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    • 8. 发明授权
    • Production method for silicon wafer and silicon wafer
    • 硅晶片和硅晶片的生产方法
    • US06544656B1
    • 2003-04-08
    • US09674841
    • 2000-11-07
    • Takao AbeKen AiharaShoji AkiyamaTetsuya IgarashiWeifeng QuYoshinori HayamizuShigeru Saito
    • Takao AbeKen AiharaShoji AkiyamaTetsuya IgarashiWeifeng QuYoshinori HayamizuShigeru Saito
    • C30B2906
    • C30B29/06C30B15/00H01L21/3225Y10T428/21
    • A silicon wafer is produced by growing a silicon single crystal ingot having a resistivity of 100 &OHgr;·cm or more and an initial interstitial oxygen concentration of 10 to 25 ppma by the Czochralski method, processing the silicon single crystal ingot into a wafer, and subjecting the wafer to an oxygen precipitation heat treatment so that a residual interstitial oxygen concentration in the wafer should become 8 ppma or less. A silicon wafer produced as described above shows little decrease in resistivity even after a heat treatment in device production etc. Further, if a silicon wafer is produced and heat-treated so that the wafer should have the above-defined initial interstitial oxygen concentration and residual interstitial oxygen concentration, slip dislocations in a subsequent heat treatment process are prevented irrespective of resistivity. Furthermore, by forming an epitaxial layer on a surface of a silicon wafer of the present invention, a high resistivity epitaxial wafer can be produced, which is free from slip dislocations etc. and can be used for various devices.
    • 通过使用Czochralski法生长电阻率为100欧姆·厘米或更高的初始间隙氧浓度为10〜25ppma的硅单晶锭,将硅单晶锭加工成晶片,生产硅晶片, 晶片进行氧析出热处理,使得晶片中的残留间隙氧浓度应变为8ppma以下。 如上所述制造的硅晶片即使在器件制造等中进行热处理之后也几乎没有电阻降低。此外,如果制造硅晶片并进行热处理,使得晶片应具有上述初始间隙氧浓度和残留量 间隙氧浓度,随后的热处理过程中的滑移位错被阻止,而与电阻率无关。 此外,通过在本发明的硅晶片的表面上形成外延层,可以制造不含滑移位错等的高电阻率外延晶片,并可用于各种器件。