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    • 1. 发明授权
    • Non-destructive measuring sensor for semiconductor wafer and method of
manufacturing the same
    • 用于半导体晶片的非破坏性测量传感器及其制造方法
    • US5554939A
    • 1996-09-10
    • US171026
    • 1993-12-21
    • Sadao HiraeHideaki MatsubaraMotohiro KounoTakamasa Sakai
    • Sadao HiraeHideaki MatsubaraMotohiro KounoTakamasa Sakai
    • G01B11/14G01N27/00G01R1/07G01R27/26G01R31/302H01L21/66G01R31/308
    • G01R1/071
    • The present invention provides a novel sensor preferably used for non-destructive measurement of the electrical characteristics of semiconductors. The sensor is easily manufactured and has a sufficiently high dielectric breakdown strength. The sensor includes an electrode mount 64 having a an electrode pattern 200 formed on a bottom surface 66a of a cone glass 66. The bottom surface 66a has a reflecting plane 66c for reflecting a laser beam, a test electrode 201, and three parallelism adjustor electrodes 111 through 113 formed around the reflecting plane 66c. The bottom surface 66a also has a guard ring 120 disposed between the test electrode 201 and the parallelism adjustor electrodes 111 through 113. An insulating film 68 covers a lower surface of the cone glass 66. Wiring formed on a inclined face 66b of the cone glass 66 is connected to external lead wires at the upper end of the wiring. Since the cone glass 66 has two flat surfaces parallel to each other, the electrode pattern 200 is easily formed on the bottom surface 66a by photo lithography. The insulating film 68 effectively works to improve the dielectric breakdown strength.
    • 本发明提供了一种新型的传感器,优选用于半导体的电气特性的非破坏性测量。 该传感器容易制造并且具有足够高的绝缘击穿强度。 传感器包括具有形成在锥形玻璃66的底面66a上的电极图案200的电极座64.底面66a具有用于反射激光束的反射面66c,测试电极201和三个平行调节电极 111至113围绕反射平面66c形成。 底表面66a还具有设置在测试电极201和平行度调节器电极111至113之间的保护环120.绝缘膜68覆盖锥形玻璃66的下表面。在锥形玻璃的倾斜面66b上形成的接线 66连接到布线上端的外部引线。 由于锥形玻璃66具有彼此平行的两个平坦表面,所以通过光刻法容易地在底表面66a上形成电极图案200。 绝缘膜68有效地改善介电击穿强度。
    • 4. 发明授权
    • Optical gap measuring device using frustrated internal reflection
    • 光学间隙测量装置使用沮丧的内部反射
    • US5239183A
    • 1993-08-24
    • US869816
    • 1992-04-16
    • Motohiro KounoIkuyoshi NakataniTakamasa SakaiSadao Hirae
    • Motohiro KounoIkuyoshi NakataniTakamasa SakaiSadao Hirae
    • G01B11/02G01B11/14G01S17/46
    • G01S17/46G01B11/026G01B11/14
    • The invention provides a device which utilizes the tunnel effect occuring upon a condition of geometric total reflection, for measuring a narrow gap and surface unevenness of a specimen with high precision. An optical device 40 includes a semi-conductor laser 42, a photodiode 43, and a waveguide layer 44 is formed on a semi-conductor substrate 41 by epitaxial growth. A reflecting surface 44b of the waveguide layer 44 is parallel to the plane of the semi-conductor substrate. A laser beam emitted from the semi-conductor laser is reflected from the reflecting surface 44b under a condition of total reflection in geometrical optics. When the gap between the reflecting surface and the specimen is less than or equal to about the wavelength of the laser beam, part of the laser beam is transmitted into the specimen. The intensity of the transmitted light, which is calculated corresponding to the intensity of the reflected light, depends on the dimension of the gap. In the practice of the invention, the relationship between the transmittance and the dimension of the gap is previously obtained, and the dimension of the gap is determined corresponding to the transmittance measured. A narrow gap and the surface unevenness are accurately and precisely measured.
    • 本发明提供了一种利用在几何全反射条件下发生的隧道效应的装置,用于以高精度测量样品的窄间隙和表面不均匀性。 光学器件40包括半导体激光器42,光电二极管43,并且通过外延生长在半导体衬底41上形成波导层44。 波导层44的反射面44b平行于半导体基板的平面。 从半导体激光器发射的激光束在几何光学中的全反射条件下从反射表面44b反射。 当反射面与试样之间的间隙小于或等于激光束的波长时,激光束的一部分被传送到试样中。 对应于反射光强度计算的透射光的强度取决于间隙的尺寸。 在本发明的实践中,预先获得间隙的透射率和尺寸之间的关系,并且根据测量的透射率确定间隙的尺寸。 准确而精确地测量窄间隙和表面凹凸。
    • 10. 发明授权
    • Heat processing apparatus for semiconductor manufacturing
    • 半导体制造用热处理装置
    • US4803948A
    • 1989-02-14
    • US36803
    • 1987-04-10
    • Keiji NakagawaIkuyoshi NakataniTakamasa SakaiYusuke Muraoka
    • Keiji NakagawaIkuyoshi NakataniTakamasa SakaiYusuke Muraoka
    • H01L21/205C23C16/44H01L21/00H01L21/22H01L21/31C23C16/00
    • C23C16/4409C23C16/4401H01L21/67109
    • A heat processing apparatus for manufacturing semiconductors is constructed such that an airtightly sealing part is provided at the tubular end having equal diameter to that of a main body of the apparatus, a ring shaped packing is wound on the outer circumference of a cylindrical tube adjacent to the end to be pressed between a pair of ring bodies which are formed with tapered edges of opposite inner sides, an inner tube having an equal diameter to that of the tube is connected with the end of the cylindrical tube through a cushioning material, on the outer circumference of the inner tube an outer tube is constructed integrally with one of the ring bodies, opening ends of both the inner and the outer tubes are adapted to be closed with a lid, and to the outer tube there are provided an exhausting tube for exhausting gas in the cylindrical tube and a gas introducing tube which interrupts an open air from the cylindrical tube with the flow of inert gas which flows when the lid is opened, and exhausting holes which connect with the exhausting tube and a plurality lines of gas holes for forming "gas curtain" are provided to the inner tube.
    • 构造半导体制造用热处理装置的结构是,在筒状端部设置气密密封部件,其直径与设备主体直径相等,环形填料卷绕在圆筒管的外圆周上 被压在形成有相对内侧的锥形边缘的一对环体之间的端部,具有与管的直径相等的直径的内管通过缓冲材料与圆柱形管的端部连接, 内管的外周,外管与其中一个环体一体地构成,内管和外管两端的开口端适于用盖封闭,并且在外管上设有用于 在圆筒管中排出气体,以及气体导入管,其在盖打开时中断来自圆筒管的开放空气与惰性气体流动 并且,在内管上设置有与排气管连接的排气孔和用于形成“气帘”的多排气孔。