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    • 1. 发明申请
    • SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE REGARDING THE DETECTION OF DEGRADATION
    • 关于降解检测的半导体集成电路设备
    • US20160226493A1
    • 2016-08-04
    • US15040817
    • 2016-02-10
    • SK hynix Inc.
    • Jeong Tae HWANGJin Youp CHAYoung Sik HEO
    • H03K19/0185G01R31/28H03K17/687
    • H03K19/018521G01R31/2856H03K17/102
    • A semiconductor integrated circuit device may include a target PMOS transistor, a target NMOS transistor, a first stress-applying circuit, a second stress-applying circuit, a third stress-applying circuit and a fourth stress-applying circuit. An inverter may include the target PMOS transistor and the NMOS transistor. The first stress-applying circuit may be configured to apply a first DC level to a gate of the target PMOS transistor. The second stress-applying circuit may be configured to apply a second DC level to a gate of the target NMOS transistor. The third stress-applying circuit may be configured to apply an AC voltage shape to the gate of the target NMOS transistor. The fourth stress-applying circuit may be configured to apply the AC voltage to a drain of the target NMOS transistor.
    • 半导体集成电路器件可以包括目标PMOS晶体管,目标NMOS晶体管,第一应力施加电路,第二应力施加电路,第三应力施加电路和第四应力施加电路。 反相器可以包括目标PMOS晶体管和NMOS晶体管。 第一应力施加电路可以被配置为将第一DC电平施加到目标PMOS晶体管的栅极。 第二应力施加电路可以被配置为将第二DC电平施加到目标NMOS晶体管的栅极。 第三应力施加电路可以被配置为向目标NMOS晶体管的栅极施加AC电压形状。 第四应力施加电路可以被配置为将AC电压施加到目标NMOS晶体管的漏极。
    • 4. 发明申请
    • SEMICONDUCTOR DEVICES AND SEMICONDUCTOR SYSTEMS INCLUDING THE SAME
    • 半导体器件和半导体系统,包括它们
    • US20140298071A1
    • 2014-10-02
    • US14041563
    • 2013-09-30
    • SK hynix Inc.
    • Jeong Tae HWANG
    • G06F1/12
    • G06F1/12G11C5/147G11C7/22G11C16/10
    • A semiconductor device including an internal command generator and a bias generator is provided. The internal command generator generates first to fourth internal command signals sequentially enabled in synchronization with pulses of an external program signal. The first internal command signal controls a read operation for reading out data stored in memory cells, and the second and third internal command signals control a program operation for programming the memory cells. The bias generator generates a read bias signal for controlling a level of an output voltage signal, which is applied to an internal circuit, in response to the first and fourth internal command signals.
    • 提供了包括内部命令发生器和偏置发生器的半导体器件。 内部命令发生器产生与外部程序信号的脉冲同步地顺序使能的第一至第四内部命令信号。 第一内部命令信号控制用于读出存储在存储单元中的数据的读取操作,第二和第三内部命令信号控制用于编程存储器单元的程序操作。 偏置发生器响应于第一和第四内部命令信号产生用于控制施加到内部电路的输出电压信号的电平的读偏置信号。