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1. 发明申请

US20170190019A1 AUTOMATIC HANDLING APPARATUS 有权
公开(公告)号：US20170190019A1
公开(公告)日：2017-07-06
申请号：US15314982
申请日：2015-05-13
申请人： SHIN-ETSU HANDOTAI CO., LTD.
发明人： Taichi YASUDA , Tatsuo ENOMOTO
IPC分类号： B24B37/27 , H01L21/683 , B25J15/06 , H01L21/68 , H01L21/02
CPC分类号： B24B37/27 , B24B37/28 , B24B41/005 , B25J9/042 , B25J9/102 , B25J15/0616 , H01L21/02 , H01L21/68 , H01L21/6838
摘要： Automatic handling apparatus having a suction-head sucking and holding a workpiece, an arm is connected to and moves the suction-head, and a stage on which the workpiece to be carried to the carrier holding hole is mounted, the suction-head has a movable section which is movable within a parallel plane to the suction-head body, the movable section to suck and hold the workpiece, and has positioning pins stretched in vertically lower direction and, at loading time, the workpiece held by the movable section into the carrier holding hole, the positioning pins are appressed against tooth-bottoms of a gear on the carrier outer periphery and movable section moving within the parallel plane. The carrier is pushed against the sun gear side to fix the carrier position and direction, and the held workpiece is carried into the holding hole. Consequently, the automatic handling apparatus load the workpiece into the carrier holding hole.

2. 发明申请

US20160332279A1 WORKPIECE PROCESSING APPARATUS AND WORKPIECE PROCESSING METHOD 审中-公开
标题翻译：工件加工设备和工件加工方法
公开(公告)号：US20160332279A1
公开(公告)日：2016-11-17
申请号：US15109954
申请日：2015-01-16
申请人： SHIN-ETSU HANDOTAI CO., LTD.
发明人： Taichi YASUDA , Tatsuo ENOMOTO
IPC分类号： B24B37/04
CPC分类号： B24B37/042 , B24B37/08 , B24B49/16
摘要： A workpiece processing apparatus including a control unit that is provided with a storage medium on which a polishing load measured when an upper turn table is moved downward to a fixed position in a state wherein the workpiece is properly held in holding hole of the carrier is recorded in advance, calculates a difference between a polishing load measured when upper turn table is moved downward to the fixed position in a state wherein the workpiece is held in holding hole of the carrier and the polishing load recorded on the storage medium, and judges the occurrence of abnormal holding of the workpiece if the calculated difference exceeds a threshold value. As a result, it becomes possible to detect abnormal holding of a workpiece in a short time with a high degree of precision before the workpiece is processed and prevent breakages of the workpiece and the processing apparatus.
摘要翻译：一种工件处理装置，包括控制单元，该控制单元设置有存储介质，在其中工件被适当地保持在承载件的保持孔中的状态下，当上部转台向下移动到固定位置时测量的研磨载荷被记录预先计算在将工件保持在承载件的保持孔中的状态下将上部转台向下移动到固定位置的研磨载荷与记录在存储介质上的研磨负荷之间的差异，并判断出现的情况如果计算的差异超过阈值，则工件的异常保持。结果，可以在加工工件之前以高精度在短时间内检测工件的异常保持，并且防止工件和处理装置的断裂。

3. 发明申请

US20180264618A1 METHOD FOR CONDITIONING POLISHING PAD AND POLISHING APPARATUS 审中-公开
公开(公告)号：US20180264618A1
公开(公告)日：2018-09-20
申请号：US15760590
申请日：2016-08-31
申请人： SHIN-ETSU HANDOTAI CO., LTD.
发明人： Taichi YASUDA , Masanao SASAKI , Tatsuo ENOMOTO , Takuya SASAKI , Kazumasa ASAI
IPC分类号： B24B37/005 , B24B53/017 , B24B53/12 , H01L21/67
CPC分类号： B24B37/005 , B24B37/00 , B24B37/08 , B24B37/107 , B24B53/00 , B24B53/017 , B24B53/12 , H01L21/67092
摘要： A method for conditioning a polishing pad, which is configured to polish a wafer and attached to a rotatable discoid turntable, by using a conditioning head, the method being characterized by: moving the conditioning head in a radial direction of the turntable to perform the conditioning while rotating the polishing pad attached to the turntable by rotation of the turntable; and controlling a rotational speed of the turntable and a moving speed of the conditioning head in the radial direction of the turntable in correspondence with a distance of the conditioning head from a center of the turntable. Consequently, the method for conditioning a polishing pad which enables appropriately conditioning an entire polishing surface of the polishing pad can be provided.

4. 发明申请

US20170069523A1 WORKPIECE HOLDING APPARATUS 有权
标题翻译：工作控制装置
公开(公告)号：US20170069523A1
公开(公告)日：2017-03-09
申请号：US15122524
申请日：2015-02-17
申请人： SHIN-ETSU HANDOTAI CO., LTD.
发明人： Taichi YASUDA , Tatsuo ENOMOTO
IPC分类号： H01L21/683 , B25J15/06
CPC分类号： H01L21/6838 , B24B37/345 , B24B41/06 , B25J15/0658 , B25J15/0666 , B25J15/0683 , H01L21/304
摘要： A workpiece holding apparatus, including: a rigid body having a vent; a suction pad adhered onto the lower end face of rigid body and having an opening communicating with vent, being configured to suck and hold a workpiece; an air controlling mechanism communicating with the vent, being configured to aspirate or discharge air through vent to aspirate or discharge air from opening; and a swelling portion being configured to be supplied with air by air controlling mechanism through the vent to swell out at least part of an area of suction pad to be in contact with the workpiece toward the workpiece in detaching workpiece from suction pad; wherein suction pad is configured to suck and hold workpiece by bringing the opening into contact with workpiece while aspirating air by air controlling mechanism through opening, and is configured to detach the workpiece from suction pad by discharging air from opening.
摘要翻译：一种工件保持装置，包括：具有通风口的刚体; 吸附垫粘附到刚体的下端面上，并且具有与排气口连通的开口，被构造成吸附和保持工件; 与排气口连通的空气控制机构，其构造成通过排气口吸入或排出空气，以从开口抽吸或排出空气; 以及膨胀部，其通过所述排气口由空气控制机构供给空气，以使从所述工件脱离吸附垫而将与所述工件接触的吸附区域的至少一部分区域向所述工件膨胀; 其特征在于，所述吸盘构成为通过使所述开口与工件接触而吸引和保持工件，同时通过打开通过空气控制机构吸入空气，并且通过从开口排出空气来将工件从吸盘上分离。

5. 发明申请

US20180117729A1 WORKPIECE PROCESSING APPARATUS 审中-公开
公开(公告)号：US20180117729A1
公开(公告)日：2018-05-03
申请号：US15572747
申请日：2016-03-25
申请人： SHIN-ETSU HANDOTAI CO., LTD.
发明人： Taichi YASUDA , Masanao SASAKI
IPC分类号： B24B37/08 , B24B37/28 , H01L21/304
CPC分类号： B24B37/08 , B24B37/28 , B24B49/00 , B24B53/017 , H01L21/304
摘要： A workpiece processing apparatus including: a center drum that is rotatable around a rotation axis and has at least one first groove formed in the axial direction on the peripheral surface, a carrier having a holding hole to insert and hold a workpiece to be processed, an upper and lower turn table that are rotatable around the rotation axis in a state wherein the carrier holding workpiece is interposed, at least one hook fitted in the upper turn table's internal circumference, with the tip being inserted into the first groove and movable along first groove; wherein the center drum has at least one second groove formed in the axial direction on peripheral surface, and second groove has a length different from that of the first groove and has a supporting surface to support the hook from below at a position above a position where upper turn table processes the workpiece.

6. 发明申请

US20170312878A1 MACHINING APPARATUS FOR WORKPIECE 审中-公开
公开(公告)号：US20170312878A1
公开(公告)日：2017-11-02
申请号：US15523817
申请日：2015-10-21
申请人： SHIN-ETSU HANDOTAI CO., LTD.
发明人： Taichi YASUDA , Tatsuo ENOMOTO
IPC分类号： B24B37/005 , B24B37/08
CPC分类号： B24B37/005 , B24B37/08 , B24B37/34 , B24B49/10
摘要： A machining apparatus for a workpieces includes an upper turn table support mechanism supporting an upper turn table from above to be vertically movable by a cylinder extending along a rotational axis direction of the table, a horizontal plate fixed to the cylinder so that a main surface thereof becomes perpendicular to a longitudinal axis of the cylinder, at least three displacement sensors which measure horizontal plate surface height positions when the upper turn table has moved down to a fixed position, and a control apparatus to calculate a relative upper turn table height position and an angle formed between the upper turn table rotational axis and the cylinder longitudinal axis from the horizontal plate surface height positions measured by the displacement sensors. A workpiece holding abnormality can be accurately and quickly detected before machining the workpiece to avoid damage, and an cylinder eccentric angle can be detected during machining.

7. 发明申请

US20160276180A1 WAFER DRYING APPARATUS AND METHOD FOR DRYING A WAFER 审中-公开
标题翻译： WAFER干燥装置和干燥方法
公开(公告)号：US20160276180A1
公开(公告)日：2016-09-22
申请号：US15035982
申请日：2014-11-19
申请人： SHIN-ETSU HANDOTAI CO., LTD.
发明人： Taichi YASUDA , Tatsuo ENOMOTO
IPC分类号： H01L21/67
CPC分类号： H01L21/67034 , H01L22/10 , H01L22/12
摘要： A wafer drying apparatus includes air supply unit having first and second air supply tube provided at respective first and second front-surface side of wafer, and wafer holding unit configured to vertically hold wafer, and configured so that wafer relatively moves with respect to air supply unit, plurality of first air outlets separated from each other at predetermined intervals are provided at wafer side of first air supply tube, plurality of second air outlets separated from each other at predetermined intervals are provided at wafer side of second air supply tube, plurality of first and second air outlets are respectively provided to form an angle with respect to vertical direction regarding wafer as to blow air from peripheral portion to central portion with respect to central line in vertical direction of wafer. It is possible to provide wafer drying apparatus with simple structure, which reduces undried portion without degrading productivity.
摘要翻译：晶片干燥装置包括供给单元，其具有设置在晶片的相应的第一和第二前表面侧的第一和第二供气管，以及构造成垂直保持晶片的晶片保持单元，并且被配置为使晶片相对于空气供给相对移动在第一空气供应管的晶片侧设置以预定间隔彼此分离的多个第一空气出口，在第二空气供给管的晶片侧设置以预定间隔彼此分离的多个第二空气出口，第一和第二空气出口分别设置成相对于晶片的垂直方向形成相对于晶片的垂直方向的中心线从周边部分向中心部分吹送空气的角度。可以提供具有简单结构的晶片干燥装置，其可以减少未干燥部分而不降低生产率。

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