专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

1. 发明申请

US20070295609A1 Method for preparing tantalum or niobium powders used for manufacturing capacitors 审中-公开
标题翻译：制造用于制造电容器的钽或铌粉末的方法
公开(公告)号：US20070295609A1
公开(公告)日：2007-12-27
申请号：US11473605
申请日：2006-06-23
申请人： Sang Mun Jeong , Sung Bin Park , Jong Hyeon Lee , Chung Seok Seo , Seong Won Park , Eung Ho Kim
发明人： Sang Mun Jeong , Sung Bin Park , Jong Hyeon Lee , Chung Seok Seo , Seong Won Park , Eung Ho Kim
IPC分类号： C25C3/00
CPC分类号： C25C3/26 , B22F9/20 , B22F2999/00 , C25C3/02 , C25C5/04
摘要： Disclosed relates to a method for preparing tantalum or niobium powders used for manufacturing capacitors in an electrolytic reducing reactor including an anode, a cathode and a molten salt, the method comprising: obtaining a tantalum or niobium oxide, expressed by Ta2O(5-y) or Nb2O(5-y) where y=2.5 to 4.5, from a tantalum pentoxide Ta2O5 or a niobium pentoxide Nb2O5 generated partially by an alkaline metal electrolytically reduced via a first electrolytic reducing reaction that reduces an alkaline metal oxide from a molten salt comprising at least one metal halogen compound, selected from the group consisting of alkaline metal and alkaline earth metal, and an alkaline metal oxide on the cathode; and preparing a tantalum or niobium powder by a first electrolytic reducing reaction that reduces at least one metal halogen compound selected from the group consisting of the alkaline metal oxide and the alkaline earth metal on the cathode and by a second reducing reaction with the tantalum or niobium oxide, represented by Ta2O(5-y) or Nb2O(5-y) where y=2.5 to 4.5.
摘要翻译：本发明涉及一种制备用于在包括阳极，阴极和熔融盐的电解还原反应器中制造电容器的钽或铌粉末的方法，所述方法包括：获得由Ta 2表示的钽或铌氧化物，（5-y）或Nb 2 O（5-y）其中y = 2.5至4.5，从五氧化二钽或通过碱金属部分地生成的五氧化二铌Nb 2 O 5 O 3，其通过电解还原的碱金属第一电解还原反应，其从包含至少一种选自碱金属和碱土金属的金属卤素化合物和阴极上的碱金属氧化物的熔融盐中降低碱金属氧化物; 并通过第一次电解还原反应来制备钽或铌粉末，该反应在阴极上还原至少一种选自碱金属氧化物和碱土金属的金属卤素化合物，并通过与钽或铌的第二次还原反应氧化物，由Ta 2 O（5-y）或Nb 2 O（5-y）表示，其中 y = 2.5〜4.5。

2. 发明申请

US20060179883A1 Apparatus and method for quantitative solidification of molten salt by using vacuum transfer and dual vessel 失效
标题翻译：使用真空转移和双重容器定量凝固熔融盐的设备和方法
公开(公告)号：US20060179883A1
公开(公告)日：2006-08-17
申请号：US11189657
申请日：2005-07-26
申请人： Myeong Soo Jeong , Jin Mok Hur , Soo Haeng Cho , Chung Seok Seo , Seong Won Park
发明人： Myeong Soo Jeong , Jin Mok Hur , Soo Haeng Cho , Chung Seok Seo , Seong Won Park
IPC分类号： C03B7/18 , C03B5/16 , C03B5/26
CPC分类号： C01D15/04
摘要： Provided are an apparatus and method for manufacturing a solidified salt that is easy to treat in size and shape by using a vacuum transfer and a dual vessel. In the apparatus for quantitative solidification of a molten salt, a molten salt is introduced into a first vessel, and a second vessel is disposed inside the first vessel and quantitatively supplied with the molten salt. A molten-salt transferring unit quantitatively transfers the molten salt from the first vessel to the second vessel by vacuum pressure. A valve controls a discharge of the molten salt from the second vessel. A mold receives the molten salt from the second vessel and solidifies the molten salt. Accordingly, the molten salt can be stably discharged to the mold by quantitatively transferring the molten salt at vacuum pressure within the dual vessel, and a predetermined size and shape of the solidified salt can be manufactured, thereby processing and collecting the solidified salt safely.
摘要翻译：提供一种制造固化盐的装置和方法，其通过使用真空转移和双重容器容易地处理尺寸和形状。在熔融盐定量固化装置中，将熔融盐引入第一容器中，将第二容器置于第一容器的内部并定量供给熔融盐。熔融盐转移单元通过真空压力将熔融盐从第一容器定量转移到第二容器。阀门控制来自第二容器的熔融盐的排放。模具从第二容器接收熔融盐并使熔融盐固化。因此，可以通过在双容器内以真空压力定量转移熔融盐，将熔融盐稳定地排出到模具中，并且可以制造预定尺寸和形状的固化盐，从而安全地加工和收集固化盐。

3. 发明授权

US07090760B2 Method of reducing spent oxide nuclear fuel into nuclear-fuel metal using LiCl-Li2O salt, cathode electrode assembly used in the method, and reduction device including the assembly 有权
标题翻译：使用LiCl-Li2O盐将废氧化物核燃料还原成核燃料金属的方法，该方法中使用的阴极电极组件以及包括组件的还原装置
公开(公告)号：US07090760B2
公开(公告)日：2006-08-15
申请号：US10618058
申请日：2003-07-11
申请人： Chung Seok Seo , Jin Mok Hur , In Kyu Choi , Seong Won Park , Hyun Soo Park
发明人： Chung Seok Seo , Jin Mok Hur , In Kyu Choi , Seong Won Park , Hyun Soo Park
IPC分类号： C25C3/34 , C25C3/00 , C25C7/00
CPC分类号： C25C7/005 , C25C3/34
摘要： Disclosed are a method of reducing spent oxides nuclear fuel to nuclear-fuel metal, in which metal oxides are reduced to metals using an electrochemical reduction device with LiCl—Li2O salt as an electrolyte, a cathode electrode assembly used in the method, and a reduction device including the cathode electrode assembly. The method is advantageous in that the process of reducing the spent oxide nuclear fuel to the nuclear-fuel metal and another process of recovering Li are united to simplify the whole processes, direct use of high oxidative Li metals is excluded to secure safety, and conversion efficiency of the spent oxide nuclear fuel is 99% or more.
摘要翻译：公开了一种将废氧化物核燃料还原为核燃料金属的方法，其中使用具有LiCl-Li 2 O盐的电化学还原装置将金属氧化物还原成金属作为电解质，阴极电极该方法中使用的组件和包括阴极电极组件的还原装置。该方法的优点在于，将废氧化物核燃料还原为核燃料金属和另一种回收Li的方法相结合，以简化整个过程，排除了直接使用高氧化性Li金属以确保安全性和转化废氧化物核燃料的效率为99％以上。

4. 发明授权

US07703304B2 Apparatus for quantitative solidification of molten salt by using vacuum transfer and dual vessel 失效
标题翻译：用于通过真空转移和双重容器定量凝固熔融盐的装置
公开(公告)号：US07703304B2
公开(公告)日：2010-04-27
申请号：US11189657
申请日：2005-07-26
申请人： Myeong Soo Jeong , Jin Mok Hur , Soo Haeng Cho , Chung Seok Seo , Seong Won Park
发明人： Myeong Soo Jeong , Jin Mok Hur , Soo Haeng Cho , Chung Seok Seo , Seong Won Park
IPC分类号： C03B7/00 , C03B5/00 , B22D35/06
CPC分类号： C01D15/04
摘要： Provided are an apparatus and method for manufacturing a solidified salt that is easy to treat in size and shape by using a vacuum transfer and a dual vessel. In the apparatus for quantitative solidification of a molten salt, a molten salt is introduced into a first vessel, and a second vessel is disposed inside the first vessel and quantitatively supplied with the molten salt. A molten-salt transferring unit quantitatively transfers the molten salt from the first vessel to the second vessel by vacuum pressure. A valve controls a discharge of the molten salt from the second vessel. A mold receives the molten salt from the second vessel and solidifies the molten salt. Accordingly, the molten salt can be stably discharged to the mold by quantitatively transferring the molten salt at vacuum pressure within the dual vessel, and a predetermined size and shape of the solidified salt can be manufactured, thereby processing and collecting the solidified salt safely.
摘要翻译：提供一种制造固化盐的装置和方法，其通过使用真空转移和双重容器容易地处理尺寸和形状。在熔融盐定量固化装置中，将熔融盐引入第一容器中，将第二容器置于第一容器的内部并定量供给熔融盐。熔融盐转移单元通过真空压力将熔融盐从第一容器定量转移到第二容器。阀门控制来自第二容器的熔融盐的排放。模具从第二容器接收熔融盐并使熔融盐固化。因此，可以通过在双容器内以真空压力定量转移熔融盐，将熔融盐稳定地排出到模具中，并且可以制造预定尺寸和形状的固化盐，从而安全地加工和收集固化盐。

5. 发明授权

US09093278B1 Method of manufacture of integrated circuit packaging system with plasma processing 有权
标题翻译：具有等离子体处理的集成电路封装系统的制造方法
公开(公告)号：US09093278B1
公开(公告)日：2015-07-28
申请号：US14137352
申请日：2013-12-20
申请人： JoonYoung Choi , Seong Won Park , KyungOe Kim , Hun Teak Lee , SungWon Cho
发明人： JoonYoung Choi , Seong Won Park , KyungOe Kim , Hun Teak Lee , SungWon Cho
IPC分类号： H01L21/302 , H01L21/461 , H01L23/00 , H01L21/56
CPC分类号： H01L24/81 , H01L21/563 , H01L24/13 , H01L24/16 , H01L24/27 , H01L24/29 , H01L24/83 , H01L24/91 , H01L2224/131 , H01L2224/13147 , H01L2224/16058 , H01L2224/16238 , H01L2224/27312 , H01L2224/2919 , H01L2224/32225 , H01L2224/73204 , H01L2224/81022 , H01L2224/81191 , H01L2224/81203 , H01L2224/83022 , H01L2224/83192 , H01L2224/8388 , H01L2924/00014 , H01L2924/12044 , H01L2224/16225 , H01L2924/00 , H01L2924/014 , H01L2224/0401
摘要： A method of manufacture of an integrated circuit packaging system including: heating a support structure having a conductive pad and an organic surface protection layer on the conductive pad; removing the organic surface protection layer from the conductive pad by a plasma process with a two-step method, the two-step method includes a first step with a dioxygen and a second step with a dihydrogen, wherein the second step immediately follows the first step; and forming an underfill over the conductive pad.
摘要翻译：一种制造集成电路封装系统的方法，包括：在所述导电焊盘上加热具有导电焊盘和有机表面保护层的支撑结构; 通过两步法通过等离子体工艺从导电焊盘去除有机表面保护层，两步法包括具有二氧化合物的第一步骤和具有二氢的第二步骤，其中第二步骤紧随着第一步骤 ; 并在导电垫上形成底部填充物。

6. 发明申请

US20110099540A1 METHOD AND SYSTEM FOR TESTING SOFWARE FOR INDUSTRIAL MACHINE 有权
标题翻译：用于测试工业机械的方法和系统
公开(公告)号：US20110099540A1
公开(公告)日：2011-04-28
申请号：US12611955
申请日：2009-11-04
申请人： Hyunseop Bae , Kyung Hwa Choi , Seokjoo Choi , Seong Won Park , Seung Joon Lee
发明人： Hyunseop Bae , Kyung Hwa Choi , Seokjoo Choi , Seong Won Park , Seung Joon Lee
IPC分类号： G06F9/45
CPC分类号： G06F11/3668 , G06F11/3664
摘要： There are provided a method and system for testing software for an industrial machine with continuous test values reflecting actual environmental factors, using a simulator before the software for the industrial machine is embedded into an actual industrial machine. A method for testing software for an industrial machine, the method comprising the steps of: coding a program for a diagram through which the industrial machine is driven; compiling the program into an instruction with which the industrial machine is driven; downloading the compiled program onto a simulator for implementing a programming interface provided by the industrial machine; executing the compiled program in the simulator: generating a first data for testing the compiled program: transmitting the first test data to the simulator having the downloaded program from a testing tool; and outputting a result data obtained after executing the program having the transmitted first test data and then transmitting the result data to the testing tool. Accordingly, it is possible to reduce a time taken for testing, to improve the accuracy and efficiency of the testing and to save cost required in the testing.
摘要翻译：提供了一种用于测试工业机器软件的方法和系统，其具有反映实际环境因素的连续测试值，在将工业机器的软件嵌入实际工业机器之前，使用模拟器。一种用于测试工业机器的软件的方法，所述方法包括以下步骤：编程用于驱动所述工业机器的图的程序; 将程序编译成工业机器驱动的指令; 将编译的程序下载到用于实现由工业机器提供的编程接口的模拟器; 在模拟器中执行编译的程序：产生用于测试编译程序的第一数据：将第一测试数据从测试工具发送到具有下载程序的模拟器; 并输出在执行具有发送的第一测试数据的程序之后获得的结果数据，然后将结果数据发送到测试工具。因此，可以减少测试所需的时间，提高测试的精度和效率，并节省测试所需的成本。

7. 发明授权

US08572583B2 Method and system for testing software for industrial machine 有权
标题翻译：工业机械软件测试方法及系统
公开(公告)号：US08572583B2
公开(公告)日：2013-10-29
申请号：US12611955
申请日：2009-11-04
申请人： Hyunseop Bae , Kyung Hwa Choi , Seokjoo Choi , Seong Won Park , Seung Joon Lee
发明人： Hyunseop Bae , Kyung Hwa Choi , Seokjoo Choi , Seong Won Park , Seung Joon Lee
IPC分类号： G06F9/44 , G06F17/50
CPC分类号： G06F11/3668 , G06F11/3664
摘要： There are provided a method and system for testing software for an industrial machine with continuous test values reflecting actual environmental factors, using a simulator before the software for the industrial machine is embedded into an actual industrial machine. A method for testing software for an industrial machine, the method comprising the steps of: coding a program for a diagram through which the industrial machine is driven; compiling the program into an instruction with which the industrial machine is driven; downloading the compiled program onto a simulator for implementing a programming interface provided by the industrial machine; executing the compiled program in the simulator: generating a first data for testing the compiled program: transmitting the first test data to the simulator having the downloaded program from a testing tool; and outputting a result data obtained after executing the program having the transmitted first test data and then transmitting the result data to the testing tool. Accordingly, it is possible to reduce a time taken for testing, to improve the accuracy and efficiency of the testing and to save cost required in the testing.
摘要翻译：提供了一种用于测试工业机器软件的方法和系统，其具有反映实际环境因素的连续测试值，在将工业机器的软件嵌入实际工业机器之前，使用模拟器。一种用于测试工业机器的软件的方法，所述方法包括以下步骤：编程用于驱动所述工业机器的图的程序; 将程序编译成工业机器驱动的指令; 将编译的程序下载到用于实现由工业机器提供的编程接口的模拟器; 在模拟器中执行编译的程序：产生用于测试编译程序的第一数据：将第一测试数据从测试工具发送到具有下载程序的模拟器; 并输出在执行具有发送的第一测试数据的程序之后获得的结果数据，然后将结果数据发送到测试工具。因此，可以减少测试所需的时间，提高测试的精度和效率，并节省测试所需的成本。

8. 发明授权

US08035205B2 Molding compound flow controller 有权
标题翻译：成型复合流量控制器
公开(公告)号：US08035205B2
公开(公告)日：2011-10-11
申请号：US11620561
申请日：2007-01-05
申请人： Seong Won Park , Cheng Yu Hsia , Yong Suk Kim
发明人： Seong Won Park , Cheng Yu Hsia , Yong Suk Kim
IPC分类号： H01L23/495
CPC分类号： H01L21/565 , H01L24/73 , H01L24/97 , H01L25/0657 , H01L2224/32145 , H01L2224/32225 , H01L2224/32245 , H01L2224/45124 , H01L2224/45144 , H01L2224/48091 , H01L2224/48225 , H01L2224/48227 , H01L2224/48247 , H01L2224/73265 , H01L2224/97 , H01L2225/06568 , H01L2924/01029 , H01L2924/14 , H01L2924/181 , H01L2224/85 , H01L2924/00 , H01L2924/00012 , H01L2924/00014
摘要： A semiconductor package can comprise a die stack attached to a substrate, with bond wires electrically connecting the two. Often multiple die stacks are adhered to a single substrate so that several semiconductor packages can be manufactured at once. A molding compound flow controller is optimally associated with the substrate or semiconductor package at one or more various locations. Flow controllers can control or direct the flow of the molding compound during the encapsulation process. Flow controllers can be sized, shaped, and positioned in order to smooth out the flow of the molding compound, such that the speed of the flow is substantially equivalent over areas of the substrate containing dies and over areas of the substrate without dies. In this manner, defects such as voids in the encapsulation, wire sweeping, and wire shorts can be substantially avoided during encapsulation.
摘要翻译：半导体封装可以包括附接到衬底的管芯堆叠，其中接合线电连接两者。通常，多个管芯堆叠被粘附到单个衬底上，使得可以一次制造几个半导体封装。模制复合流量控制器在一个或多个不同位置处与衬底或半导体封装最佳地相关联。流动控制器可以在封装过程中控制或引导模塑料的流动。流量控制器的尺寸，形状和位置可以平滑模制化合物的流动，从而在含有模具的基材的区域和没有模具的基材的超过区域上流动的速度基本相当。以这种方式，在封装期间可以基本上避免诸如封装，电线清扫和电线短路之类的缺陷的缺陷。

9. 发明申请

US20080164587A1 MOLDING COMPOUND FLOW CONTROLLER 有权
标题翻译：模压化合物流量控制器
公开(公告)号：US20080164587A1
公开(公告)日：2008-07-10
申请号：US11620561
申请日：2007-01-05
申请人： Seong Won Park , Cheng Yu Hsia , Yong Suk Kim
发明人： Seong Won Park , Cheng Yu Hsia , Yong Suk Kim
IPC分类号： H01L23/495 , H01L21/56
CPC分类号： H01L21/565 , H01L24/73 , H01L24/97 , H01L25/0657 , H01L2224/32145 , H01L2224/32225 , H01L2224/32245 , H01L2224/45124 , H01L2224/45144 , H01L2224/48091 , H01L2224/48225 , H01L2224/48227 , H01L2224/48247 , H01L2224/73265 , H01L2224/97 , H01L2225/06568 , H01L2924/01029 , H01L2924/14 , H01L2924/181 , H01L2224/85 , H01L2924/00 , H01L2924/00012 , H01L2924/00014
摘要： A semiconductor package can comprise a die stack attached to a substrate, with bond wires electrically connecting the two. Often multiple die stacks are adhered to a single substrate so that several semiconductor packages can be manufactured at once. A molding compound flow controller is optimally associated with the substrate or semiconductor package at one or more various locations. Flow controllers can control or direct the flow of the molding compound during the encapsulation process. Flow controllers can be sized, shaped, and positioned in order to smooth out the flow of the molding compound, such that the speed of the flow is substantially equivalent over areas of the substrate containing dies and over areas of the substrate without dies. In this manner, defects such as voids in the encapsulation, wire sweeping, and wire shorts can be substantially avoided during encapsulation.
摘要翻译：半导体封装可以包括附接到衬底的管芯堆叠，其中接合线电连接两者。通常，多个管芯堆叠被粘附到单个衬底上，使得可以一次制造几个半导体封装。模制复合流量控制器在一个或多个不同位置处与衬底或半导体封装最佳地相关联。流动控制器可以在封装过程中控制或引导模塑料的流动。流量控制器的尺寸，形状和位置可以平滑模制化合物的流动，从而在含有模具的基材的区域和没有模具的基材的超过区域上流动的速度基本相当。以这种方式，在封装期间可以基本上避免诸如封装，电线清扫和电线短路之类的缺陷的缺陷。

10. 发明授权

US09693455B1 Integrated circuit packaging system with plated copper posts and method of manufacture thereof 有权
公开(公告)号：US09693455B1
公开(公告)日：2017-06-27
申请号：US14227346
申请日：2014-03-27
申请人： Seong Won Park , Hun Teak Lee , WoonJae Beak , MinJung Kim , ChangHwan Kim , ByungHyun Kwak , GwangTae Kim , HeeSoo Lee
发明人： Seong Won Park , Hun Teak Lee , WoonJae Beak , MinJung Kim , ChangHwan Kim , ByungHyun Kwak , GwangTae Kim , HeeSoo Lee
IPC分类号： H05K1/11 , H05K3/36 , H05K3/40 , H05K1/09 , H05K1/18 , H05K1/14 , H05K3/32 , H05K3/46
CPC分类号： H05K1/112 , H01L2224/16225 , H01L2224/73204 , H05K1/09 , H05K1/113 , H05K1/14 , H05K1/18 , H05K1/186 , H05K3/32 , H05K3/36 , H05K3/4007 , H05K3/4038 , H05K3/46 , H05K3/4614 , H05K3/4623 , H05K2201/04 , H05K2203/061 , H05K2203/0733
摘要： A system and method of manufacture of an integrated circuit packaging system includes: a copper film; a first metal layer directly on the copper film; an insulation layer directly on and over the first metal layer, the insulation layer having a via hole through the insulation layer; a conductive via within the via hole and directly on the first metal layer; a second metal layer directly on the conductive via and the insulation layer; a copper post directly on the copper film; a solder pad over the copper post; and an interposer coupled to the copper post and the solder pad.

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式