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1. 发明申请

US20140076618A1 METHOD OF FORMING GOLD THIN FILM AND PRINTED CIRCUIT BOARD 审中-公开
标题翻译：形成金薄膜和印刷电路板的方法
公开(公告)号：US20140076618A1
公开(公告)日：2014-03-20
申请号：US13692643
申请日：2012-12-03
申请人： SAMSUNG ELECTRO-MECHANICS CO., LTD. , RESEARCH & BUSINESS FOUNDATION SUNGK
发明人： Seong Min CHO , Chan Hwa CHUNG , Chang Yong AN , Chang Sup RYU , Hyo Seung NAM
IPC分类号： H05K3/18 , H05K1/09
CPC分类号： H05K3/188 , C23C18/1637 , C23C18/1651 , C23C18/1844 , C23C18/36 , C23C18/44 , C23C18/48 , C23C18/54 , H05K1/09 , H05K3/244 , H05K2201/0344 , H05K2203/073
摘要： There is provided a method of forming a gold thin film, the method including: forming a nickel plating layer on a surface of an object through electroless nickel (Ni) plating; forming a palladium-copper mixture plating layer on the nickel plating layer through electroless plating using a palladium-copper (Pd—Cu) mixture; and forming a first gold thin film by immersing the palladium-copper mixture plating layer in a gold (Au) galvanic electrolytic liquid to replace a portion of copper (Cu) particles in the palladium-copper mixture plating layer with gold particles through a replacement reaction.
摘要翻译：提供一种形成金薄膜的方法，所述方法包括：通过无电镀镍（Ni）电镀在物体的表面上形成镀镍层; 通过使用钯 - 铜（Pd-Cu）混合物的化学镀来在镍镀层上形成钯 - 铜混合物镀层; 并且通过将钯 - 铜混合物镀层浸入金（Au）电解电解液中形成第一金薄膜，以通过置换反应用金颗粒代替钯 - 铜混合物镀层中的一部分铜（Cu）颗粒。

2. 发明申请

US20140069816A1 NICKEL PLATING SOLUTION AND METHOD FOR FORMING NICKEL PLATING LAYER USING THE SAME 审中-公开
标题翻译：镍镀层解决方案和使用其形成镍镀层的方法
公开(公告)号：US20140069816A1
公开(公告)日：2014-03-13
申请号：US13831061
申请日：2013-03-14
申请人： SAMSUNG ELECTRO-MECHANICS CO., LTD.
发明人： Mi Geum KIM , Hyo Seung NAM
IPC分类号： C25D3/12 , C25D7/12
CPC分类号： C25D3/12 , C25D5/12 , C25D7/12
摘要： Disclosed herein are a nickel plating solution and a method for forming a nickel layer on an external electrode of a chip component by using the nickel plating solution, the nickel plating solution including: a nickel ion; a chloride ion; and a pH buffer, wherein the pH buffer is used by mixing an inorganic acid, and an organic acid and a salt thereof, so that the damage to a body of the chip component can be reduced by containing organic acid and a salt thereof in the nickel plating solution for forming the nickel plating layer on the external electrode of the chip component having a body formed of a material including ferrite or manganese oxide.
摘要翻译：本发明公开了一种镍电镀溶液和通过使用镍电镀液在芯片部件的外部电极上形成镍层的方法，所述镍电镀液包括：镍离子; 氯离子; 和pH缓冲剂，其中通过混合无机酸和有机酸及其盐来使用pH缓冲剂，使得通过在有机酸和其盐中含有有机酸及其盐，可以降低对芯片组分的体的损害用于在具有由铁氧体或氧化锰的材料形成的本体的芯片部件的外部电极上形成镍镀层的镍电镀液。

3. 发明申请

US20150342054A1 EMBEDDED CORELESS SUBSTRATE AND METHOD FOR MANUFACTURING THE SAME 审中-公开
标题翻译：嵌入式无缝基板及其制造方法
公开(公告)号：US20150342054A1
公开(公告)日：2015-11-26
申请号：US14667001
申请日：2015-03-24
申请人： SAMSUNG ELECTRO-MECHANICS CO., LTD.
发明人： Yong Ho BAEK , Hyo Seung NAM , Jae Ean LEE , Ju Yeon BONG , Jung Hyun CHO , Kyung Hwan KO
IPC分类号： H05K1/18 , H05K3/10 , H05K3/32 , H05K3/46 , H05K1/02 , H05K1/11
CPC分类号： H05K3/10 , H05K1/182 , H05K3/284 , H05K3/32 , H05K3/4682 , H05K2201/096 , H05K2201/10015 , Y10T29/49156
摘要： Embodiments of the invention provide an embedded coreless substrate, and a method for manufacturing the same. According to an embodiment of the present invention, an embedded coreless substrate includes an insulating layer, a conductive pattern including a plurality of circuit pattern layers formed in(on) the insulating layer and a plurality of vias for vertically connecting the circuit pattern layers, and at least one embedded device, which is partially embedded in the insulating layer and an outer circuit pattern layer among the plurality of circuit pattern layers and of which an electrode in an embedded portion is partially or entirely covered with the outer circuit pattern layer to fix the embedded portion, is provided. Further, a method for manufacturing an embedded coreless substrate is provided.
摘要翻译：本发明的实施例提供一种嵌入式无芯基板及其制造方法。根据本发明的实施例，嵌入式无芯基板包括绝缘层，包括形成在绝缘层中的多个电路图案层的导电图案和用于垂直连接电路图案层的多个通孔，以及部分嵌入绝缘层中的至少一个嵌入式装置和多个电路图案层之中的外部电路图案层，并且其中嵌入部分中的电极部分或全部被外部电路图案层覆盖以将嵌入式部分。此外，提供了一种用于制造嵌入式无芯基板的方法。

4. 发明申请

US20150129293A1 PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME 审中-公开
标题翻译：印刷电路板及其制造方法
公开(公告)号：US20150129293A1
公开(公告)日：2015-05-14
申请号：US14537998
申请日：2014-11-11
申请人： SAMSUNG ELECTRO-MECHANICS CO., LTD.
发明人： Suk Hyeon CHO , Hyo Seung NAM , Yong Sam LEE , Seok Hwan AHN
IPC分类号： H05K1/02 , H05K3/42 , H05K3/00 , H05K3/46 , H05K1/11 , H05K1/03
CPC分类号： H05K1/0271 , H01L24/97 , H01L2224/16225 , H01L2224/97 , H01L2924/12042 , H01L2924/15311 , H05K3/002 , H05K3/0029 , H05K3/0047 , H05K3/0052 , H05K3/007 , H05K3/429 , H05K3/4605 , H05K3/4644 , H05K2201/017 , H05K2201/0187 , H05K2201/0195 , H05K2201/0909 , H05K2201/09136 , H05K2201/09827 , H05K2201/09881 , H05K2201/2009 , H05K2203/1536 , H01L2224/81 , H01L2924/00
摘要： A printed circuit board and a method of manufacturing the same. In one embodiment, a printed circuit board includes: a core made of a glass material; an insulator surrounding the core; and a via connecting internal circuit layers through the core and the insulator.
摘要翻译：印刷电路板及其制造方法。在一个实施例中，印刷电路板包括：由玻璃材料制成的芯; 围绕芯的绝缘体; 以及通过芯和绝缘体连接内部电路层的通孔。

5. 发明申请

US20150156860A1 SOLDER RESIST OPENING STRUCTURE AND CIRCUIT BOARD 审中-公开
标题翻译：焊接开放结构和电路板
公开(公告)号：US20150156860A1
公开(公告)日：2015-06-04
申请号：US14278522
申请日：2014-05-15
申请人： SAMSUNG ELECTRO-MECHANICS CO., LTD.
发明人： Chang Bo LEE , Dae Jo HONG , Hyo Seung NAM
IPC分类号： H05K1/02
CPC分类号： H05K1/111 , H05K2201/099 , H05K2201/09909 , H05K2201/2081 , Y02P70/611
摘要： A solder resist opening structure that exposes an electrode pad through a solder resist opening. The solder resist opening has a bottom diameter of about 80 μm or less with a first tolerance less than about 2.5 μm, the bottom diameter being smaller than a diameter of the electrode pad; an inverted trapezoidal cross section with a top diameter larger than the bottom diameter; and a diameter difference between the top diameter and the bottom diameter of about 10 μm or more with a second tolerance less than about 2.5 μm
摘要翻译：阻焊剂开口结构，其通过阻焊剂开口暴露电极焊盘。阻焊剂开口的底部直径为约80μm以下，第一公差小于约2.5μm，底部直径小于电极焊盘的直径; 顶部直径大于底部直径的倒梯形横截面; 上述直径和底部直径之间的直径差为约10μm以上，第二公差小于约2.5μm

6. 发明申请

US20150195902A1 PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME 审中-公开
标题翻译：印刷电路板及其制造方法
公开(公告)号：US20150195902A1
公开(公告)日：2015-07-09
申请号：US14592696
申请日：2015-01-08
申请人： SAMSUNG ELECTRO-MECHANICS CO., LTD.
发明人： Eung Suek LEE , Hyo Seung NAM , Sung Uk LEE , Jae Hoon CHOI , II Jong SEO , Yong Ho BAEK
IPC分类号： H05K1/02 , H05K3/00 , C23C14/34 , H05K1/09
CPC分类号： H05K3/4682 , H05K3/3452 , H05K2201/0376
摘要： There are provided a printed circuit board and a method of manufacturing the same. The printed circuit board according to an exemplary embodiment of the present disclosure includes: an insulating layer; a first circuit buried below the insulating layer and having a lower surface formed to be exposed from a lower surface of the insulating layer; a second circuit layer formed on the insulating layer; and a first solder resist layer formed below the insulating layer and the first circuit layer and formed to expose a portion of the first circuit layer.
摘要翻译：提供了一种印刷电路板及其制造方法。根据本公开的示例性实施例的印刷电路板包括：绝缘层; 埋置在所述绝缘层下方并具有形成为从所述绝缘层的下表面露出的下表面的第一电路; 形成在所述绝缘层上的第二电路层; 以及形成在所述绝缘层和所述第一电路层下面并形成以暴露所述第一电路层的一部分的第一阻焊层。

7. 发明申请

US20140099433A1 BASKET JIG FOR ELECTROLESS PLATING APPARATUS AND ELECTROLESS PLATING METHOD 审中-公开
标题翻译：用于电镀镀层和电镀的方法
公开(公告)号：US20140099433A1
公开(公告)日：2014-04-10
申请号：US13827115
申请日：2013-03-14
申请人： SAMSUNG ELECTRO-MECHANICS CO., LTD.
发明人： Hyo Seung NAM , Chang Sup Ryu
IPC分类号： C23C18/16
CPC分类号： C23C18/163 , C23C18/1646 , C23C18/1675 , H05K3/187 , H05K2203/072 , H05K2203/1518 , H05K2203/1554 , H05K2203/159
摘要： The present invention relates to a basket jig for an electroless plating apparatus and an electroless plating method. A basket jig for an electroless plating apparatus in accordance with the present invention includes a basket loaded thereon a plurality of printed circuit boards, a rotating structure coupled to top portions of both sides of the basket and a tube in a shape of a rectangular plate coupled to bottom portions of the basket.
摘要翻译：本发明涉及一种用于化学镀装置的篮式夹具和无电镀方法。根据本发明的用于无电电镀装置的篮子夹具包括一个装在其上的多个印刷电路板的篮子，一个连接到该篮子两侧的顶部的旋转结构和一个矩形板形状的管到篮子的底部。

8. 发明申请

US20140069805A1 ELECTRO-COPPER PLATING APPARATUS 审中-公开
标题翻译：电镀铜装置
公开(公告)号：US20140069805A1
公开(公告)日：2014-03-13
申请号：US13842947
申请日：2013-03-15
申请人： SAMSUNG ELECTRO-MECHANICS CO., LTD.
发明人： Hyo Seung NAM , Mi Geum KIM
IPC分类号： C25D3/38
CPC分类号： C25D3/38 , C25D17/10 , C25D21/18
摘要： Disclosed herein is an electro-copper plating apparatus in which a cathode, an insoluble anode, a copper ball, and a plating solution are included in a single bath, wherein the plating solution includes manganese oxide; or an electro-copper plating apparatus including: a main bath including a cathode, an insoluble anode, and a plating solution; and a dissolution bath including a copper ball, and manganese oxide. According to the present invention, the manganese oxide having higher oxidation-reduction potential instead of using Fe3+ of the related art as the copper source in the electro-copper plating apparatus may be used to obtain a high effect in suppressing surface plating even at a low concentration.
摘要翻译：这里公开了一种电镀铜装置，其中阴极，不溶性阳极，铜球和电镀液包含在单个浴中，其中电镀溶液包括氧化锰; 或电镀铜装置，其包括：主阴极，不溶性阳极和电镀液; 以及包含铜球和氧化锰的溶解浴。根据本发明，可以使用具有较高氧化还原电位的氧化还原电位而不是使用现有技术的Fe 3+作为电镀铜装置中的铜源的氧化锰，以获得即使在低电平下也能抑制表面电镀的高效果浓度。

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