch panel includes: a pen having a body extending longitudinally and an input portion positioned at one end of the body to provide touch input to the capacitive type touch panel, wherein the input portion comprises: a center conductor having a connection portion that is combined with the body and a tip portion having a cross-sectional area that is smaller than the cross-sectional area of the connection portion that is connected to the body; and a transparent electrode plate that is connected to an end of the tip portion of the center conductor opposite an end connected to the connection portion, wherein the transparent electrode plate has a cross-sectional area larger than the tip portion while defining a touch surface.
摘要翻译：用于电容式触摸屏的触控笔，允许精细的输入。用于电容式触摸面板的触控笔包括：具有纵向延伸的主体的笔和位于身体的一端的输入部分，以提供对电容型触摸面板的触摸输入，其中输入部分包括：中心导体，具有与主体结合的连接部分和具有小于连接到主体的连接部分的横截面积的横截面积的尖端部分; 以及透明电极板，其与所述中心导体的与所述连接部连接的端部相对的前端部的端部连接，所述透明电极板的截面积大于所述前端部，同时限定触摸面。

6. 发明申请

US20090286108A1 HYBRID ELECTRONIC DEVICE INCLUDING SEMICONDUCTOR CHIP AND FUEL CELL, METHOD OF FABRICATING THE SAME AND SYSTEM HAVING THE SAME 审中-公开
标题翻译：包含半导体芯片和燃料电池的混合电子器件，其制造方法和具有相同功能的系统
公开(公告)号：US20090286108A1
公开(公告)日：2009-11-19
申请号：US12404823
申请日：2009-03-16
申请人： Sang-Uk KIM , Tae-Je CHO , Heung-Kyu KWON
发明人： Sang-Uk KIM , Tae-Je CHO , Heung-Kyu KWON
IPC分类号： H01M8/00
CPC分类号： H01M8/1097 , H01L23/58 , H01L24/73 , H01L2224/16225 , H01L2224/32145 , H01L2224/32225 , H01L2224/48095 , H01L2224/48227 , H01L2224/73265 , H01L2224/73267 , H01L2924/15153 , H01L2924/15192 , H01L2924/15311 , H01L2924/15331 , H01L2924/181 , H01M8/08 , H01M8/1011 , H01M8/241 , Y02E60/523 , Y02P70/56 , H01L2924/00014 , H01L2924/00 , H01L2924/00012
摘要： A hybrid electronic device according some embodiments disclosed herein can be generally characterized as including a semiconductor chip and a fuel cell. The semiconductor chip may be in electrical communication with the fuel cell, in thermal communication with the fuel cell, or a combination thereof. The hybrid electronic device may further include a voltage converter is electrically connected to the first semiconductor chip and the first fuel cell.
摘要翻译：根据本文公开的一些实施例的混合电子设备通常可以表征为包括半导体芯片和燃料电池。半导体芯片可以与燃料电池电连接，与燃料电池热连通，或其组合。混合电子装置还可以包括电连接到第一半导体芯片和第一燃料电池的电压转换器。

7. 发明申请

US20100001639A1 ORGANIC LIGHT-EMITTING DISPLAY APPARATUS 有权
标题翻译：有机发光显示装置
公开(公告)号：US20100001639A1
公开(公告)日：2010-01-07
申请号：US12427885
申请日：2009-04-22
申请人： Young-Dae KIM , Kyoung-Bo KIM , Moo-Jin KIM , Cheol-Su KIM , Hye-Dong KIM , Ki-Ju IM , Yong-Sung PARK , Gun-Shik KIM , Jun-Sik OH , Brent JANG , Sang-Uk KIM
发明人： Young-Dae KIM , Kyoung-Bo KIM , Moo-Jin KIM , Cheol-Su KIM , Hye-Dong KIM , Ki-Ju IM , Yong-Sung PARK , Gun-Shik KIM , Jun-Sik OH , Brent JANG , Sang-Uk KIM
IPC分类号： H01J1/54
CPC分类号： H01L27/3244 , G06F3/0412 , G06F3/0421 , H01L27/3227 , H01L27/323
摘要： An organic light-emitting display apparatus having a touch panel operation. The organic light-emitting display apparatus includes: a substrate; a display unit disposed on the substrate; an encapsulation substrate disposed above the display unit; a reflection layer formed on the substrate; and a photo sensor interposed between the reflection layer and the encapsulation substrate, and to detect light striking an object disposed on the encapsulation substrate.
摘要翻译：一种具有触摸面板操作的有机发光显示装置。有机发光显示装置包括：基板; 设置在所述基板上的显示单元; 设置在所述显示单元上方的封装基板; 形成在基板上的反射层; 以及插入在所述反射层和所述封装基板之间的光电传感器，并且检测撞击设置在所述封装基板上的物体的光。

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