会员体验
专利管家(专利管理)
工作空间(专利管理)
风险监控(情报监控)
数据分析(专利分析)
侵权分析(诉讼无效)
联系我们
交流群
官方交流:
QQ群: 891211   
微信请扫码    >>>
现在联系顾问~
热词
    • 1. 发明授权
    • Microwave plasma processing method and apparatus
    • 微波等离子体处理方法及装置
    • US5804033A
    • 1998-09-08
    • US29241
    • 1993-03-10
    • Saburo KanaiYoshinao KawasakiKazuaki IchihashiSeiichi WatanabeMakoto NawataMuneo FuruseTetsunori Kaji
    • Saburo KanaiYoshinao KawasakiKazuaki IchihashiSeiichi WatanabeMakoto NawataMuneo FuruseTetsunori Kaji
    • H01L21/205H01L21/302H01L21/31
    • H01J37/32229H01J37/32238H01J37/32266
    • The present invention relates to a microwave plasma processing method and apparatus. According to the present invention, the microwaves are introduced into the electric discharge means in correspondence with only the traveling direction thereof, whereby uniformity in a plasma density distribution corresponding to the surface to-be-processed of the sample can be sharply enhanced, so that the sample processed by utilizing such plasma can attain an enhanced processing homogeneity within the surface to be processed. In addition, homogeneity and stability of the plasma are improved by inserting a cavity resonator between the microwave generator and plasma processing (plasma generating) chamber, and coupling the cavity resonator and plasma processing chamber such that microwaves substantially only of a desired mode (e.g., TE.sub.11) pass into the plasma processing chamber. Such coupling to provide microwaves substantially only of circular TE.sub.11 mode can be achieved by providing the coupling such that a ratio of diameter of the discharge block, where the plasma is generated, to the diameter of the cavity resonator, is 0.345.
    • 本发明涉及一种微波等离子体处理方法和装置。 根据本发明,微波仅与其行进方向相对应地被引入到放电装置中,从而可以显着提高对应于样品待处理表面的等离子体密度分布的均匀性,使得 通过利用这种等离子体处理的样品可以在被处理表面内获得增强的处理均匀性。 此外,通过在微波发生器和等离子体处理(等离子体产生)室之间插入空腔谐振器,并耦合空腔谐振器和等离子体处理室,使得微波基本上仅仅是期望的模式(例如, TE11)进入等离子体处理室。 通过提供耦合使得产生等离子体的放电块的直径与腔谐振器的直径的比率为0.345,可以实现基本上仅提供圆形TE11模式的微波的这种耦合。
    • 2. 发明授权
    • Microwave plasma processing method and apparatus
    • 微波等离子体处理方法及装置
    • US5914051A
    • 1999-06-22
    • US443438
    • 1995-05-18
    • Saburo KanaiYoshinao KawasakiKazuaki IchihashiSeiichi WatanabeMakoto Nawata
    • Saburo KanaiYoshinao KawasakiKazuaki IchihashiSeiichi WatanabeMakoto Nawata
    • H01J37/32H01L21/302B65D6/34C23F1/02
    • H01J37/32229H01J37/32192H01J37/32238H01J37/32266
    • A microwave plasma processing method and apparatus of the type wherein a waveguide section includes electric discharge means isolated from a waveguide for the propagation of microwaves and having a plasma generation region therein, which method and apparatus are well suited for subjecting samples, such as semiconductor device substrates, to an etching process, a film forming process, etc. The microwaves are introduced into the electric discharge means in correspondence with only the traveling direction thereof, whereby uniformity in a plasma density distribution corresponding to the surface to-be-processed of the sample can be sharply enhanced, so that the sample processed by utilizing such plasma can attain an enhanced processing homogeneity within the surface to-be-processed. The temperature of the electric discharge block is controlled to decrease an amount of plasma polymers deposited on the electric discharge block, increase an amount existing in the plasma and increase an amount deposited on the sample to improve a selection ratio.
    • 一种微波等离子体处理方法和装置,其中波导部分包括从波导隔离用于微波传播并在其中具有等离子体产生区域的放电装置,该方法和装置非常适合于对诸如半导体装置 基板,蚀刻工艺,成膜工艺等。微波仅与其行进方向相对应地被引入放电装置,由此等离子体密度分布的均匀性对应于待处理的表面 样品可以急剧增强,使得通过利用这种等离子体处理的样品可以在待处理的表面内获得增强的处理均匀性。 控制放电块的温度以减少沉积在放电块上的等离子聚合物的量,增加存在于等离子体中的量并增加沉积在样品上的量以提高选择比。
    • 3. 发明授权
    • Microwave plasma processing method and apparatus
    • 微波等离子体处理方法及装置
    • US5785807A
    • 1998-07-28
    • US765834
    • 1991-09-26
    • Saburo KanaiYoshinao KawasakiKazuaki IchihashiSeiichi WatanabeMakoto Nawata
    • Saburo KanaiYoshinao KawasakiKazuaki IchihashiSeiichi WatanabeMakoto Nawata
    • H01J37/32H01L21/302
    • H01J37/32229H01J37/32192H01J37/32238H01J37/32266
    • The present invention relates to a microwave plasma processing method and apparatus. More particularly, it relates to a microwave plasma processing method and apparatus of the type wherein a waveguide section includes electric discharge means isolated from a waveguide for the propagation of microwaves and having a plasma generation region therein, which method and apparatus are well suited for subjecting samples, such as semiconductor device substrates, to an etching process, a film forming process, etc. According to the present invention, the microwaves are introduced into the electric discharge means in correspondence with only the traveling direction thereof, whereby uniformity in a plasma density distribution corresponding to the surface to-be-processed of the sample can be sharply enhanced, so that the sample processed by utilizing such plasma can attain an enhanced processing homogeneity within the surface to-be-processed.
    • 本发明涉及一种微波等离子体处理方法和装置。 更具体地说,本发明涉及一种微波等离子体处理方法和装置,其中波导部分包括从波导隔离用于微波传播并在其中具有等离子体产生区域的放电装置,该方法和装置非常适合于 样品,例如半导体器件衬底,蚀刻工艺,成膜工艺等。根据本发明,微波仅与其行进方向相对应地被引入放电装置,从而使等离子体密度 可以大大提高与样品表面对应的分布,使得利用这种等离子体处理的样品能够在待处理的表面内获得增强的加工均匀性。