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1. 发明授权

US5571593A Via fill compositions for direct attach of devices and methods for applying same 失效
标题翻译：用于直接连接装置的填充组合物和用于施加装置的方法
公开(公告)号：US5571593A
公开(公告)日：1996-11-05
申请号：US467558
申请日：1995-06-06
申请人： Roy L. Arldt , Christina M. Boyko , Burtran J. Cayson , Richard M. Kozlowski , Joseph D. Kulesza , John M. Lauffer , Philip C. Liu , Voya R. Markovich , Issa S. Mahmoud , James F. Muska , Kostas Papathomas , Joseph G. Sabia , Richard A. Schumacher
发明人： Roy L. Arldt , Christina M. Boyko , Burtran J. Cayson , Richard M. Kozlowski , Joseph D. Kulesza , John M. Lauffer , Philip C. Liu , Voya R. Markovich , Issa S. Mahmoud , James F. Muska , Kostas Papathomas , Joseph G. Sabia , Richard A. Schumacher
IPC分类号： B32B7/04 , C08G59/40 , C08G73/00 , C08L63/00 , C09D163/00 , H01B1/20 , H01B1/22 , H01B1/24 , H05K1/09 , H05K1/11 , H05K1/16 , H05K3/00 , H05K3/40 , B32B9/00
CPC分类号： H01B1/24 , B32B7/04 , H01B1/22 , H05K1/095 , H05K1/113 , H05K1/167 , H05K3/4053 , H05K3/4069 , H01L2224/16235 , H05K1/16 , H05K2201/0347 , H05K2201/09563 , H05K2201/10734 , H05K2203/0126 , H05K2203/0191 , H05K2203/0207 , H05K2203/0278 , H05K2203/0338 , H05K2203/0763 , H05K3/0023 , H05K3/0047 , H05K3/0094 , Y10S428/901 , Y10T29/49099 , Y10T29/49144 , Y10T29/49155 , Y10T29/49165 , Y10T428/24273 , Y10T428/24331 , Y10T428/24339 , Y10T428/24826 , Y10T428/24917 , Y10T428/24926 , Y10T428/25
摘要： The present invention permits solder joints to be made directly to via and through holes without the solder being wicked into the vias or through holes, by filling plated through holes with an epoxy or cyanate fill composition. When cured and overplated, the fill composition provides support for the solder joint and provides a flat solderable surface for the inter-connection. In certain embodiments, the cured fill compositions, offer a further advantage of being conductive. The invention also relates to several novel methods for filling through holes with such fill compositions, and to resistors located in through holes and vias.
摘要翻译：本发明允许焊接接头直接制成通孔和通孔，而不会通过用环氧树脂或氰酸盐填充组合物填充电镀通孔，焊料不会被弄脏到通孔或通孔中。当固化和过度镀覆时，填充组合物为焊接接头提供支撑，并为相互连接提供平坦的可焊接表面。在某些实施方案中，固化的填充组合物提供另外的导电性的优点。本发明还涉及用这种填充组合物填充通孔的几种新方法，以及位于通孔和通孔中的电阻器。

2. 发明授权

US06555762B2 Electronic package having substrate with electrically conductive through holes filled with polymer and conductive composition 有权
标题翻译：电子封装，其具有填充有聚合物和导电组合物的导电通孔的基板
公开(公告)号：US06555762B2
公开(公告)日：2003-04-29
申请号：US09345428
申请日：1999-07-01
申请人： Bernd K. Appelt , Jeffrey D. Gelorme , Sung Kwon Kang , Voya R. Markovich , Kostas Papathomas , Sampath Purushothaman
发明人： Bernd K. Appelt , Jeffrey D. Gelorme , Sung Kwon Kang , Voya R. Markovich , Kostas Papathomas , Sampath Purushothaman
IPC分类号： H05K111
CPC分类号： H01L23/49827 , H01B1/02 , H01B1/22 , H01L23/49866 , H01L2924/0002 , H05K1/095 , H05K3/4069 , Y10T428/12181 , Y10T428/2991 , Y10T428/2993 , Y10T428/2998 , H01L2924/00
摘要： The present invention provides a unique, high density, electronic package having a conductive composition for filling vias or through holes to make reliable vertical or Z-connects from a dielectric layer to adjacent electrical circuits. The through holes may be plated or non-plated prior to filling. A description for making high density electronic packaging using this feature is also disclosed.
摘要翻译：本发明提供了一种独特的，高密度的电子封装，其具有用于填充通孔或通孔的导电组合物，以使得从电介质层到相邻电路的可靠的垂直或Z-连接。通孔可以在填充之前进行镀覆或非电镀。还公开了使用该特征制造高密度电子封装的描述。

3. 发明申请

US20080003407A1 Circuitized substrate with dielectric layer having dielectric composition not including continuous or semi-continuous fibers 有权
标题翻译：具有介电层的电路化基底，其电介质组成不包括连续或半连续的纤维
公开(公告)号：US20080003407A1
公开(公告)日：2008-01-03
申请号：US11896786
申请日：2007-09-06
申请人： Robert Japp , Kostas Papathomas
发明人： Robert Japp , Kostas Papathomas
IPC分类号： B32B27/06
CPC分类号： H05K1/0373 , H01L2224/16225 , H01L2924/15311 , H05K3/4602 , H05K2201/0209 , H05K2201/0239 , Y10T428/24322 , Y10T428/24355 , Y10T428/24917
摘要： A circuitized substrate which includes at least one circuit layer and at least one substantially solid dielectric layer comprised of a dielectric composition which includes a cured resin material and a predetermined percentage by weight of particulate fillers, but not including continuous or semi-continuous fibers as part thereof.
摘要翻译：一种电路化衬底，其包括至少一个电路层和至少一个基本上固体的电介质层，该电介质层包括固化树脂材料和预定重量百分比的颗粒填料，但不包括连续或半连续纤维作为部分其中。

4. 发明申请

US20060131755A1 Method of making circuitized substrate 有权
标题翻译：制造电路化基板的方法
公开(公告)号：US20060131755A1
公开(公告)日：2006-06-22
申请号：US11349990
申请日：2006-02-09
申请人： Robert Japp , Voya Markovich , Cheryl Palomaki , Kostas Papathomas , David Thomas
发明人： Robert Japp , Voya Markovich , Cheryl Palomaki , Kostas Papathomas , David Thomas
IPC分类号： H01L23/48
CPC分类号： H01L23/145 , H01L23/4922 , H01L23/49822 , H01L23/49827 , H01L2224/16225 , H05K1/0373 , H05K3/4602 , H05K2201/0209
摘要： A method of making a circuitized substrate comprising a first layer comprised of a dielectric material including a resin material including a predetermined quantity of particles therein and not including continuous fibers, semi-continuous fibers or the like as part thereof, and at least one circuitized layer positioned on the dielectric first layer.
摘要翻译：一种制造电路化基板的方法，包括由包括其中包含预定量的颗粒的树脂材料的介电材料构成的第一层，并且不包括连续纤维，半连续纤维等作为其一部分，以及至少一个电路层位于电介质第一层上。

5. 发明授权

US6138350A Process for manufacturing a circuit board with filled holes 失效
标题翻译：用于制造具有填充孔的电路板的工艺
公开(公告)号：US6138350A
公开(公告)日：2000-10-31
申请号：US30587
申请日：1998-02-25
申请人： Anilkumar Chinuprasad Bhatt , Donald Herman Glatzel , Allen F. Moring , Voya Rista Markovich , Kostas Papathomas , David John Russell
发明人： Anilkumar Chinuprasad Bhatt , Donald Herman Glatzel , Allen F. Moring , Voya Rista Markovich , Kostas Papathomas , David John Russell
IPC分类号： H05K1/11 , H05K3/00 , H05K3/02 , H05K3/24 , H05K3/40 , H05K3/42 , H05K3/46 , H01K3/10
CPC分类号： H05K3/4652 , H05K1/113 , H05K3/4069 , H05K3/4602 , H01L2224/48091 , H01L2224/73204 , H01L2924/12044 , H05K2201/0347 , H05K2201/0355 , H05K2201/092 , H05K2201/0959 , H05K2203/0191 , H05K2203/025 , H05K2203/0278 , H05K2203/0338 , H05K2203/0554 , H05K3/0023 , H05K3/0094 , H05K3/025 , H05K3/246 , H05K3/429 , Y10S428/901 , Y10T29/49126 , Y10T29/4913 , Y10T29/49139 , Y10T29/49144 , Y10T29/49155 , Y10T29/49165 , Y10T428/24917 , Y10T428/24926 , Y10T428/24942 , Y10T428/249996
摘要： A process for manufacturing circuit boards comprising providing a circuitized substrate having a dielectric surface, providing a peel apart structure including a metal layer and a peelable film, laminating the peel apart structure to the circuitized substrate with the metal layer positioned adjacent said dielectric surface, forming holes in the circuitized substrate through the peel apart structure, applying a filler material including an organic base to the peel apart structure, applying a sacrificial film onto the filler material, and applying sufficient heat and pressure to the sacrificial film to force the filler material into the holes to substantially fill the holes is provided.
摘要翻译：一种用于制造电路板的方法，包括提供具有电介质表面的电路化基板，提供包括金属层和可剥离膜的剥离结构，将剥离结构层压到电路化基板上，金属层位于邻近所述电介质表面，形成通过剥离结构在电路化基板中的孔，将包含有机基底的填充材料施加到剥离结构上，将牺牲膜施加到填充材料上，以及向牺牲膜施加足够的热和压力以迫使填充材料进入提供基本上填充孔的孔。

6. 发明授权

US06066889A Methods of selectively filling apertures 失效
公开(公告)号：US06066889A
公开(公告)日：2000-05-23
申请号：US158811
申请日：1998-09-22
申请人： Gerald Walter Jones , Heike Marcello , Kostas Papathomas
发明人： Gerald Walter Jones , Heike Marcello , Kostas Papathomas
IPC分类号： H01L21/48 , H05K3/00 , H01L23/04
CPC分类号： H01L21/486 , H05K3/0094 , H05K2201/0959 , H05K2203/0278 , H05K3/0082
摘要： A novel method of filling apertures in substrates, such as through holes, is provided. The method utilizes a photoimageable film, and comprises the following steps: applying a photoimagable, hole fill film over the apertures; reflowing the hole fill film to flow into the apertures; exposing the hole fill film to actinic radiation, preferably ultraviolet light, through a phototool, which preferably has openings slightly larger than the diameter of the apertures; then at least partially curing the hole fill film; and developing the hole fill film to remove the unexposed hole fill film. An advantage of the present method is that the apertures may be selectively filled. After the apertures are filled, the hole fill film is cured, preferably by baking. Thereafter, the substrate is preferably subjected to further processing steps; for example, nubs of cured hole fill film are preferably removed. If desired, the substrate is circuitized. If desired, features are gold plated, such as for example, electrolessly gold plated. The hole fill film preferably has solids which comprise 0 to about 20% of a thixotrope and about 80% to about 100% parts of an epoxy resin system; the epoxy resin system comprises: from about 10% to about 80% of phenoxy polyol resin which is the condensation product of epichlorohydrin and bisphenol A, having a molecular weight of from about 40,000 to about 130,000; from about 20% to about 90% of an epoxidized multifunctional bisphenol A formaldehyde novolac resin having a molecular weight of from about 4,000 to about 10,000; from about 35% to about 50% of a diglycidyl ether of bisphenol A, preferably halogenated, and having a molecular weight of from about 600 to about 2,500; and from about 0.1 to about 15 parts by weight of the total resin weight, a cationic photoinitiator. The invention also relates to circuitized structures produced according to the method.

7. 发明授权

US08445094B2 Circuitized substrate with dielectric layer having dielectric composition not including continuous or semi-continuous fibers 有权
标题翻译：具有介电层的电路化基底，其电介质组成不包括连续或半连续的纤维
公开(公告)号：US08445094B2
公开(公告)日：2013-05-21
申请号：US11896786
申请日：2007-09-06
申请人： Robert Japp , Kostas Papathomas
发明人： Robert Japp , Kostas Papathomas
IPC分类号： B32B3/24 , H05K1/03
CPC分类号： H05K1/0373 , H01L2224/16225 , H01L2924/15311 , H05K3/4602 , H05K2201/0209 , H05K2201/0239 , Y10T428/24322 , Y10T428/24355 , Y10T428/24917
摘要： A circuitized substrate which includes at least one circuit layer and at least one substantially solid dielectric layer comprised of a dielectric composition which includes a cured resin material and a predetermined percentage by weight of particulate fillers, but not including continuous or semi-continuous fibers as part thereof.
摘要翻译：一种电路化衬底，其包括至少一个电路层和至少一个基本上固体的电介质层，该电介质层包括固化树脂材料和预定重量百分比的颗粒填料，但不包括连续或半连续纤维作为部分其中。

8. 发明授权

US07508076B2 Information handling system including a circuitized substrate having a dielectric layer without continuous fibers 有权
标题翻译：信息处理系统包括具有不带连续纤维的电介质层的电路化基板
公开(公告)号：US07508076B2
公开(公告)日：2009-03-24
申请号：US11350777
申请日：2006-02-10
申请人： Robert Japp , Voya Markovich , Cheryl Palomaki , Kostas Papathomas , David L. Thomas
发明人： Robert Japp , Voya Markovich , Cheryl Palomaki , Kostas Papathomas , David L. Thomas
IPC分类号： H01L23/48
CPC分类号： H01L23/145 , H01L23/4922 , H01L23/49822 , H01L23/49827 , H01L2224/16225 , H05K1/0373 , H05K3/4602 , H05K2201/0209
摘要： An information handling system which includes as part thereof a circuitized substrate comprising a first layer comprised of a dielectric material including a resin material including a predetermined quantity of particles therein and not including continuous fibers, semi-continuous fibers or the like as part thereof, and at least one circuitized layer positioned on the dielectric first layer.
摘要翻译：一种信息处理系统，其包括作为其一部分的电路化基板，其包括由包括其中包含预定量的颗粒的树脂材料的介电材料构成的第一层，并且不包括连续纤维，半连续纤维等作为其一部分，以及位于电介质第一层上的至少一个电路层。

9. 发明申请

US20070221404A1 Circuitized substrate with conductive paste, electrical assembly including said circuitized substrate and method of making said substrate 有权
标题翻译：具有导电浆料的电路基板，包括所述电路化基板的电气组件和制造所述基板的方法
公开(公告)号：US20070221404A1
公开(公告)日：2007-09-27
申请号：US11802434
申请日：2007-05-23
申请人： Rabindra Das , Kostas Papathomas , Voya Markovich
发明人： Rabindra Das , Kostas Papathomas , Voya Markovich
IPC分类号： H01R12/04 , H05K3/46
CPC分类号： H05K1/0313 , B23K26/382 , B23K26/40 , B23K2101/40 , B23K2103/16 , B23K2103/172 , B23K2103/52 , H01B1/22 , H01L2224/16225 , H01L2224/32245 , H01L2224/73253 , H01L2924/01322 , H01L2924/15311 , H05K1/097 , H05K3/4053 , H05K3/4069 , H05K3/462 , H05K3/4623 , H05K3/4641 , H05K2201/0257 , H05K2201/09536 , H05K2201/0959 , H05K2201/096 , H05K2201/09718 , H05K2201/10378 , H05K2203/0425 , H05K2203/1152 , Y10T29/49128 , Y10T29/49165 , H01L2924/00
摘要： A circuitized substrate which includes a conductive paste for providing electrical connections. The paste, in one embodiment, includes a metallic component including nano-particles and may include additional elements such as solder or other metal micro-particles, as well as a conducting polymer and organic. The particles of the paste composition sinter and, depending on what additional elements are added, melt as a result of lamination to thereby form effective contiguous circuit paths through the paste. A method of making such a substrate is also provided, as is an electrical assembly utilizing the substrate and including an electronic component such as a semiconductor chip coupled thereto.
摘要翻译：一种电路化基板，包括用于提供电连接的导电浆料。在一个实施方案中，糊状物包括包含纳米颗粒的金属组分，并且可以包括附加元素，例如焊料或其它金属微粒，以及导电聚合物和有机物。糊料组合物的颗粒烧结并且根据添加的另外的元素而熔化，因为层压，从而形成通过糊料的有效连续的电路。还提供了制造这种基板的方法，以及利用该基板并且包括诸如与其耦合的半导体芯片的电子部件的电组件。

10. 发明授权

US07270845B2 Dielectric composition for forming dielectric layer for use in circuitized substrates 有权
标题翻译：用于形成用于电路化基板的电介质层的介电组合物
公开(公告)号：US07270845B2
公开(公告)日：2007-09-18
申请号：US10812889
申请日：2004-03-31
申请人： Robert Japp , Kostas Papathomas
发明人： Robert Japp , Kostas Papathomas
IPC分类号： H01K3/10
CPC分类号： H05K1/0373 , H01L2224/16225 , H01L2924/15311 , H05K3/4602 , H05K2201/0209 , H05K2201/0239 , Y10T428/24322 , Y10T428/24355 , Y10T428/24917
摘要： A dielectric composition which forms a dielectric layer usable in circuitized substrates such as PCBs, chip carriers and the like. As such a layer, it includes a cured resin material and a predetermined percentage by weight of particulate fillers, thus not including continuous fibers, semi-continuous fibers or the like as part thereof.
摘要翻译：形成电介质层的电介质组合物，其可用于诸如PCB，芯片载体等的电路化基板中。作为这样的层，其包括固化树脂材料和预定重量的颗粒填料，因此不包括连续纤维，半连续纤维等作为其一部分。

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