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1. 发明授权

US07372133B2 Microelectronic package having a stiffening element and method of making same 有权
标题翻译：具有加强元件的微电子封装及其制造方法
公开(公告)号：US07372133B2
公开(公告)日：2008-05-13
申请号：US11292705
申请日：2005-12-01
申请人： Saeed Shojaie , Brian Taggart , Dale Hackitt
发明人： Saeed Shojaie , Brian Taggart , Dale Hackitt
IPC分类号： H01L23/495 , H01L23/28 , H01L23/498 , H01L21/50 , H01L21/48 , H01L21/44
CPC分类号： H01L23/3107 , H01L21/568 , H01L23/49582 , H01L24/45 , H01L24/48 , H01L2224/32245 , H01L2224/45144 , H01L2224/48095 , H01L2224/48247 , H01L2224/48257 , H01L2224/48465 , H01L2224/73265 , H01L2924/01013 , H01L2924/01014 , H01L2924/01028 , H01L2924/01029 , H01L2924/01078 , H01L2924/01079 , H01L2924/14 , H01L2924/1433 , H01L2924/181 , H01L2924/19041 , H01L2924/00014 , H01L2924/00012 , H01L2924/00
摘要： A method of forming a leadframe package, a leadframe package formed according to the method, and a system incorporating the leadframe package. The leadframe package includes: a metallization layer comprising a paddle portion and a contact portion including contact leads; a die mounted onto the paddle portion; wirebonds connected between the die and respective ones of the contact leads; an overmold encapsulating the die, the paddle portion, the contact leads and the wirebonds; and a stiffening element encapsulated in the overmold and unconnected to electrical pathways within the leadframe package.
摘要翻译：一种形成引线框封装的方法，根据该方法形成的引线框封装以及结合引线框封装的系统。引线框封装包括：金属化层，其包括桨状部分和包括接触引线的接触部分; 安装在所述桨部上的模具; 连接在管芯和相应的接触引线之间的引线; 封装模具，桨形部分，接触引线和引线键的包覆模制; 以及封装在包覆模制中且与引线框封装内的电路不连接的加强元件。

2. 发明申请

US20070126094A1 Microelectronic package having a stiffening element and method of making same 有权
标题翻译：具有加强元件的微电子封装及其制造方法
公开(公告)号：US20070126094A1
公开(公告)日：2007-06-07
申请号：US11292705
申请日：2005-12-01
申请人： Saeed Shojaie , Brian Taggart , Dale Hackitt
发明人： Saeed Shojaie , Brian Taggart , Dale Hackitt
IPC分类号： H01L23/495
CPC分类号： H01L23/3107 , H01L21/568 , H01L23/49582 , H01L24/45 , H01L24/48 , H01L2224/32245 , H01L2224/45144 , H01L2224/48095 , H01L2224/48247 , H01L2224/48257 , H01L2224/48465 , H01L2224/73265 , H01L2924/01013 , H01L2924/01014 , H01L2924/01028 , H01L2924/01029 , H01L2924/01078 , H01L2924/01079 , H01L2924/14 , H01L2924/1433 , H01L2924/181 , H01L2924/19041 , H01L2924/00014 , H01L2924/00012 , H01L2924/00
摘要： A method of forming a leadframe package, a leadframe package formed according to the method, and a system incorporating the leadframe package. The leadframe package includes: a metallization layer comprising a paddle portion and a contact portion including contact leads; a die mounted onto the paddle portion; wirebonds connected between the die and respective ones of the contact leads; an overmold encapsulating the die, the paddle portion, the contact leads and the wirebonds; and a stiffening element encapsulated in the overmold and unconnected to electrical pathways within the leadframe package.
摘要翻译：一种形成引线框封装的方法，根据该方法形成的引线框封装以及结合引线框封装的系统。引线框封装包括：金属化层，其包括桨状部分和包括接触引线的接触部分; 安装在所述桨部上的模具; 连接在管芯和相应的接触引线之间的引线; 封装模具，桨形部分，接触引线和引线键的包覆模制; 以及封装在包覆模制中且与引线框封装内的电路不连接的加强元件。

3. 发明申请

US20050285260A1 Bottom heat spreader 有权
标题翻译：底部散热器
公开(公告)号：US20050285260A1
公开(公告)日：2005-12-29
申请号：US10877586
申请日：2004-06-25
申请人： Dale Hackitt , Robert Nickerson , Brian Taggart
发明人： Dale Hackitt , Robert Nickerson , Brian Taggart
IPC分类号： H01L23/34 , H01L23/367 , H01L23/433 , H01L25/065
CPC分类号： H01L25/0657 , H01L23/367 , H01L23/4334 , H01L24/48 , H01L2224/32145 , H01L2224/48091 , H01L2224/48145 , H01L2224/48227 , H01L2225/06589 , H01L2924/00014 , H01L2924/01078 , H01L2924/10253 , H01L2924/15311 , H01L2924/181 , H01L2924/00 , H01L2924/00012 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： Embodiments of the invention provide a microelectronic device having a heat spreader positioned between a chip and substrate to which the chip is electrically connected. For one embodiment of the invention, the heat spreader is a thermal slug having a coefficient of thermal expansion approximately equal to the coefficient of thermal expansion of the chip.
摘要翻译：本发明的实施例提供了一种微电子器件，其具有位于芯片与芯片电连接的芯片和衬底之间的散热器。对于本发明的一个实施例，散热器是具有近似等于芯片的热膨胀系数的热膨胀系数的热塞。

4. 发明授权

US07190068B2 Bottom heat spreader 有权
标题翻译：底部散热器
公开(公告)号：US07190068B2
公开(公告)日：2007-03-13
申请号：US10877586
申请日：2004-06-25
申请人： Dale Hackitt , Robert Nickerson , Brian Taggart
发明人： Dale Hackitt , Robert Nickerson , Brian Taggart
IPC分类号： H01L23/10 , H01L23/34 , H01L21/50
CPC分类号： H01L25/0657 , H01L23/367 , H01L23/4334 , H01L24/48 , H01L2224/32145 , H01L2224/48091 , H01L2224/48145 , H01L2224/48227 , H01L2225/06589 , H01L2924/00014 , H01L2924/01078 , H01L2924/10253 , H01L2924/15311 , H01L2924/181 , H01L2924/00 , H01L2924/00012 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： Embodiments of the invention provide a microelectronic device having a heat spreader positioned between a chip and substrate to which the chip is electrically connected. For one embodiment of the invention, the heat spreader is a thermal slug having a coefficient of thermal expansion approximately equal to the coefficient of thermal expansion of the chip.
摘要翻译：本发明的实施例提供了一种微电子器件，其具有位于芯片与芯片电连接的芯片和衬底之间的散热器。对于本发明的一个实施例，散热器是具有近似等于芯片的热膨胀系数的热膨胀系数的热塞。

5. 发明申请

US20060001180A1 In-line wire bonding on a package, and method of assembling same 审中-公开
标题翻译：封装上的线内引线接合及其组装方法
公开(公告)号：US20060001180A1
公开(公告)日：2006-01-05
申请号：US10882998
申请日：2004-06-30
申请人： Brian Taggart , Robert Nickerson , Ronald Spreitzer
发明人： Brian Taggart , Robert Nickerson , Ronald Spreitzer
IPC分类号： H01L23/48 , H01L21/44
CPC分类号： H01L24/85 , H01L23/49816 , H01L23/49838 , H01L23/5386 , H01L24/45 , H01L24/48 , H01L24/49 , H01L2224/05554 , H01L2224/45124 , H01L2224/45139 , H01L2224/45144 , H01L2224/4554 , H01L2224/45644 , H01L2224/45669 , H01L2224/48091 , H01L2224/48227 , H01L2224/48464 , H01L2224/48482 , H01L2224/49052 , H01L2224/49175 , H01L2224/49431 , H01L2224/49433 , H01L2224/85051 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01014 , H01L2924/01027 , H01L2924/01028 , H01L2924/0103 , H01L2924/01033 , H01L2924/01045 , H01L2924/01046 , H01L2924/01047 , H01L2924/01077 , H01L2924/01078 , H01L2924/01079 , H01L2924/014 , H01L2924/12041 , H01L2924/14 , H01L2924/1433 , H01L2924/15311 , H01L2224/78 , H01L2924/00
摘要： A wire-bonding substrate includes in-line wire bonds that are substantially of the same pitch on the die bond pads as on the substrate bond pads. A wire-bonding substrate also includes staggered bond pads on at least one of the die and the substrate. A substrate bond pad includes a first wire-bond pad and a first via that is disposed directly below the first wire-bond pad in the wire-bonding substrate. A package is also disclosed that includes a die that is coupled to the first wire-bonding pad. A computing system is also disclosed that includes the in-line wire-bonding configuration.
摘要翻译：引线键合衬底包括在衬底接合焊盘上的芯片接合焊盘上基本上具有相同间距的在线引线键合。引线键合衬底还包括在芯片和衬底中的至少一个上的交错键合焊盘。衬底接合焊盘包括第一引线接合焊盘和直接设置在引线接合衬底中的第一引线接合焊盘下方的第一通孔。还公开了包括耦合到第一引线接合焊盘的管芯的封装。还公开了包括在线引线结构配置的计算系统。

6. 发明授权

US07780058B2 Braided solder 有权
标题翻译：编织焊锡
公开(公告)号：US07780058B2
公开(公告)日：2010-08-24
申请号：US12038809
申请日：2008-02-27
申请人： Siuyoung Yao , Brian Taggart
发明人： Siuyoung Yao , Brian Taggart
IPC分类号： B23K35/14 , B23K31/02
CPC分类号： B23K1/00 , B23K3/063 , B23K35/0227 , B23K35/262 , B23K35/3006 , B23K35/362 , B23K35/365 , Y10T428/12222
摘要： Improved solder and soldering methods are disclosed. In accordance with one technique, a solder having a plurality of individual wire strands braided together is used. In accordance with another technique, the braided solder comprises both the same solder composition and wire gauge in the individual solder wire strands. In accordance with another technique, the braided solder comprises at least two different solder compositions used in the individual solder wire strands. In accordance with another technique, the braided solder comprises at least two different wire gauges used in the individual solder wire strands. In accordance with another technique, the braided solder comprises at least one wire strand where the primary surface is coated with a thin layer of a noble metal. In accordance with another technique, the braided solder comprises at least one wire strand where flux material is present. In accordance with one soldering technique, a method of soldering is accomplished by melting a plurality of braided solder strands to join a plurality of metallic surfaces together.
摘要翻译：公开了改进的焊料和焊接方法。根据一种技术，使用具有编织在一起的多个单独的线股的焊料。根据另一种技术，编织焊料包括单个焊丝股线中相同的焊料组成和线规。根据另一种技术，编织焊料包括用于各个焊丝线中的至少两种不同的焊料组合物。根据另一技术，编织焊料包括在单独的焊丝股线中使用的至少两种不同的线规。根据另一种技术，编织焊料包括至少一根线股，其中主表面涂覆有贵金属的薄层。根据另一种技术，编织焊料包括至少一根线束，其中存在焊剂材料。根据一种焊接技术，焊接方法是通过熔化多个编织的焊料线来将多个金属表面结合在一起来实现的。

7. 发明申请

US20060123096A1 Method and Apparatus for Remote Site Access of a Multi-Core Processor Computing System 审中-公开
标题翻译：用于多核处理器计算系统的远程站点访问的方法和装置
公开(公告)号：US20060123096A1
公开(公告)日：2006-06-08
申请号：US10904672
申请日：2004-11-22
申请人： Brian Taggart
发明人： Brian Taggart
IPC分类号： G06F15/16
CPC分类号： H04L67/08 , H04L67/04 , H04L67/322 , H04L69/329
摘要： A multi-core processor computer system is described. The computer system includes a wireless communicator that enables access from at least one remote access site comprised of hardware equipped with a wireless communicator. This remote access site may not include a processor as part of the hardware. This remote hardware can access the capabilities of the multi-core processor computer and the computing system via wireless communicators and can allocate a dedicated core within the multi-core processor to the remote user, thereby enabling parallel, independent access to the computing system that can be shared by at least one additional user. The number of remote users can be correlated to the number of cores residing in the multi-core processor computing system. A process of wireless communication between the remote access sites and the computing system to enable independent computing processing capability is also described.
摘要翻译：描述了一种多核处理器计算机系统。计算机系统包括无线通信器，其能够从至少一个由配备有无线通信器的硬件组成的远程接入站点进行访问。该远程访问站点可能不包括处理器作为硬件的一部分。该远程硬件可以经由无线通信器访问多核处理器计算机和计算系统的能力，并且可以将多核处理器内的专用核心分配给远程用户，从而实现对计算系统的并行独立访问，由至少一个额外的用户共享。远程用户的数量可以与驻留在多核处理器计算系统中的核心数量相关联。还描述了远程访问站点和计算系统之间的无线通信过程以实现独立的计算处理能力。

8. 发明授权

US07818878B2 Integrated circuit device mounting with folded substrate and interposer 有权
标题翻译：集成电路器件安装与折叠的基板和插入
公开(公告)号：US07818878B2
公开(公告)日：2010-10-26
申请号：US12042222
申请日：2008-03-04
申请人： Robert M. Nickerson , Ronald L. Spreitzer , John C. Conner , Brian Taggart
发明人： Robert M. Nickerson , Ronald L. Spreitzer , John C. Conner , Brian Taggart
IPC分类号： H05K3/30
CPC分类号： H01L23/5387 , H01L24/48 , H01L24/73 , H01L25/105 , H01L2224/16225 , H01L2224/32145 , H01L2224/32225 , H01L2224/48091 , H01L2224/48227 , H01L2224/73257 , H01L2224/73265 , H01L2225/0651 , H01L2225/06527 , H01L2225/06541 , H01L2225/06555 , H01L2225/06579 , H01L2225/06586 , H01L2225/1023 , H01L2225/1041 , H01L2225/1058 , H01L2924/00011 , H01L2924/00014 , H01L2924/01005 , H01L2924/01013 , H01L2924/01029 , H01L2924/01033 , H01L2924/01079 , H01L2924/01087 , H01L2924/14 , H01L2924/15311 , H01L2924/181 , H05K1/141 , H05K1/147 , H05K1/189 , H05K7/1061 , H05K2201/056 , H05K2201/10378 , H05K2201/10734 , Y10T29/49128 , Y10T29/4913 , Y10T29/49135 , Y10T29/49144 , Y10T29/49146 , H01L2924/00 , H01L2924/00012 , H01L2224/0401 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： In one embodiment, a package-to-package stack is assembled comprising a first integrated circuit package, and a second integrated circuit package which are mechanically and electrically connected using an interposer and a substrate folded around the interposer. Other embodiments are described and claimed.
摘要翻译：在一个实施例中，组装包装堆叠包括第一集成电路封装和第二集成电路封装，所述第一集成电路封装使用中介层和围绕插入件折叠的衬底机械地和电连接。描述和要求保护其他实施例。

9. 发明申请

US20090212091A1 Braided Solder 有权
标题翻译：编织焊
公开(公告)号：US20090212091A1
公开(公告)日：2009-08-27
申请号：US12038809
申请日：2008-02-27
申请人： Siuyoung Yao , Brian Taggart
发明人： Siuyoung Yao , Brian Taggart
IPC分类号： B23K1/00 , B23K35/02
CPC分类号： B23K1/00 , B23K3/063 , B23K35/0227 , B23K35/262 , B23K35/3006 , B23K35/362 , B23K35/365 , Y10T428/12222
摘要： Improved solder and soldering methods are disclosed. In accordance with one technique, a solder having a plurality of individual wire strands braided together is used. In accordance with another technique, the braided solder comprises both the same solder composition and wire gauge in the individual solder wire strands. In accordance with another technique, the braided solder comprises at least two different solder compositions used in the individual solder wire strands. In accordance with another technique, the braided solder comprises at least two different wire gauges used in the individual solder wire strands. In accordance with another technique, the braided solder comprises at least one wire strand where the primary surface is coated with a thin layer of a noble metal. In accordance with another technique, the braided solder comprises at least one wire strand where flux material is present. In accordance with one soldering technique, a method of soldering is accomplished by melting a plurality of braided solder strands to join a plurality of metallic surfaces together.
摘要翻译：公开了改进的焊料和焊接方法。根据一种技术，使用具有编织在一起的多个单独的线股的焊料。根据另一种技术，编织焊料包括单个焊丝股线中相同的焊料组成和线规。根据另一种技术，编织焊料包括用于各个焊丝线中的至少两种不同的焊料组合物。根据另一技术，编织焊料包括在单独的焊丝股线中使用的至少两种不同的线规。根据另一种技术，编织焊料包括至少一根线股，其中主表面涂覆有贵金属的薄层。根据另一种技术，编织焊料包括至少一根线束，其中存在焊剂材料。根据一种焊接技术，焊接方法是通过熔化多个编织的焊料线来将多个金属表面结合在一起来实现的。

10. 发明申请

US20080023820A1 BOND FINGER ON VIA SUBSTRATE, PROCESS OF MAKING SAME, PACKAGE MADE THEREBY, AND METHOD OF ASSEMBLING SAME 审中-公开
标题翻译：通过基材的粘合剂手指，其制造方法，其包装及其组装方法
公开(公告)号：US20080023820A1
公开(公告)日：2008-01-31
申请号：US11866239
申请日：2007-10-02
申请人： Brian Taggart , Ronald Apreitzer , Robert Nickerson
发明人： Brian Taggart , Ronald Apreitzer , Robert Nickerson
IPC分类号： H01L23/04 , H05K1/11
CPC分类号： H05K1/111 , H01L23/49816 , H01L23/49827 , H01L23/49838 , H01L24/45 , H01L24/48 , H01L24/49 , H01L2224/05554 , H01L2224/45144 , H01L2224/48091 , H01L2224/48227 , H01L2224/48235 , H01L2224/49052 , H01L2224/49175 , H01L2224/49433 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01027 , H01L2924/01028 , H01L2924/0103 , H01L2924/01045 , H01L2924/01047 , H01L2924/01077 , H01L2924/01078 , H01L2924/01079 , H01L2924/014 , H01L2924/10162 , H01L2924/12041 , H01L2924/12042 , H01L2924/14 , H01L2924/1433 , H01L2924/15311 , H05K2201/096 , H05K2203/049 , Y02P70/611 , Y10T29/49156 , Y10T29/49162 , Y10T29/49165 , H01L2924/00014 , H01L2924/00
摘要： A wire-bonding substrate is disclosed. The wire-bonding substrate includes a first wire-bond pad and a first via that is disposed directly below the first wire-bond pad in the in the wire-bonding substrate. A package is also disclosed that includes a die that is coupled to the first wire-bonding pad. The package can include a larger substrate that is coupled to the wire-bonding substrate through an electrical connection such as a solder ball. A process of forming the wire-bonding substrate is also disclosed. The process includes via formation to stop on the wire-bond pad. A method of assembling a microelectronic package is also disclosed that includes coupling the die to the wire-bond pad. A computing system is also disclosed that includes the wire-bonding substrate.
摘要翻译：公开了引线键合衬底。引线键合衬底包括第一引线接合焊盘和布置在引线接合衬底中的第一引线接合焊盘正下方的第一通孔。还公开了包括耦合到第一引线接合焊盘的管芯的封装。封装可以包括通过诸如焊球之类的电连接而与引线键合衬底耦合的较大衬底。还公开了形成引线接合基板的工艺。该过程包括通孔形成以在接线焊盘上停止。还公开了组装微电子封装的方法，其包括将管芯耦合到引线接合焊盘。还公开了一种包括引线接合衬底的计算系统。

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