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    • 1. 发明授权
    • Blankmask and photomask using the same
    • Blankmask和光掩模使用相同
    • US08846276B2
    • 2014-09-30
    • US13653698
    • 2012-10-17
    • S&S TECH Co., Ltd.
    • Kee-Soo NamGeung-Won KangJong-Hwa LeeChul-Kyu YangSoon-Gi Kwon
    • G03F1/46G03F1/24G03F1/80
    • G03F1/46G03F1/80
    • Provided is a blankmask for a hardmask. In the blankmask, a hard film is formed by appropriately controlling contents of nitrogen and carbon therein to reduce a deviation in a critical dimension caused when an etch process is performed. A metal film is formed to a thin thickness by increasing a content of metal in a light-shielding film and reducing a content of metal in an anti-reflective film. Thus, resolution, pattern fidelity, and chemical resistance of the metal film may be improved. Also, the metal film and the hard film are formed such that a reflectivity contrast therebetween is high, thereby allowing the hard film to be easily inspected. Accordingly, the blank mask for a hardmask may be applied to a dynamic random access memory (DRAM), a flash memory, or a micro-processing unit (MPU) to have a half-pitch of 32 nm or less, and particularly, a critical dimension of 22 nm or less.
    • 提供了一个硬掩模的空白掩码。 在坯料中,通过适当地控制其中的氮和碳的含量来形成硬膜,以减少当进行蚀刻工艺时引起的临界尺寸的偏差。 通过增加遮光膜中的金属含量并减少抗反射膜中的金属含量,将金属膜形成为薄的厚度。 因此,可以提高金属膜的分辨率,图案保真度和耐化学性。 此外,金属膜和硬膜形成为使得它们之间的反射率对比度高,从而容易地检查硬膜。 因此,用于硬掩模的空白掩模可以应用于动态随机存取存储器(DRAM),闪速存储器或微处理单元(MPU)以具有32nm或更小的半间距,并且特别地, 临界尺寸为22nm或更小。
    • 3. 发明授权
    • Blankmask and photomask using the same
    • Blankmask和光掩模使用相同
    • US09551925B2
    • 2017-01-24
    • US14604247
    • 2015-01-23
    • S&S TECH CO., LTD
    • Kee-Soo NamChul-Kyu YangGeung-Won KangCheol ShinJong-Hwa LeeMin-Ki ChoiChang-Jun KimKyu-Jin Jang
    • G03F1/48G03F1/26G03F1/80
    • G03F1/48G03F1/26G03F1/80
    • A blankmask and a photomask using the same are provided. The blankmask can be useful in preventing the loss in thickness of lateral, top and bottom surfaces of a pattern of a light shielding film or a phase shifting film after the manufacture of the photomask by forming protective film, which has an etch selectivity with respect to a pattern of a hard film or the light shielding film, on the light shielding film or the phase shifting film so that the loss of the phase shifting film formed under the light shielding film or the phase shifting film can be prevented when a process of removing the light shielding film disposed under the hard film or a pattern of the light shielding film is performed during a washing process and a process of removing a pattern of the hard film in a method of manufacturing a photomask, thereby securing uniformity in thickness.
    • 提供了一个空白掩码和使用它的光掩模。 空白掩模可用于防止在通过形成保护膜制造光掩模之后遮光膜或相移膜的图案的横向,顶部和底部表面的厚度损失,所述保护膜具有相对于 在遮光膜或相移膜上的硬膜或遮光膜的图案,可以防止在遮光膜或相移膜下形成的相移膜的损失, 设置在硬膜下方的遮光膜或遮光膜的图案在洗涤过程中进行,并且在制造光掩模的方法中去除硬膜的图案的过程,从而确保厚度均匀性。
    • 4. 发明授权
    • Mask blank, photomask, and method for manufacturing same
    • 掩模空白,光掩模及其制造方法
    • US09389500B2
    • 2016-07-12
    • US14377941
    • 2012-10-26
    • S&S Tech Co., Ltd.
    • Kee-Soo NamGeung-Won KangJong-Hwa LeeChul-Kyu YangSoon-Gi Kwon
    • G03F1/26G03F1/76G03F1/80G03F1/50
    • G03F1/26G03F1/32G03F1/50G03F1/76G03F1/80
    • Provided are a method of manufacturing a photomask, in which a hardmask film pattern is used as an etch mask for etching a phase-shift layer under the hardmask film pattern, a blankmask, and a photomask using the blankmask. In the method, a resist film for patterning a hardmask film may be formed to a thin thickness, and the phase-shift layer may be etched using the hardmask film pattern having a high etch selectivity with respect to the phase-shift layer. Accordingly, an optical density may be maintained to be 3.0 due to use of a light-shielding film pattern, thereby increasing the resolution and precision of a pattern, reducing a loading effect, and improving critical dimension (CD) features, such as CD uniformity and CD linearity.
    • 提供一种制造光掩模的方法,其中使用硬掩模膜图案作为蚀刻掩模,用于蚀刻硬掩模膜图案下的相移层,空白掩模和使用该掩模的光掩模。 在该方法中,用于图形化硬掩模膜的抗蚀剂膜可以形成为薄的厚度,并且可以使用相对于相移层具有高蚀刻选择性的硬掩模膜图案来蚀刻相移层。 因此,由于使用遮光膜图案,光密度可以维持在3.0,从而提高图案的分辨率和精度,降低负载效果,并且改善关键尺寸(CD)特征,例如CD均匀性 和CD线性。
    • 7. 发明授权
    • Phase-shift blankmask and method for fabricating the same
    • 相移掩模及其制造方法
    • US09256119B2
    • 2016-02-09
    • US13864624
    • 2013-04-17
    • S&S TECH Co., Ltd.
    • Kee-Soo NamGeung-Won KangDong-Geun KimJong-Won JangMin-Ki Choi
    • G03F1/26
    • G03F1/26
    • Provided is a phase-shift blankmask in which a phase-shift layer is formed in at least two continuous layers or a multi-layer film and an uppermost phase-shift layer included in the phase-shift layer is thinly formed to contain a small amount of oxygen (O) so as to enhance chemical resistance and durability thereof.Accordingly, a phase-shift blankmask including the phase-shift layer having enhanced chemical resistance and durability with respect to a cleaning solution containing acid and basic materials, hot deionized water, or ozone water, which is used in a cleaning process that is repeatedly performed during manufacture of a photomask, may be provided using the uppermost phase-shift layer having the enhanced chemical resistance and durability.Furthermore, degradation in the refractive index and degree of phase shift of the phase-shift layer, caused when the cleaning process is repeatedly performed may be prevented due to the uppermost phase-shift layer having the enhanced chemical resistance and durability. Accordingly, a phase-shift blankmask including a thin phase-shift layer can be provided.
    • 提供一种相移空白掩模,其中在至少两个连续层中形成相移层或多层膜,并且包含在相移层中的最上层相移层被薄形成以包含少量 的氧(O),以提高其耐化学性和耐久性。 因此,包括相对于含有酸和碱性材料,热去离子水或臭氧水的清洗溶液具有增强的耐化学性和耐久性的相移空白掩模,其用于重复进行的清洁过程 在制造光掩模期间,可以使用具有增强的耐化学性和耐久性的最上层的相移层来提供。 此外,由于具有增强的耐化学性和耐久性的最上层的相移层,可以防止在重复执行清洁处理时引起的相移层的折射率和相移程度的劣化。 因此,可以提供包括薄相移层的相移空白掩模。